Daisuke Kawaguchi

Person

Shizuoka, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Manufacturing method of semiconductor device
- Patent number 12,334,339
- Issue date Jun 17, 2025
- Denso Corporation
- Shosuke Nakabayashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor chip and method for manufacturing the same
- Patent number 12,293,945
- Issue date May 6, 2025
- Denso Corporation
- Shinichi Hoshi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor chip, processed wafer, and method for manufacturing s...
- Patent number 12,288,720
- Issue date Apr 29, 2025
- Denso Corporation
- Masatake Nagaya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Laser processing method, semiconductor member manufacturing method,...
- Patent number 12,194,570
- Issue date Jan 14, 2025
- NATIONAL UNIVERSITY CORPORATION TOKAI NATIONAL HIGHER EDUCATION AND RESEARCH...
- Atsushi Tanaka
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor chip and method for manufacturing the same
- Patent number 11,810,821
- Issue date Nov 7, 2023
- Denso Corporation
- Masatake Nagaya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Gallium nitride semiconductor device and method for manufacturing t...
- Patent number 11,810,783
- Issue date Nov 7, 2023
- Denso Corporation
- Chiaki Sasaoka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing gallium nitride semiconductor device
- Patent number 11,784,039
- Issue date Oct 10, 2023
- Denso Corporation
- Jun Kojima
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing quantum cascade laser beam source
- Patent number 10,439,363
- Issue date Oct 8, 2019
- Hamamatsu Photonics K.K.
- Akio Ito
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for cutting object to be processed
- Patent number 10,315,403
- Issue date Jun 11, 2019
- Hamamatsu Photonics K.K.
- Hideki Shimoi
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Laser machining device and laser machining method
- Patent number 10,124,439
- Issue date Nov 13, 2018
- Hamamatsu Photonics K.K.
- Daisuke Kawaguchi
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Laser machining device and laser machining method
- Patent number 10,124,440
- Issue date Nov 13, 2018
- Hamamatsu Photonics K.K.
- Daisuke Kawaguchi
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Laser machining device and laser machining method
- Patent number 9,914,183
- Issue date Mar 13, 2018
- Hamamatsu Photonics K.K.
- Daisuke Kawaguchi
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Laser machining device and laser machining method
- Patent number 9,902,017
- Issue date Feb 27, 2018
- Hamamatsu Photonics K.K.
- Daisuke Kawaguchi
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Laser machining device and laser machining method
- Patent number 9,902,016
- Issue date Feb 27, 2018
- Hamamatsu Photonics K.K.
- Daisuke Kawaguchi
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Laser machining method and laser machining device
- Patent number 9,821,408
- Issue date Nov 21, 2017
- Hamamatsu Photonics K.K.
- Daisuke Kawaguchi
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Laser processing method
- Patent number 9,764,421
- Issue date Sep 19, 2017
- Hamamatsu Photonics K.K.
- Daisuke Kawaguchi
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for cutting object to be processed
- Patent number 9,302,410
- Issue date Apr 5, 2016
- Hamamatsu Photonics K.K.
- Hideki Shimoi
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of cutting object to be processed, method of cutting strengt...
- Patent number 8,950,217
- Issue date Feb 10, 2015
- Hamamatsu Photonics K.K.
- Hiroyuki Iwaki
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for cutting processing target
- Patent number 8,890,026
- Issue date Nov 18, 2014
- Hamamatsu Photonics K.K.
- Naoki Uchiyama
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of cutting object to be processed
- Patent number 8,816,245
- Issue date Aug 26, 2014
- Hamamatsu Photonics K.K.
- Hiroyuki Iwaki
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE
- Publication number 20240194530
- Publication date Jun 13, 2024
- DENSO CORPORATION
- SHOSUKE NAKABAYASHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LASER PROCESSING METHOD, SEMICONDUCTOR DEVICE MANUFACTURING METHOD,...
- Publication number 20230405725
- Publication date Dec 21, 2023
- HAMAMATSU PHOTONICS K. K.
- Daisuke KAWAGUCHI
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE
- Publication number 20230326748
- Publication date Oct 12, 2023
- DENSO CORPORATION
- SHOSUKE NAKABAYASHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING GALLIUM NITRIDE SUBSTRATE
- Publication number 20230238281
- Publication date Jul 27, 2023
- DENSO CORPORATION
- MASATAKE NAGAYA
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR WAFER PROCESSING APPARATUS AND METHOD OF MANUFACTURIN...
- Publication number 20230230829
- Publication date Jul 20, 2023
- DENSO CORPORATION
- SHOSUKE NAKABAYASHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20230197442
- Publication date Jun 22, 2023
- DENSO CORPORATION
- TAKASHI USHIJIMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR WAFER
- Publication number 20230160104
- Publication date May 25, 2023
- DENSO CORPORATION
- Junji OHARA
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE
- Publication number 20230116208
- Publication date Apr 13, 2023
- DENSO CORPORATION
- TAKASHI USHIJIMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR CHIP AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20230116302
- Publication date Apr 13, 2023
- DENSO CORPORATION
- MASATAKE NAGAYA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20230095477
- Publication date Mar 30, 2023
- DENSO CORPORATION
- KOZO KATO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR CHIP AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20220352027
- Publication date Nov 3, 2022
- DENSO CORPORATION
- Shinichi Hoshi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR CHIP, PROCESSED WAFER, AND METHOD FOR MANUFACTURING S...
- Publication number 20220285219
- Publication date Sep 8, 2022
- DENSO CORPORATION
- MASATAKE NAGAYA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LASER PROCESSING METHOD, SEMICONDUCTOR MEMBER MANUFACTURING METHOD,...
- Publication number 20220093463
- Publication date Mar 24, 2022
- National University Corporation Tokai National Higher Education and Research...
- Atsushi TANAKA
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
LASER PROCESSING METHOD, SEMICONDUCTOR MEMBER MANUFACTURING METHOD,...
- Publication number 20220055156
- Publication date Feb 24, 2022
- National University Corporation Tokai National Higher Education and Research...
- Atsushi TANAKA
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
GALLIUM NITRIDE SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING T...
- Publication number 20210327710
- Publication date Oct 21, 2021
- DENSO CORPORATION
- Chiaki SASAOKA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR CHIP AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20210327757
- Publication date Oct 21, 2021
- DENSO CORPORATION
- Masatake Nagaya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING GALLIUM NITRIDE SEMICONDUCTOR DEVICE
- Publication number 20210327702
- Publication date Oct 21, 2021
- DENSO CORPORATION
- Jun KOJIMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE MANUFACTURING METHOD
- Publication number 20200180082
- Publication date Jun 11, 2020
- Atsushi TANAKA
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD OF MANUFACTURING QUANTUM CASCADE LASER BEAM SOURCE
- Publication number 20190074664
- Publication date Mar 7, 2019
- HAMAMATSU PHOTONICS K. K.
- Akio ITO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR CUTTING OBJECT TO BE PROCESSED
- Publication number 20160167355
- Publication date Jun 16, 2016
- HAMAMATSU PHOTONICS K. K.
- Hideki SHIMOI
- B32 - LAYERED PRODUCTS
Information Patent Application
LASER MACHINING DEVICE AND LASER MACHINING METHOD
- Publication number 20160052084
- Publication date Feb 25, 2016
- Hamamatsu Photonics K.K.
- Daisuke KAWAGUCHI
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
LASER MACHINING DEVICE AND LASER MACHINING METHOD
- Publication number 20160052085
- Publication date Feb 25, 2016
- Hamamatsu Photonics K.K.
- Daisuke KAWAGUCHI
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
LASER MACHINING DEVICE AND LASER MACHINING METHOD
- Publication number 20160052088
- Publication date Feb 25, 2016
- Hamamatsu Photonics K.K.
- Daisuke KAWAGUCHI
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
LASER MACHINING DEVICE AND LASER MACHINING METHOD
- Publication number 20160052083
- Publication date Feb 25, 2016
- Hamamatsu Photonics K.K.
- Daisuke KAWAGUCHI
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
LASER MACHINING DEVICE AND LASER MACHINING METHOD
- Publication number 20160045979
- Publication date Feb 18, 2016
- Hamamatsu Photonics K.K.
- Daisuke KAWAGUCHI
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
LASER PROCESSING METHOD
- Publication number 20160039044
- Publication date Feb 11, 2016
- Daisuke KAWAGUCHI
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
LASER MACHINING METHOD AND LASER MACHINING DEVICE
- Publication number 20150298252
- Publication date Oct 22, 2015
- Hamamatsu Photonics K.K.
- Daisuke KAWAGUCHI
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR CUTTING TOUGHENED GLASS PLATE
- Publication number 20150075221
- Publication date Mar 19, 2015
- HAMAMATSU PHOTONICS K. K.
- Daisuke KAWAGUCHI
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
LASER MACHINING METHOD AND LASER MACHINING DEVICE
- Publication number 20140251963
- Publication date Sep 11, 2014
- Hamamatsu Photonics K.K.
- Daisuke Kawaguchi
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR CUTTING OBJECT TO BE PROCESSED
- Publication number 20120111495
- Publication date May 10, 2012
- HAMAMATSU PHOTONICS K.K.
- Hideki Shimoi
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Daisuke Kawaguchi

Person

Patents Grantslast 30 patents

Manufacturing method of semiconductor device

Semiconductor chip and method for manufacturing the same

Semiconductor chip, processed wafer, and method for manufacturing s...

Laser processing method, semiconductor member manufacturing method,...

Semiconductor chip and method for manufacturing the same

Gallium nitride semiconductor device and method for manufacturing t...

Method for manufacturing gallium nitride semiconductor device

Method of manufacturing quantum cascade laser beam source

Method for cutting object to be processed

Laser machining device and laser machining method

Laser machining device and laser machining method

Laser machining device and laser machining method

Laser machining device and laser machining method

Laser machining device and laser machining method

Laser machining method and laser machining device

Laser processing method

Method for cutting object to be processed

Method of cutting object to be processed, method of cutting strengt...

Method for cutting processing target

Method of cutting object to be processed

Patents Applicationslast 30 patents

MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE

LASER PROCESSING METHOD, SEMICONDUCTOR DEVICE MANUFACTURING METHOD,...

MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE

METHOD OF MANUFACTURING GALLIUM NITRIDE SUBSTRATE

SEMICONDUCTOR WAFER PROCESSING APPARATUS AND METHOD OF MANUFACTURIN...

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR WAFER

MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE

SEMICONDUCTOR CHIP AND METHOD FOR MANUFACTURING THE SAME

METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE

SEMICONDUCTOR CHIP AND METHOD FOR MANUFACTURING THE SAME

SEMICONDUCTOR CHIP, PROCESSED WAFER, AND METHOD FOR MANUFACTURING S...

LASER PROCESSING METHOD, SEMICONDUCTOR MEMBER MANUFACTURING METHOD,...

LASER PROCESSING METHOD, SEMICONDUCTOR MEMBER MANUFACTURING METHOD,...

GALLIUM NITRIDE SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING T...

SEMICONDUCTOR CHIP AND METHOD FOR MANUFACTURING THE SAME

METHOD FOR MANUFACTURING GALLIUM NITRIDE SEMICONDUCTOR DEVICE

SUBSTRATE MANUFACTURING METHOD

METHOD OF MANUFACTURING QUANTUM CASCADE LASER BEAM SOURCE

METHOD FOR CUTTING OBJECT TO BE PROCESSED

LASER MACHINING DEVICE AND LASER MACHINING METHOD

LASER MACHINING DEVICE AND LASER MACHINING METHOD

LASER MACHINING DEVICE AND LASER MACHINING METHOD

LASER MACHINING DEVICE AND LASER MACHINING METHOD

LASER MACHINING DEVICE AND LASER MACHINING METHOD

LASER PROCESSING METHOD

LASER MACHINING METHOD AND LASER MACHINING DEVICE

METHOD FOR CUTTING TOUGHENED GLASS PLATE

LASER MACHINING METHOD AND LASER MACHINING DEVICE

METHOD FOR CUTTING OBJECT TO BE PROCESSED