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Patents Grantslast 30 patents

Information Patent Grant
Multi-layer electronic part built-in board
- Patent number 8,184,447
- Issue date May 22, 2012
- Denso Corporation
- Dai Itou
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Connector mounting structure and electronic apparatus having the same
- Patent number 7,419,385
- Issue date Sep 2, 2008
- DENSO COPRPORATION
- Dai Itou
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Multi-layer electronic part built-in board
- Publication number 20080117609
- Publication date May 22, 2008
- DENSO CORPORATION
- Dai Itou
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Connector mounting structure and electronic apparatus having the same
- Publication number 20070218715
- Publication date Sep 20, 2007
- DENSO CORPORATION
- Dai Itou
- H01 - BASIC ELECTRIC ELEMENTS