Daigo Ichikawa

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Iruma-shi, JP

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Patents Grantslast 30 patents

Information Patent Grant
Solder composition and electronic substrate
- Patent number 11,780,035
- Issue date Oct 10, 2023
- Tamura Corporation
- Ryutaro Shimoishi
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Solder composition and electronic board
- Patent number 10,449,638
- Issue date Oct 22, 2019
- Tamura Corporation
- Daigo Ichikawa
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
SOLDER COMPOSITION AND METHOD FOR MANUFACTURING FLEXIBLE CIRCUIT BOARD
- Publication number 20230100601
- Publication date Mar 30, 2023
- TAMURA CORPORATION
- Sumire Tanaka
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SOLDER COMPOSITION AND ELECTRONIC SUBSTRATE
- Publication number 20220097181
- Publication date Mar 31, 2022
- TAMURA CORPORATION
- Ryutaro Shimoishi
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SOLDER COMPOSITION AND ELECTRONIC BOARD
- Publication number 20170282304
- Publication date Oct 5, 2017
- TAMURA CORPORATION
- Daigo Ichikawa
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR