Daisuke HAMADA

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Taito-ku, Tokyo, JP

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Patents Applicationslast 30 patents

Information Patent Application
SEALANT FILM, PACKAGING MATERIAL, AND PACKAGE
- Publication number 20250229515
- Publication date Jul 17, 2025
- TOPPAN Holdings Inc.
- Daisuke HAMADA
- B32 - LAYERED PRODUCTS
Information Patent Application
MULTILAYER FILM, PACKAGING MATERIAL, AND PACKAGE
- Publication number 20240343026
- Publication date Oct 17, 2024
- TOPPAN Holdings Inc.
- Daisuke HAMADA
- B32 - LAYERED PRODUCTS
Information Patent Application
MULTILAYER FILM, PACKAGING MATERIAL, AND PACKAGE
- Publication number 20240198642
- Publication date Jun 20, 2024
- TOPPAN INC.
- Daisuke HAMADA
- B32 - LAYERED PRODUCTS
Information Patent Application
MULTILAYER FILM, PACKAGING MATERIAL AND PACKAGE
- Publication number 20230202153
- Publication date Jun 29, 2023
- TOPPAN INC.
- Daisuke HAMADA
- B32 - LAYERED PRODUCTS