Daiping Tang

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Shanghai, CN

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Patents Grantslast 30 patents

Information Patent Grant
Connection plate, circuit board assembly, and electronic device
- Patent number 11,706,871
- Issue date Jul 18, 2023
- Huawei Technologies Co., Ltd.
- Hui Wang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Connection plate, circuit board assembly, and electronic device
- Patent number 11,166,374
- Issue date Nov 2, 2021
- Huawei Technologies Co., Ltd.
- Hui Wang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Signal processing method and communications chip structure
- Patent number 10,904,054
- Issue date Jan 26, 2021
- Huawei Technologies Co., Ltd.
- Mingjun Fan
- H04 - ELECTRIC COMMUNICATION TECHNIQUE

Patents Applicationslast 30 patents

Information Patent Application
WIRELESS COMMUNICATIONS SYSTEM, POWER SUPPLY SYSTEM, AND TERMINAL D...
- Publication number 20230027340
- Publication date Jan 26, 2023
- Huawei Technologies Co., Ltd
- Hsiang Hui CHANG
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
CONNECTION PLATE, CIRCUIT BOARD ASSEMBLY, AND ELECTRONIC DEVICE
- Publication number 20220022320
- Publication date Jan 20, 2022
- Huawei Technologies Co., Ltd
- Hui WANG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CONNECTION PLATE, CIRCUIT BOARD ASSEMBLY, AND ELECTRONIC DEVICE
- Publication number 20210014971
- Publication date Jan 14, 2021
- HUAWEI TECHNOLOGIES CO., LTD.
- Hui WANG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SIGNAL PROCESSING METHOD AND COMMUNICATIONS CHIP STRUCTURE
- Publication number 20200162294
- Publication date May 21, 2020
- Huawei Technologies Co., Ltd
- Mingjun Fan
- H04 - ELECTRIC COMMUNICATION TECHNIQUE