Daisuke Chino

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Tokyo, JP

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Patents Grantslast 30 patents

Information Patent Grant
Method and device for cutting out hard-brittle substrate
- Patent number 10,071,462
- Issue date Sep 11, 2018
- Fuji Manufacturing Co., Ltd.
- Keiji Mase
- B24 - GRINDING POLISHING
Information Patent Grant
Method and device for cutting out hard-brittle substrate and protec...
- Patent number 9,333,624
- Issue date May 10, 2016
- Fuji Manufacturing Co., Ltd.
- Keiji Mase
- B24 - GRINDING POLISHING

Patents Applicationslast 30 patents

Information Patent Application
METHOD AND DEVICE FOR CUTTING OUT HARD-BRITTLE SUBSTRATE
- Publication number 20160243673
- Publication date Aug 25, 2016
- FUJI MANUFACTURING CO., LTD
- Keiji Mase
- B24 - GRINDING POLISHING
Information Patent Application
METHOD AND DEVICE FOR CUTTING OUT HARD-BRITTLE SUBSTRATE
- Publication number 20130303053
- Publication date Nov 14, 2013
- FUJI MANUFACTURING CO., LTD
- Keiji Mase
- B24 - GRINDING POLISHING