Daiki Komatsu

Person

Ogaki-shi, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Wiring board and method for manufacturing the same
- Patent number 9,565,756
- Issue date Feb 7, 2017
- Ibiden Co., Ltd.
- Makoto Terui
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic component having encapsulated wiring board and method fo...
- Patent number 9,536,801
- Issue date Jan 3, 2017
- Ibiden Co., Ltd.
- Toshiki Furutani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate for mounting semiconductor, semiconductor device and meth...
- Patent number 9,338,886
- Issue date May 10, 2016
- Ibiden Co., Ltd.
- Toshiki Furutani
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wiring board and method for manufacturing the same
- Patent number 9,066,435
- Issue date Jun 23, 2015
- Ibiden Co., Ltd.
- Makoto Terui
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic component having encapsulated wiring board and method fo...
- Patent number 9,059,187
- Issue date Jun 16, 2015
- Ibiden Co., Ltd.
- Toshiki Furutani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing interposer
- Patent number 8,997,344
- Issue date Apr 7, 2015
- Ibiden Co., Ltd.
- Hajime Sakamoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multilayer printed wiring board
- Patent number 8,829,355
- Issue date Sep 9, 2014
- Ibiden Co., Ltd.
- Takashi Kariya
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Substrate for mounting semiconductor, semiconductor device and meth...
- Patent number 8,785,255
- Issue date Jul 22, 2014
- Ibiden Co., Ltd.
- Toshiki Furutani
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Substrate for mounting semiconductor, semiconductor device and meth...
- Patent number 8,698,303
- Issue date Apr 15, 2014
- Ibiden Co., Ltd.
- Toshiki Furutani
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wiring board
- Patent number 8,546,922
- Issue date Oct 1, 2013
- Ibiden Co., Ltd.
- Toshiki Furutani
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device
- Patent number 8,441,133
- Issue date May 14, 2013
- Ibiden Co., Ltd.
- Daiki Komatsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate for mounting semiconductor element and method for manufac...
- Patent number 8,395,054
- Issue date Mar 12, 2013
- Ibiden Co., Ltd.
- Takashi Kariya
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed wiring board and method for manufacturing the same
- Patent number 8,378,230
- Issue date Feb 19, 2013
- Ibiden Co., Ltd.
- Masahiro Kaneko
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic component mounting substrate and method for manufacturin...
- Patent number 8,373,069
- Issue date Feb 12, 2013
- Ibiden Co., Ltd.
- Takashi Kariya
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multilayer printed wiring board and method for manufacturing multil...
- Patent number 8,362,367
- Issue date Jan 29, 2013
- Ibiden Co., Ltd.
- Daiki Komatsu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Interposer and method for manufacturing interposer
- Patent number 8,188,378
- Issue date May 29, 2012
- Ibiden Co., Ltd.
- Hajime Sakamoto
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Interposer and method for manufacturing interposer
- Patent number 8,173,907
- Issue date May 8, 2012
- Ibiden Co., Ltd.
- Hajime Sakamoto
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC

Patents Applicationslast 30 patents

Information Patent Application
WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20150264817
- Publication date Sep 17, 2015
- IBIDEN CO., LTD.
- Makoto TERUI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC COMPONENT HAVING ENCAPSULATED WIRING BOARD AND METHOD FO...
- Publication number 20150255359
- Publication date Sep 10, 2015
- IBIDEN CO., LTD.
- Toshiki FURUTANI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTILAYER PRINTED WIRING BOARD
- Publication number 20150026975
- Publication date Jan 29, 2015
- IBIDEN CO., LTD.
- Takashi Kariya
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SUBSTRATE FOR MOUNTING SEMICONDUCTOR, SEMICONDUCTOR DEVICE AND METH...
- Publication number 20140284820
- Publication date Sep 25, 2014
- IBIDEN CO., LTD.
- Toshiki FURUTANI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE FOR MOUNTING SEMICONDUCTOR, SEMICONDUCTOR DEVICE AND METH...
- Publication number 20140162411
- Publication date Jun 12, 2014
- IBIDEN CO., LTD.
- Toshiki FURUTANI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20130256000
- Publication date Oct 3, 2013
- IBIDEN CO., LTD.
- Makoto TERUI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20130258625
- Publication date Oct 3, 2013
- IBIDEN CO., LTD.
- Makoto Terui
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE FOR MOUNTING SEMICONDUCTOR, SEMICONDUCTOR DEVICE AND METH...
- Publication number 20120181708
- Publication date Jul 19, 2012
- IBIDEN CO., LTD.
- Toshiki FURUTANI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRING BOARD
- Publication number 20120175754
- Publication date Jul 12, 2012
- IBIDEN CO., LTD.
- Toshiki FURUTANI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC COMPONENT AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20120080786
- Publication date Apr 5, 2012
- IBIDEN CO., LTD.
- Toshiki FURUTANI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC COMPONENT AND PRINTED WIRING BOARD
- Publication number 20120018198
- Publication date Jan 26, 2012
- IBIDEN CO., LTD.
- Toshiki FURUTANI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
INTERPOSER AND METHOD FOR MANUFACTURING INTERPOSER
- Publication number 20110265324
- Publication date Nov 3, 2011
- IBIDEN CO., LTD.
- Hajime SAKAMOTO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20110067913
- Publication date Mar 24, 2011
- IBIDEN CO., LTD.
- Masahiro KANEKO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MULTILAYER PRINTED WIRING BOARD
- Publication number 20100243299
- Publication date Sep 30, 2010
- IBIDEN CO., LTD.
- Takashi Kariya
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20100244242
- Publication date Sep 30, 2010
- IBIDEN CO., LTD.
- Daiki KOMATSU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE FOR MOUNTING SEMICONDUCTOR ELEMENT AND METHOD FOR MANUFAC...
- Publication number 20100230148
- Publication date Sep 16, 2010
- IBIDEN, CO., LTD.
- Takashi Kariya
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC COMPONENT MOUNTING SUBSTRATE AND METHOD FOR MANUFACTURIN...
- Publication number 20100200279
- Publication date Aug 12, 2010
- IBIDEN CO., LTD.
- Takashi KARIYA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MULTILAYER PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING MULTIL...
- Publication number 20100078212
- Publication date Apr 1, 2010
- IBIDEN, CO., LTD.
- Daiki Komatsu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
INTERPOSER AND METHOD FOR MANUFACTURING INTERPOSER
- Publication number 20090173522
- Publication date Jul 9, 2009
- IBIDEN CO., LTD.
- Hajime Sakamoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERPOSER AND METHOD FOR MANUFACTURING INTERPOSER
- Publication number 20090173530
- Publication date Jul 9, 2009
- IBIDEN CO., LTD.
- Hajime SAKAMOTO
- H01 - BASIC ELECTRIC ELEMENTS

Daiki Komatsu

Person

Patents Grantslast 30 patents

Wiring board and method for manufacturing the same

Electronic component having encapsulated wiring board and method fo...

Substrate for mounting semiconductor, semiconductor device and meth...

Wiring board and method for manufacturing the same

Electronic component having encapsulated wiring board and method fo...

Method for manufacturing interposer

Multilayer printed wiring board

Substrate for mounting semiconductor, semiconductor device and meth...

Substrate for mounting semiconductor, semiconductor device and meth...

Wiring board

Semiconductor device

Substrate for mounting semiconductor element and method for manufac...

Printed wiring board and method for manufacturing the same

Electronic component mounting substrate and method for manufacturin...

Multilayer printed wiring board and method for manufacturing multil...

Interposer and method for manufacturing interposer

Interposer and method for manufacturing interposer

Patents Applicationslast 30 patents

WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME

ELECTRONIC COMPONENT HAVING ENCAPSULATED WIRING BOARD AND METHOD FO...

MULTILAYER PRINTED WIRING BOARD

SUBSTRATE FOR MOUNTING SEMICONDUCTOR, SEMICONDUCTOR DEVICE AND METH...

SUBSTRATE FOR MOUNTING SEMICONDUCTOR, SEMICONDUCTOR DEVICE AND METH...

WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME

WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME

SUBSTRATE FOR MOUNTING SEMICONDUCTOR, SEMICONDUCTOR DEVICE AND METH...

WIRING BOARD

ELECTRONIC COMPONENT AND METHOD FOR MANUFACTURING THE SAME

ELECTRONIC COMPONENT AND PRINTED WIRING BOARD

INTERPOSER AND METHOD FOR MANUFACTURING INTERPOSER

PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME

MULTILAYER PRINTED WIRING BOARD

SEMICONDUCTOR DEVICE

SUBSTRATE FOR MOUNTING SEMICONDUCTOR ELEMENT AND METHOD FOR MANUFAC...

ELECTRONIC COMPONENT MOUNTING SUBSTRATE AND METHOD FOR MANUFACTURIN...

MULTILAYER PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING MULTIL...

INTERPOSER AND METHOD FOR MANUFACTURING INTERPOSER

INTERPOSER AND METHOD FOR MANUFACTURING INTERPOSER