Dai Yokoyama

Person

Singapore, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Component supply device and component mounting device
- Patent number 11,357,144
- Issue date Jun 7, 2022
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Hideaki Watanabe
- B21 - MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL PUNCHING...
Information Patent Grant
Method of mounting component
- Patent number 11,202,374
- Issue date Dec 14, 2021
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Hideaki Watanabe
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of manufacturing component-mounted substrate
- Patent number 11,006,560
- Issue date May 11, 2021
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Hideaki Watanabe
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Component mounting device and method of mounting component
- Patent number 10,568,250
- Issue date Feb 18, 2020
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Hideaki Watanabe
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Component mounting apparatus
- Patent number 10,549,432
- Issue date Feb 4, 2020
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Dai Yokoyama
- B25 - HAND TOOLS PORTABLE POWER-DRIVEN TOOLS MANIPULATORS
Information Patent Grant
Electronic component mounting method and electronic component mount...
- Patent number 10,492,350
- Issue date Nov 26, 2019
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Dai Yokoyama
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Component supply device, component mounter, and component-mounted b...
- Patent number 10,390,470
- Issue date Aug 20, 2019
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Hideaki Watanabe
- F16 - ENGINEERING ELEMENTS AND UNITS GENERAL MEASURES FOR PRODUCING AND MAINT...
Information Patent Grant
Electronic component mounter
- Patent number 10,004,170
- Issue date Jun 19, 2018
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Yosuke Nagasawa
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic component mounting apparatus
- Patent number 6,915,561
- Issue date Jul 12, 2005
- Matsushita Electric Industrial Co., Ltd.
- Dai Yokoyama
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Apparatus for mounting a wire component
- Patent number 6,715,205
- Issue date Apr 6, 2004
- Matsushita Electric Industrial Co., Ltd.
- Hideaki Watanabe
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Axial-type electronic component inserting apparatus
- Patent number 6,477,766
- Issue date Nov 12, 2002
- Matsushita Electric Industrial Co., Ltd.
- Kiyoshi Imai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Axial-type electronic component inserting method
- Patent number 6,205,655
- Issue date Mar 27, 2001
- Matsushita Electric Industrial Co., Ltd.
- Kiyoshi Imai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Board recognizing apparatus and method
- Patent number 5,930,381
- Issue date Jul 27, 1999
- Matsushita Electric Industrial Co., Ltd.
- Hideaki Watanabe
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Electronic parts mounting method
- Patent number 5,909,914
- Issue date Jun 8, 1999
- Matsushita Electric Industrial Co., Ltd.
- Kiyoshi Imai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method and apparatus for inserting electronic component
- Patent number 5,832,597
- Issue date Nov 10, 1998
- Matsushita Electric Industrial Co., Ltd.
- Dai Yokoyama
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Axial type electronic component inserting apparatus
- Patent number 5,701,662
- Issue date Dec 30, 1997
- Matsushita Electric Industrial Co., Ltd.
- Kiyoshi Imai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
COMPONENT SUPPLY DEVICE, COMPONENT MOUNTING DEVICE, AND METHOD OF M...
- Publication number 20190133007
- Publication date May 2, 2019
- Panasonic Intellectual Property Management Co., Ltd.
- Hideaki WATANABE
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
COMPONENT MOUNTING DEVICE AND METHOD OF MANUFACTURING COMPONENT-MOU...
- Publication number 20190082566
- Publication date Mar 14, 2019
- Panasonic Intellectual Property Management Co., Ltd.
- Hideaki WATANABE
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
COMPONENT MOUNTING DEVICE AND METHOD OF MOUNTING COMPONENT
- Publication number 20180255670
- Publication date Sep 6, 2018
- Panasonic Intellectual Property Management Co., Ltd.
- Hideaki WATANABE
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
COMPONENT MOUNTING DEVICE AND METHOD OF MOUNTING COMPONENT
- Publication number 20180255671
- Publication date Sep 6, 2018
- Panasonic Intellectual Property Management Co., Ltd.
- Hideaki WATANABE
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
COMPONENT SUPPLY DEVICE, COMPONENT MOUNTER, AND COMPONENT-MOUNTED B...
- Publication number 20180103566
- Publication date Apr 12, 2018
- Panasonic Intellectual Property Management Co., Ltd.
- HIDEAKI WATANABE
- B65 - CONVEYING PACKING STORING HANDLING THIN OR FILAMENTARY MATERIAL
Information Patent Application
COMPONENT MOUNTING APPARATUS
- Publication number 20170066141
- Publication date Mar 9, 2017
- Panasonic Intellectual Property Management Co., Ltd.
- DAI YOKOYAMA
- B25 - HAND TOOLS PORTABLE POWER-DRIVEN TOOLS MANIPULATORS
Information Patent Application
ELECTRONIC COMPONENT MOUNTER
- Publication number 20170042073
- Publication date Feb 9, 2017
- Panasonic Intellectual Property Management Co., Ltd.
- YOSUKE NAGASAWA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC COMPONENT MOUNTING METHOD AND ELECTRONIC COMPONENT MOUNT...
- Publication number 20170034968
- Publication date Feb 2, 2017
- Panasonic Intellectual Property Management Co., Ltd.
- DAI YOKOYAMA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Wiring and piping apparatus of part mounting machine
- Publication number 20060016614
- Publication date Jan 26, 2006
- Dai Yokoyama
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Electronic component mounting apparatus
- Publication number 20020108237
- Publication date Aug 15, 2002
- MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.
- Dai Yokoyama
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Application
Apparatus and method for mounting wire component
- Publication number 20020046463
- Publication date Apr 25, 2002
- Hideaki Watanabe
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Application
Axial-type electronic component inserting method
- Publication number 20010003864
- Publication date Jun 21, 2001
- Kiyoshi Imai
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC

Dai Yokoyama

Person

Patents Grantslast 30 patents

Component supply device and component mounting device

Method of mounting component

Method of manufacturing component-mounted substrate

Component mounting device and method of mounting component

Component mounting apparatus

Electronic component mounting method and electronic component mount...

Component supply device, component mounter, and component-mounted b...

Electronic component mounter

Electronic component mounting apparatus

Apparatus for mounting a wire component

Axial-type electronic component inserting apparatus

Axial-type electronic component inserting method

Board recognizing apparatus and method

Electronic parts mounting method

Method and apparatus for inserting electronic component

Axial type electronic component inserting apparatus

Patents Applicationslast 30 patents

COMPONENT SUPPLY DEVICE, COMPONENT MOUNTING DEVICE, AND METHOD OF M...

COMPONENT MOUNTING DEVICE AND METHOD OF MANUFACTURING COMPONENT-MOU...

COMPONENT MOUNTING DEVICE AND METHOD OF MOUNTING COMPONENT

COMPONENT MOUNTING DEVICE AND METHOD OF MOUNTING COMPONENT

COMPONENT SUPPLY DEVICE, COMPONENT MOUNTER, AND COMPONENT-MOUNTED B...

COMPONENT MOUNTING APPARATUS

ELECTRONIC COMPONENT MOUNTER

ELECTRONIC COMPONENT MOUNTING METHOD AND ELECTRONIC COMPONENT MOUNT...

Wiring and piping apparatus of part mounting machine

Electronic component mounting apparatus

Apparatus and method for mounting wire component

Axial-type electronic component inserting method