Daisuke HIEDA

Follow

Person

Tokyo, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Susceptor, vapor deposition apparatus, vapor deposition method and...
- Patent number 10,490,437
- Issue date Nov 26, 2019
- Sumco Corporation
- Daisuke Hieda
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...

Patents Applicationslast 30 patents

Information Patent Application
METHOD FOR PRODUCING SUPPORT SUBSTRATE FOR BONDED WAFER, AND SUPPOR...
- Publication number 20230395423
- Publication date Dec 7, 2023
- SUMCO CORPORATION
- Naoya NONAKA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUPPORT SUBSTRATE FOR BONDED WAFER
- Publication number 20230230875
- Publication date Jul 20, 2023
- SUMCO CORPORATION
- Shota SHIBUYA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUSCEPTOR, VAPOR DEPOSITION APPARATUS, VAPOR DEPOSITION METHOD AND...
- Publication number 20160300753
- Publication date Oct 13, 2016
- SUMCO CORPORATION
- Daisuke HIEDA
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...