Daigo Shitabo

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Tokyo, JP

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Patents Grantslast 30 patents

Information Patent Grant
Wet etching method and wet etching system
- Patent number 12,119,230
- Issue date Oct 15, 2024
- Disco Corporation
- Kazuma Sekiya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Gettering layer forming method
- Patent number 10,546,758
- Issue date Jan 28, 2020
- Disco Corporation
- Daigo Shitabo
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
MANUFACTURING METHOD FOR DEVICE CHIP
- Publication number 20220399235
- Publication date Dec 15, 2022
- Disco Corporation
- Katsuhiko SUZUKI
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
WET ETCHING METHOD AND WET ETCHING SYSTEM
- Publication number 20210335620
- Publication date Oct 28, 2021
- Disco Corporation
- Kazuma SEKIYA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
GETTERING LAYER FORMING METHOD
- Publication number 20180323081
- Publication date Nov 8, 2018
- Disco Corporation
- Daigo Shitabo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LASER PROCESSING METHOD AND FINE PARTICLE LAYER FORMING AGENT
- Publication number 20140175070
- Publication date Jun 26, 2014
- Disco Corporation
- Yukinobu Ohura
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR