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Daisuke Akita

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Patents Grantslast 30 patents

  • Information Patent Grant

    Grinding method of workpiece
    • Patent number 12,325,104
    • Issue date Jun 10, 2025
    • Disco Corporation
    • Daisuke Akita
    • B24 - GRINDING POLISHING
  • Information Patent Grant

    Hard wafer grinding method
    • Patent number 12,285,835
    • Issue date Apr 29, 2025
    • Disco Corporation
    • Daisuke Akita
    • B24 - GRINDING POLISHING
  • Information Patent Grant

    Electromagnetic flowmeter
    • Patent number 8,136,412
    • Issue date Mar 20, 2012
    • Yamatake Corporation
    • Tomoshige Yamamoto
    • G01 - MEASURING TESTING
  • Information Patent Grant

    Method and apparatus for peeling surface protective film
    • Patent number 7,521,384
    • Issue date Apr 21, 2009
    • Tokyo Seimitsu Co., Ltd.
    • Masaki Kanazawa
    • B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL

Patents Applicationslast 30 patents