Daisuke Hayashi

Person

Otsu-shi, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Absorption analyzer
- Patent number 11,513,060
- Issue date Nov 29, 2022
- Horiba Stec, Co., Ltd.
- Miyako Hada
- G01 - MEASURING TESTING
Information Patent Grant
Gas control system, deposition apparatus including gas control syst...
- Patent number 10,655,220
- Issue date May 19, 2020
- HORIBA STEC, Co., Ltd.
- Yuhei Sakaguchi
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Cp2Mg concentration measuring device
- Patent number 9,823,181
- Issue date Nov 21, 2017
- Horiba Stec, Co., Ltd.
- Daisuke Hayashi
- G01 - MEASURING TESTING
Information Patent Grant
Spectrophotometer and method for calibrating the same
- Patent number 8,629,397
- Issue date Jan 14, 2014
- Horiba Stec, Co., Ltd.
- Daisuke Hayashi
- G01 - MEASURING TESTING
Information Patent Grant
Material gas concentration control system
- Patent number 8,459,290
- Issue date Jun 11, 2013
- HORIBA, Ltd.
- Masakazu Minami
- G05 - CONTROLLING REGULATING

Patents Applicationslast 30 patents

Information Patent Application
WAFER TEMPERATURE CONTROL DEVICE, WAFER TEMPERATURE CONTROL METHOD...
- Publication number 20250006524
- Publication date Jan 2, 2025
- HORIBA STEC, CO., LTD.
- Daisuke HAYASHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER TEMPERATURE CONTROL DEVICE, WAFER TEMPERATURE CONTROL METHOD...
- Publication number 20240258139
- Publication date Aug 1, 2024
- HORIBA STEC, CO., LTD.
- Daisuke HAYASHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER TEMPERATURE CONTROL DEVICE, WAFER TEMPERATURE CONTROL METHOD,...
- Publication number 20240234186
- Publication date Jul 11, 2024
- HORIBA STEC, CO., LTD.
- Daisuke HAYASHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER TEMPERATURE CONTROL DEVICE, WAFER TEMPERATURE CONTROL METHOD,...
- Publication number 20240136212
- Publication date Apr 25, 2024
- HORIBA STEC, CO., LTD.
- Daisuke HAYASHI
- G05 - CONTROLLING REGULATING
Information Patent Application
ABSORPTION ANALYZER
- Publication number 20200182776
- Publication date Jun 11, 2020
- Horiba Stec, Co., Ltd.
- Miyako HADA
- G01 - MEASURING TESTING
Information Patent Application
SUBSTRATE PROCESSING APPARATUS AND PROGRAM FOR SUBSTRATE PROCESSING...
- Publication number 20190333737
- Publication date Oct 31, 2019
- Horiba Stec, Co., Ltd.
- Daisuke HAYASHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
GAS CONTROL SYSTEM, DEPOSITION APPARATUS INCLUDING GAS CONTROL SYST...
- Publication number 20180258530
- Publication date Sep 13, 2018
- HORIBA STEC, CO., LTD.
- Yuhei Sakaguchi
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
CP2Mg CONCENTRATION MEASURING DEVICE
- Publication number 20170052115
- Publication date Feb 23, 2017
- Horiba Stec, Co., Ltd.
- Daisuke HAYASHI
- G01 - MEASURING TESTING
Information Patent Application
SPECTROPHOTOMETER AND METHOD FOR CALIBRATING THE SAME
- Publication number 20120250014
- Publication date Oct 4, 2012
- HORIBA STEC, CO., LTD.
- Daisuke Hayashi
- G01 - MEASURING TESTING
Information Patent Application
MATERIAL GAS CONCENTRATION CONTROL SYSTEM
- Publication number 20100108154
- Publication date May 6, 2010
- HORIBA, Ltd.
- Masakazu Minami
- G05 - CONTROLLING REGULATING

Daisuke Hayashi

Person

Patents Grantslast 30 patents

Absorption analyzer

Gas control system, deposition apparatus including gas control syst...

Cp2Mg concentration measuring device

Spectrophotometer and method for calibrating the same

Material gas concentration control system

Patents Applicationslast 30 patents

WAFER TEMPERATURE CONTROL DEVICE, WAFER TEMPERATURE CONTROL METHOD...

WAFER TEMPERATURE CONTROL DEVICE, WAFER TEMPERATURE CONTROL METHOD...

WAFER TEMPERATURE CONTROL DEVICE, WAFER TEMPERATURE CONTROL METHOD,...

WAFER TEMPERATURE CONTROL DEVICE, WAFER TEMPERATURE CONTROL METHOD,...

ABSORPTION ANALYZER

SUBSTRATE PROCESSING APPARATUS AND PROGRAM FOR SUBSTRATE PROCESSING...

GAS CONTROL SYSTEM, DEPOSITION APPARATUS INCLUDING GAS CONTROL SYST...

CP2Mg CONCENTRATION MEASURING DEVICE

SPECTROPHOTOMETER AND METHOD FOR CALIBRATING THE SAME

MATERIAL GAS CONCENTRATION CONTROL SYSTEM