Daichi KITAZUME

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Nishigo-mura, JP

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Patents Grantslast 30 patents

Information Patent Grant
Carrier for double-side polishing apparatus, double-side polishing...
- Patent number 11,453,098
- Issue date Sep 27, 2022
- Shin-Etsu Handotai Co., Ltd.
- Yuki Tanaka
- B24 - GRINDING POLISHING
Information Patent Grant
Method for double-side polishing wafer
- Patent number 11,298,796
- Issue date Apr 12, 2022
- Shin-Etsu Handotai Co., Ltd.
- Yuki Tanaka
- B24 - GRINDING POLISHING
Information Patent Grant
Manufacturing method of carrier for double-side polishing apparatus...
- Patent number 11,065,735
- Issue date Jul 20, 2021
- Shin-Etsu Handotai Co., Ltd.
- Daichi Kitazume
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
NITRIDE SEMICONDUCTOR SUBSTRATE AND METHOD FOR PRODUCING NITRIDE SE...
- Publication number 20250059676
- Publication date Feb 20, 2025
- Shin-Etsu Handotai Co., Ltd.
- Ippei KUBONO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CARRIER FOR DOUBLE-SIDE POLISHING APPARATUS, DOUBLE-SIDE POLISHING...
- Publication number 20200061772
- Publication date Feb 27, 2020
- Shin-Etsu Handotai Co., Ltd.
- Yuki TANAKA
- B24 - GRINDING POLISHING
Information Patent Application
MANUFACTURING METHOD OF CARRIER FOR DOUBLE-SIDE POLISHING APPARATUS...
- Publication number 20190047113
- Publication date Feb 14, 2019
- Shin-Etsu Handotai Co., Ltd.
- Daichi KITAZUME
- B24 - GRINDING POLISHING
Information Patent Application
METHOD FOR DOUBLE-SIDE POLISHING WAFER
- Publication number 20180272497
- Publication date Sep 27, 2018
- Shin-Etsu Handotai Co., Ltd.
- Yuki TANAKA
- B24 - GRINDING POLISHING