Daisuke Fujimoto

Person

Chikusei-shi, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Epoxy resin, epoxy resin composition, resin sheet, B-stage sheet, C...
- Patent number 11,795,293
- Issue date Oct 24, 2023
- Resonac Corporation
- Kazuya Kiguchi
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Method for producing semiconductor device
- Patent number 11,049,825
- Issue date Jun 29, 2021
- SHOWA DENKO MATERIALS CO., LTD.
- Aya Kasahara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Roof ditch molding end cap
- Patent number 10,464,502
- Issue date Nov 5, 2019
- Nissan North America, Inc.
- Jordan Renn
- B60 - VEHICLES IN GENERAL
Information Patent Grant
Structure containing conductor circuit, method for manufacturing sa...
- Patent number 10,034,384
- Issue date Jul 24, 2018
- Hitachi Chemical Company, Ltd.
- Kazuhiko Kurafuchi
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Grant
Film-like epoxy resin composition, method of producing film-like ep...
- Patent number 9,873,771
- Issue date Jan 23, 2018
- Hitachi Chemical Company, Ltd.
- Yutaka Nomura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structure containing conductor circuit, method for manufacturing sa...
- Patent number 9,661,763
- Issue date May 23, 2017
- Hitachi Chemical Company, Ltd.
- Kazuhiko Kurafuchi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Thermosetting resin composition of semi-IPN composite, and varnish,...
- Patent number 8,568,891
- Issue date Oct 29, 2013
- Hitachi Chemical Company, Ltd.
- Yasuyuki Mizuno
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Thermosetting resin composition of semi-IPN composite, and varnish,...
- Patent number 8,501,870
- Issue date Aug 6, 2013
- Hitachi Chemical Co., Ltd.
- Yasuyuki Mizuno
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Process for producing resin varnish containing semi-IPN composite t...
- Patent number 8,404,769
- Issue date Mar 26, 2013
- Hitachi Chemical Company, Ltd.
- Daisuke Fujimoto
- B32 - LAYERED PRODUCTS
Information Patent Grant
Thermosetting resin composition of semi-IPN composite, and varnish,...
- Patent number 8,277,948
- Issue date Oct 2, 2012
- Hitachi Chemical Co., Ltd.
- Yasuyuki Mizuno
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Composition of polycyanate ester and biphenyl epoxy resin
- Patent number 7,816,430
- Issue date Oct 19, 2010
- Hitachi Chemical Company, Ltd.
- Yasuyuki Mizuno
- B32 - LAYERED PRODUCTS
Information Patent Grant
Resin composition with excellent dielectric characteristics, proces...
- Patent number 7,157,506
- Issue date Jan 2, 2007
- Hitachi Chemical Co., Ltd.
- Yasuyuki Mizuno
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Thermosetting resin composition and use thereof
- Patent number 7,078,106
- Issue date Jul 18, 2006
- Hitachi Chemical Co., Ltd.
- Shinji Tsuchikawa
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Thermosetting resin composition and use thereof
- Patent number 6,667,107
- Issue date Dec 23, 2003
- Hitachi Chemical Co., Ltd.
- Shinji Tsuchikawa
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Production of insulating varnishes and multilayer printed circuit b...
- Patent number 6,197,149
- Issue date Mar 6, 2001
- Hitachi Chemical Company, Ltd.
- Kazuhito Kobayashi
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Process for producing multilayer printed circuit board for wire bon...
- Patent number 5,879,568
- Issue date Mar 9, 1999
- Hitachi, Ltd.
- Naoyuki Urasaki
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
METHOD FOR EVALUATING COMPATIBILITY OF THERMOSETTING RESIN COMPOSIT...
- Publication number 20230392002
- Publication date Dec 7, 2023
- Shuichi ISHIBASHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR USING A BUFFER SHEET
- Publication number 20230095879
- Publication date Mar 30, 2023
- Showa Denko Materials Co., Ltd.
- Yuta Koseki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Maleimide Resin Composition, Prepreg, Laminated Board, Resin Film,...
- Publication number 20220363850
- Publication date Nov 17, 2022
- Showa Denko Materials Co., Ltd.
- Aya Kasahara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RESIN COMPOSITION, RESIN MEMBER, RESIN SHEET, B-STAGE SHEET, C-STAG...
- Publication number 20210206906
- Publication date Jul 8, 2021
- Kazuya KIGUCHI
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
EPOXY RESIN, EPOXY RESIN COMPOSITION, RESIN SHEET, B-STAGE SHEET, C...
- Publication number 20210016546
- Publication date Jan 21, 2021
- Hitachi Chemical Company, Ltd.
- Kazuya KIGUCHI
- B32 - LAYERED PRODUCTS
Information Patent Application
PREPREG, LAMINATE, AND PRODUCTION METHODS THEREFOR, AS WELL AS PRIN...
- Publication number 20200404783
- Publication date Dec 24, 2020
- Hitachi Chemical Company, Ltd.
- Mari SHIMIZU
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
METHOD FOR PRODUCING SEMICONDUCTOR DEVICE
- Publication number 20200194391
- Publication date Jun 18, 2020
- Hitachi Chemical Company, Ltd.
- Aya KASAHARA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ROOF DITCH MOLDING END CAP
- Publication number 20190232890
- Publication date Aug 1, 2019
- NISSAN NORTH AMERICA, INC.
- Scott Nydam
- B60 - VEHICLES IN GENERAL
Information Patent Application
BUFFER SHEET COMPOSITION AND BUFFER SHEET
- Publication number 20180340056
- Publication date Nov 29, 2018
- Hitachi Chemical Company, Ltd.
- Yuta Koseki
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
FILM-LIKE EPOXY RESIN COMPOSITION, METHOD OF PRODUCING FILM-LIKE EP...
- Publication number 20170073481
- Publication date Mar 16, 2017
- Hitachi Chemical Company, Ltd.
- Yutaka NOMURA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRUCTURE CONTAINING CONDUCTOR CIRCUIT, METHOD FOR MANUFACTURING SA...
- Publication number 20170020004
- Publication date Jan 19, 2017
- Hitachi Chemical Company, Ltd.
- Kazuhiko KURAFUCHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRUCTURE CONTAINING CONDUCTOR CIRCUIT, METHOD FOR MANUFACTURING SA...
- Publication number 20140251676
- Publication date Sep 11, 2014
- HITACHI CHEMICAL COMPANY, LTD.
- Kazuhiko Kurafuchi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRIMER LAYER FOR PLATING PROCESS, LAMINATE FOR CIRCUIT BOARD AND PR...
- Publication number 20140151091
- Publication date Jun 5, 2014
- Daisuke FUJIMOTO
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
PROCESS FOR PRODUCING RESIN VARNISH CONTAINING SEMI-IPN COMPOSITE,...
- Publication number 20130040153
- Publication date Feb 14, 2013
- Daisuke Fujimoto
- B32 - LAYERED PRODUCTS
Information Patent Application
THERMOSETTING RESIN COMPOSITION OF SEMI-IPN COMPOSITE, AND VARNISH,...
- Publication number 20130000843
- Publication date Jan 3, 2013
- Yasuyuki MIZUNO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRIMER LAYER FOR PLATING PROCESS, LAMINATE FOR WIRING BOARD AND MET...
- Publication number 20120305291
- Publication date Dec 6, 2012
- Daisuke FUJIMOTO
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
THERMOSETTING RESIN COMPOSITION OF SEMI-IPN COMPOSITE, AND VARNISH,...
- Publication number 20120214009
- Publication date Aug 23, 2012
- Yasuyuki MIZUNO
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
Thermosetting Resin Composition of Semi-IPN Composite, and Varnish,...
- Publication number 20100233495
- Publication date Sep 16, 2010
- Yasuyuki Mizuno
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
PROCESS FOR PRODUCING RESIN VARNISH CONTAINING SEMI-IPN COMPOSITE T...
- Publication number 20100129676
- Publication date May 27, 2010
- Daisuke Fujimoto
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
Conductor Foil with Adhesive Layer, Conductor-Clad Laminate, Printe...
- Publication number 20090323300
- Publication date Dec 31, 2009
- Daisuke Fujimoto
- B32 - LAYERED PRODUCTS
Information Patent Application
Resin composition excellent in dielectric properties, process for p...
- Publication number 20070207326
- Publication date Sep 6, 2007
- Yasuyuki Mizuno
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
Resin composition for printed wiring board, and vanish, prepreg and...
- Publication number 20060167189
- Publication date Jul 27, 2006
- Yasuyuki Mizuno
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
Thermosetting resin composition and use thereof
- Publication number 20040091726
- Publication date May 13, 2004
- Shinji Tsuchikawa
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
Resin composition with excellent dielectric characteristics, proces...
- Publication number 20030130412
- Publication date Jul 10, 2003
- Yasuyuki Mizuno
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
Thermosetting resin composition and use thereof
- Publication number 20020147277
- Publication date Oct 10, 2002
- Shinji Tsuchikawa
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...

Daisuke Fujimoto

Person

Patents Grantslast 30 patents

Epoxy resin, epoxy resin composition, resin sheet, B-stage sheet, C...

Method for producing semiconductor device

Roof ditch molding end cap

Structure containing conductor circuit, method for manufacturing sa...

Film-like epoxy resin composition, method of producing film-like ep...

Structure containing conductor circuit, method for manufacturing sa...

Thermosetting resin composition of semi-IPN composite, and varnish,...

Thermosetting resin composition of semi-IPN composite, and varnish,...

Process for producing resin varnish containing semi-IPN composite t...

Thermosetting resin composition of semi-IPN composite, and varnish,...

Composition of polycyanate ester and biphenyl epoxy resin

Resin composition with excellent dielectric characteristics, proces...

Thermosetting resin composition and use thereof

Thermosetting resin composition and use thereof

Production of insulating varnishes and multilayer printed circuit b...

Process for producing multilayer printed circuit board for wire bon...

Patents Applicationslast 30 patents

METHOD FOR EVALUATING COMPATIBILITY OF THERMOSETTING RESIN COMPOSIT...

METHOD FOR USING A BUFFER SHEET

Maleimide Resin Composition, Prepreg, Laminated Board, Resin Film,...

RESIN COMPOSITION, RESIN MEMBER, RESIN SHEET, B-STAGE SHEET, C-STAG...

EPOXY RESIN, EPOXY RESIN COMPOSITION, RESIN SHEET, B-STAGE SHEET, C...

PREPREG, LAMINATE, AND PRODUCTION METHODS THEREFOR, AS WELL AS PRIN...

METHOD FOR PRODUCING SEMICONDUCTOR DEVICE

ROOF DITCH MOLDING END CAP

BUFFER SHEET COMPOSITION AND BUFFER SHEET

FILM-LIKE EPOXY RESIN COMPOSITION, METHOD OF PRODUCING FILM-LIKE EP...

STRUCTURE CONTAINING CONDUCTOR CIRCUIT, METHOD FOR MANUFACTURING SA...

STRUCTURE CONTAINING CONDUCTOR CIRCUIT, METHOD FOR MANUFACTURING SA...

PRIMER LAYER FOR PLATING PROCESS, LAMINATE FOR CIRCUIT BOARD AND PR...

PROCESS FOR PRODUCING RESIN VARNISH CONTAINING SEMI-IPN COMPOSITE,...

THERMOSETTING RESIN COMPOSITION OF SEMI-IPN COMPOSITE, AND VARNISH,...

PRIMER LAYER FOR PLATING PROCESS, LAMINATE FOR WIRING BOARD AND MET...

THERMOSETTING RESIN COMPOSITION OF SEMI-IPN COMPOSITE, AND VARNISH,...

Thermosetting Resin Composition of Semi-IPN Composite, and Varnish,...

PROCESS FOR PRODUCING RESIN VARNISH CONTAINING SEMI-IPN COMPOSITE T...

Conductor Foil with Adhesive Layer, Conductor-Clad Laminate, Printe...

Resin composition excellent in dielectric properties, process for p...

Resin composition for printed wiring board, and vanish, prepreg and...

Thermosetting resin composition and use thereof

Resin composition with excellent dielectric characteristics, proces...

Thermosetting resin composition and use thereof