DAI ISHIKAWA

Person

TOKYO, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Member connection method
- Patent number 11,887,960
- Issue date Jan 30, 2024
- Resonac Corporation
- Motohiro Negishi
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Formation of SiN thin films
- Patent number 11,784,043
- Issue date Oct 10, 2023
- ASM IP Holding, B.V.
- Toshiya Suzuki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming silicon nitride film selectively on top/bottom p...
- Patent number 11,676,812
- Issue date Jun 13, 2023
- ASM IP Holding B.V.
- Dai Ishikawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing thermoelectric conversion module, thermoel...
- Patent number 11,575,076
- Issue date Feb 7, 2023
- SHOWA DENKO MATERIALS CO., LTD.
- Motohiro Negishi
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Grant
Copper paste for pressureless bonding, bonded body and semiconducto...
- Patent number 11,532,588
- Issue date Dec 20, 2022
- SHOWA DENKO MATERIALS CO., LTD.
- Hideo Nakako
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for producing joined body, and joining material
- Patent number 11,483,936
- Issue date Oct 25, 2022
- SHOWA DENKO MATERIALS CO., LTD.
- Hideo Nakako
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal paste for joints, assembly, production method for assembly, s...
- Patent number 11,462,502
- Issue date Oct 4, 2022
- SHOWA DENKO MATERIALS CO., LTD.
- Yuki Kawana
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Metal paste for joints, assembly, production method for assembly, s...
- Patent number 11,370,066
- Issue date Jun 28, 2022
- SHOWA DENKO MATERIALS CO., LTD.
- Yuki Kawana
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Formation of SiN thin films
- Patent number 11,133,181
- Issue date Sep 28, 2021
- ASM IP Holding B.V.
- Toshiya Suzuki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Copper paste for joining, method for manufacturing joined body, and...
- Patent number 11,040,416
- Issue date Jun 22, 2021
- SHOWA DENKO MATERIALS CO., LTD.
- Dai Ishikawa
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Copper paste for pressureless bonding, bonded body and semiconducto...
- Patent number 10,930,612
- Issue date Feb 23, 2021
- SHOWA DENKO MATERIALS CO., LTD.
- Hideo Nakako
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Method of selectively depositing a capping layer structure on a sem...
- Patent number 10,910,262
- Issue date Feb 2, 2021
- ASM IP Holding B.V.
- Aurélie Kuroda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for etching a carbon-containing feature
- Patent number 10,811,256
- Issue date Oct 20, 2020
- ASM IP Holding B.V.
- Mitsuya Utsuno
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Reaction chamber passivation and selective deposition of metallic f...
- Patent number 10,793,946
- Issue date Oct 6, 2020
- ASM IP Holding B.V.
- Delphine Longrie
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Copper paste for joining, method for manufacturing joined body, and...
- Patent number 10,748,865
- Issue date Aug 18, 2020
- Hitachi Chemical Company, Ltd.
- Yuki Kawana
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Method for forming silicon nitride film selectively on top surface
- Patent number 10,720,322
- Issue date Jul 21, 2020
- ASM IP Holding B.V.
- Dai Ishikawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of spacer-defined direct patterning in semiconductor fabrica...
- Patent number 10,658,181
- Issue date May 19, 2020
- ASM IP Holding B.V.
- Toshihisa Nozawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Assembly and semiconductor device
- Patent number 10,566,304
- Issue date Feb 18, 2020
- Hitachi Chemical Company, Ltd.
- Hideo Nakako
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Method for forming silicon nitride film selectively on sidewalls or...
- Patent number 10,529,554
- Issue date Jan 7, 2020
- ASM IP Holding B.V.
- Dai Ishikawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Reaction chamber passivation and selective deposition of metallic f...
- Patent number 10,480,064
- Issue date Nov 19, 2019
- ASM IP Holding B.V.
- Delphine Longrie
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method for forming spacers using silicon nitride film for spacer-de...
- Patent number 10,468,251
- Issue date Nov 5, 2019
- ASM IP Holding B.V.
- Dai Ishikawa
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Formation of SiN thin films
- Patent number 10,410,857
- Issue date Sep 10, 2019
- ASM IP Holding B.V.
- Toshiya Suzuki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Copper paste for joining, method for producing joined body, and met...
- Patent number 10,363,608
- Issue date Jul 30, 2019
- Hitachi Chemical Company, Ltd.
- Yuki Kawana
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Silver paste composition and semiconductor device using same
- Patent number 10,201,879
- Issue date Feb 12, 2019
- Hitachi Chemical Company, Ltd.
- Dai Ishikawa
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Adhesive composition and semiconductor device using same
- Patent number 10,174,226
- Issue date Jan 8, 2019
- Hitachi Chemical Company, Ltd.
- Hideo Nakako
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Reaction chamber passivation and selective deposition of metallic f...
- Patent number 10,041,166
- Issue date Aug 7, 2018
- ASM IP Holding B.V.
- Delphine Longrie
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Selective deposition of metallic films
- Patent number 10,014,212
- Issue date Jul 3, 2018
- ASM IP Holding B.V.
- Shang Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Processes for preventing oxidation of metal thin films
- Patent number 9,947,582
- Issue date Apr 17, 2018
- ASM IP Holding B.V.
- Aurélie Kuroda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Reaction chamber passivation and selective deposition of metallic f...
- Patent number 9,803,277
- Issue date Oct 31, 2017
- ASM IP Holding B.V.
- Delphine Longrie
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Selective deposition of metallic films
- Patent number 9,805,974
- Issue date Oct 31, 2017
- ASM IP Holding B.V.
- Shang Chen
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
METAL PASTE FOR JOINING, JOINT, AND MANUFACTURING METHOD THEREFOR
- Publication number 20240300055
- Publication date Sep 12, 2024
- Resonac Corporation
- Hideo NAKAKO
- B22 - CASTING POWDER METALLURGY
Information Patent Application
COPPER PASTE FOR FORMING SINTERED COPPER PILLARS AND METHOD FOR PRO...
- Publication number 20240181575
- Publication date Jun 6, 2024
- Michiko NATORI
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
COMPOSITION AND AMELIORATING AGENT HAVING INFLAMMATION REDUCING EFFECT
- Publication number 20240156879
- Publication date May 16, 2024
- Juntendo Educational Foundation
- Dai ISHIKAWA
- C12 - BIOCHEMISTRY BEER SPIRITS WINE VINEGAR MICROBIOLOGY ENZYMOLOGY MUTATION...
Information Patent Application
COMPOSITION AND AMELIORATING AGENT HAVING INFLAMMATION REDUCING EFFECT
- Publication number 20240148799
- Publication date May 9, 2024
- Juntendo Educational Foundation
- Dai ISHIKAWA
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Application
COPPER PASTE, WICK FORMATION METHOD, AND HEAT PIPE
- Publication number 20230356294
- Publication date Nov 9, 2023
- Resonac Corporation
- Hideo NAKAKO
- B22 - CASTING POWDER METALLURGY
Information Patent Application
COPPER PASTE FOR JOINING, METHOD FOR MANUFACTURING JOINED BODY, AND...
- Publication number 20220371087
- Publication date Nov 24, 2022
- Motohiro NEGISHI
- B22 - CASTING POWDER METALLURGY
Information Patent Application
FORMATION OF SiN THIN FILMS
- Publication number 20220044923
- Publication date Feb 10, 2022
- ASM IP HOLDING B.V.
- TOSHIYA SUZUKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MEMBER CONNECTION METHOD
- Publication number 20210351157
- Publication date Nov 11, 2021
- Hitachi Chemical Company, Ltd.
- Motohiro NEGISHI
- B22 - CASTING POWDER METALLURGY
Information Patent Application
SUBSTRATE PROCESSING APPARATUS, BEVEL MASK AND SUBSTRATE PROCESSING...
- Publication number 20210175052
- Publication date Jun 10, 2021
- ASM IP HOLDING B.V.
- Yuki Takahashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COPPER PASTE FOR PRESSURELESS BONDING, BONDED BODY AND SEMICONDUCTO...
- Publication number 20210143121
- Publication date May 13, 2021
- Hideo NAKAKO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR PRODUCING JOINED BODY, AND JOINING MATERIAL
- Publication number 20200344893
- Publication date Oct 29, 2020
- Hitachi Chemical Company, Ltd.
- Hideo NAKAKO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR FORMING SILICON NITRIDE FILM SELECTIVELY ON TOP/BOTTOM P...
- Publication number 20200321209
- Publication date Oct 8, 2020
- ASM IP HOLDING B.V.
- Dai Ishikawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING THERMOELECTRIC CONVERSION MODULE, THERMOEL...
- Publication number 20200295248
- Publication date Sep 17, 2020
- Hitachi Chemical Company, Ltd.
- Motohiro NEGISHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
REACTION CHAMBER PASSIVATION AND SELECTIVE DEPOSITION OF METALLIC F...
- Publication number 20200291511
- Publication date Sep 17, 2020
- ASM IP HOLDING B.V.
- Delphine Longrie
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
COPPER PASTE FOR JOINING, METHOD FOR MANUFACTURING JOINED BODY, AND...
- Publication number 20200176411
- Publication date Jun 4, 2020
- Hitachi Chemical Company, Ltd.
- Yuki KAWANA
- B22 - CASTING POWDER METALLURGY
Information Patent Application
METAL PASTE FOR JOINTS, ASSEMBLY, PRODUCTION METHOD FOR ASSEMBLY, S...
- Publication number 20200130109
- Publication date Apr 30, 2020
- Hitachi Chemical Company, Ltd.
- Yuki KAWANA
- B22 - CASTING POWDER METALLURGY
Information Patent Application
METHOD FOR ETCHING A CARBON-CONTAINING FEATURE
- Publication number 20200118811
- Publication date Apr 16, 2020
- ASM IP HOLDING B.V.
- Mitsuya Utsuno
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COPPER PASTE FOR JOINING, METHOD FOR MANUFACTURING JOINED BODY, AND...
- Publication number 20200108471
- Publication date Apr 9, 2020
- Hitachi Chemical Company, Ltd.
- Dai ISHIKAWA
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METAL PASTE FOR JOINTS, ASSEMBLY, PRODUCTION METHOD FOR ASSEMBLY, S...
- Publication number 20200075528
- Publication date Mar 5, 2020
- Hitachi Chemical Company, Ltd.
- Yuki KAWANA
- B22 - CASTING POWDER METALLURGY
Information Patent Application
FORMATION OF SiN THIN FILMS
- Publication number 20190378711
- Publication date Dec 12, 2019
- ASM IP HOLDING B.V.
- TOSHIYA SUZUKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COPPER PASTE FOR PRESSURELESS BONDING, BONDED BODY AND SEMICONDUCTO...
- Publication number 20190355690
- Publication date Nov 21, 2019
- Hitachi Chemical Company, Ltd.
- Hideo NAKAKO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF SPACER-DEFINED DIRECT PATTERNING IN SEMICONDUCTOR FABRICA...
- Publication number 20190259612
- Publication date Aug 22, 2019
- ASM IP HOLDING B.V.
- Toshihisa Nozawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF SELECTIVELY DEPOSITING A CAPPING LAYER STRUCTURE ON A SEM...
- Publication number 20190148224
- Publication date May 16, 2019
- ASM IP HOLDING B.V.
- Aurélie Kuroda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
REACTION CHAMBER PASSIVATION AND SELECTIVE DEPOSITION OF METALLIC F...
- Publication number 20190055643
- Publication date Feb 21, 2019
- ASM IP HOLDING B.V.
- Delphine Longrie
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
METHOD FOR FORMING SILICON NITRIDE FILM SELECTIVELY ON SIDEWALLS OF...
- Publication number 20190057857
- Publication date Feb 21, 2019
- ASM IP HOLDING B.V.
- Dai Ishikawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ASSEMBLY AND SEMICONDUCTOR DEVICE
- Publication number 20180342478
- Publication date Nov 29, 2018
- Hitachi Chemical Company, Ltd.
- Hideo NAKAKO
- B22 - CASTING POWDER METALLURGY
Information Patent Application
COPPER PASTE FOR JOINING, METHOD FOR PRODUCING JOINED BODY, AND MET...
- Publication number 20180250751
- Publication date Sep 6, 2018
- Hitachi Chemical Company, Ltd.
- Yuki KAWANA
- B22 - CASTING POWDER METALLURGY
Information Patent Application
REACTION CHAMBER PASSIVATION AND SELECTIVE DEPOSITION OF METALLIC F...
- Publication number 20180080121
- Publication date Mar 22, 2018
- ASM IP HOLDING B.V.
- Delphine Longrie
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
SELECTIVE DEPOSITION OF METALLIC FILMS
- Publication number 20170358482
- Publication date Dec 14, 2017
- ASM IP HOLDING B.V.
- Shang Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FORMING SPACERS USING SILICON NITRIDE FILM FOR SPACER-DE...
- Publication number 20170316940
- Publication date Nov 2, 2017
- ASM IP HOLDING B.V.
- Dai Ishikawa
- H01 - BASIC ELECTRIC ELEMENTS

DAI ISHIKAWA

Person

Patents Grantslast 30 patents

Member connection method

Formation of SiN thin films

Method for forming silicon nitride film selectively on top/bottom p...

Method for manufacturing thermoelectric conversion module, thermoel...

Copper paste for pressureless bonding, bonded body and semiconducto...

Method for producing joined body, and joining material

Metal paste for joints, assembly, production method for assembly, s...

Metal paste for joints, assembly, production method for assembly, s...

Formation of SiN thin films

Copper paste for joining, method for manufacturing joined body, and...

Copper paste for pressureless bonding, bonded body and semiconducto...

Method of selectively depositing a capping layer structure on a sem...

Method for etching a carbon-containing feature

Reaction chamber passivation and selective deposition of metallic f...

Copper paste for joining, method for manufacturing joined body, and...

Method for forming silicon nitride film selectively on top surface

Method of spacer-defined direct patterning in semiconductor fabrica...

Assembly and semiconductor device

Method for forming silicon nitride film selectively on sidewalls or...

Reaction chamber passivation and selective deposition of metallic f...

Method for forming spacers using silicon nitride film for spacer-de...

Formation of SiN thin films

Copper paste for joining, method for producing joined body, and met...

Silver paste composition and semiconductor device using same

Adhesive composition and semiconductor device using same

Reaction chamber passivation and selective deposition of metallic f...

Selective deposition of metallic films

Processes for preventing oxidation of metal thin films

Reaction chamber passivation and selective deposition of metallic f...

Selective deposition of metallic films

Patents Applicationslast 30 patents

METAL PASTE FOR JOINING, JOINT, AND MANUFACTURING METHOD THEREFOR

COPPER PASTE FOR FORMING SINTERED COPPER PILLARS AND METHOD FOR PRO...

COMPOSITION AND AMELIORATING AGENT HAVING INFLAMMATION REDUCING EFFECT

COMPOSITION AND AMELIORATING AGENT HAVING INFLAMMATION REDUCING EFFECT

COPPER PASTE, WICK FORMATION METHOD, AND HEAT PIPE

COPPER PASTE FOR JOINING, METHOD FOR MANUFACTURING JOINED BODY, AND...

FORMATION OF SiN THIN FILMS

MEMBER CONNECTION METHOD

SUBSTRATE PROCESSING APPARATUS, BEVEL MASK AND SUBSTRATE PROCESSING...

COPPER PASTE FOR PRESSURELESS BONDING, BONDED BODY AND SEMICONDUCTO...

METHOD FOR PRODUCING JOINED BODY, AND JOINING MATERIAL

METHOD FOR FORMING SILICON NITRIDE FILM SELECTIVELY ON TOP/BOTTOM P...

METHOD FOR MANUFACTURING THERMOELECTRIC CONVERSION MODULE, THERMOEL...

REACTION CHAMBER PASSIVATION AND SELECTIVE DEPOSITION OF METALLIC F...

COPPER PASTE FOR JOINING, METHOD FOR MANUFACTURING JOINED BODY, AND...

METAL PASTE FOR JOINTS, ASSEMBLY, PRODUCTION METHOD FOR ASSEMBLY, S...

METHOD FOR ETCHING A CARBON-CONTAINING FEATURE

COPPER PASTE FOR JOINING, METHOD FOR MANUFACTURING JOINED BODY, AND...

METAL PASTE FOR JOINTS, ASSEMBLY, PRODUCTION METHOD FOR ASSEMBLY, S...

FORMATION OF SiN THIN FILMS

COPPER PASTE FOR PRESSURELESS BONDING, BONDED BODY AND SEMICONDUCTO...

METHOD OF SPACER-DEFINED DIRECT PATTERNING IN SEMICONDUCTOR FABRICA...

METHOD OF SELECTIVELY DEPOSITING A CAPPING LAYER STRUCTURE ON A SEM...

REACTION CHAMBER PASSIVATION AND SELECTIVE DEPOSITION OF METALLIC F...

METHOD FOR FORMING SILICON NITRIDE FILM SELECTIVELY ON SIDEWALLS OF...

ASSEMBLY AND SEMICONDUCTOR DEVICE

COPPER PASTE FOR JOINING, METHOD FOR PRODUCING JOINED BODY, AND MET...

REACTION CHAMBER PASSIVATION AND SELECTIVE DEPOSITION OF METALLIC F...

SELECTIVE DEPOSITION OF METALLIC FILMS

METHOD FOR FORMING SPACERS USING SILICON NITRIDE FILM FOR SPACER-DE...