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Daisuke HAMADA
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Taito-ku, Tokyo, JP
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last 30 patents
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Patent Application
MULTILAYER FILM, PACKAGING MATERIAL, AND PACKAGE
Publication number
20240198642
Publication date
Jun 20, 2024
TOPPAN INC.
Daisuke HAMADA
B32 - LAYERED PRODUCTS
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Patent Application
MULTILAYER FILM, PACKAGING MATERIAL AND PACKAGE
Publication number
20230202153
Publication date
Jun 29, 2023
TOPPAN INC.
Daisuke HAMADA
B32 - LAYERED PRODUCTS