Daisuke Mizutani

Person

Kawasaki, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Circuit board, method of manufacturing circuit board, and electroni...
- Patent number 11,317,520
- Issue date Apr 26, 2022
- FUJITSU INTERCONNECT TECHNOLOGIES LIMITED
- Masaharu Furuyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuit board, method of manufacturing circuit board, and electroni...
- Patent number 11,057,996
- Issue date Jul 6, 2021
- FUJITSU INTERCONNECT TECHNOLOGIES LIMITED
- Toshiki Iwai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit board, method for manufacturing circuit board, and electron...
- Patent number 10,896,871
- Issue date Jan 19, 2021
- Fujitsu Limited
- Tomoyuki Akahoshi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wiring board, electronic device, and wiring board manufacturing method
- Patent number 10,770,386
- Issue date Sep 8, 2020
- FUJITSU INTERCONNECT TECHNOLOGIES LIMITED
- Toshiki Iwai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wiring board, electronic device, and wiring board manufacturing method
- Patent number 10,734,316
- Issue date Aug 4, 2020
- FUJITSU INTERCONNECT TECHNOLOGIES LIMITED
- Toshiki Iwai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Capacitor built-in multilayer wiring substrate and manufacturing me...
- Patent number 10,701,808
- Issue date Jun 30, 2020
- Fujitsu Limited
- Tomoyuki Akahoshi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing board
- Patent number 10,396,020
- Issue date Aug 27, 2019
- Fujitsu Limited
- Kei Fukui
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Capacitor built-in multilayer wiring substrate and manufacturing me...
- Patent number 10,362,677
- Issue date Jul 23, 2019
- Fujitsu Limited
- Tomoyuki Akahoshi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Simulation method and simulation apparatus
- Patent number 10,311,189
- Issue date Jun 4, 2019
- Fujitsu Limited
- Hideaki Nagaoka
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Wiring substrate, method for manufacturing wiring substrate, electr...
- Patent number 9,754,830
- Issue date Sep 5, 2017
- Fujitsu Limited
- Taiga Fukumori
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuit board and electronic device
- Patent number 9,699,887
- Issue date Jul 4, 2017
- Fujitsu Limited
- Daisuke Mizutani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device manufacturing method and semiconductor mountin...
- Patent number 9,326,372
- Issue date Apr 26, 2016
- Fujitsu Limited
- Mamoru Kurashina
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electric circuit apparatus and manufacturing method therefor
- Patent number 9,055,685
- Issue date Jun 9, 2015
- Fujitsu Limited
- Mamoru Kurashina
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device manufacturing method and semiconductor mountin...
- Patent number 9,048,332
- Issue date Jun 2, 2015
- Fujitsu Limited
- Mamoru Kurashina
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method thereof
- Patent number 9,030,007
- Issue date May 12, 2015
- Fujitsu Limited
- Daisuke Mizutani
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit board, semiconductor device, and method of manufacturing se...
- Patent number 8,952,271
- Issue date Feb 10, 2015
- Fujitsu Limited
- Masaharu Furuyama
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multichip module and method for manufacturing the same
- Patent number 8,811,031
- Issue date Aug 19, 2014
- Fujitsu Limited
- Masateru Koide
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic part and method of manufacturing the same
- Patent number 8,546,187
- Issue date Oct 1, 2013
- Fujitsu Limited
- Masateru Koide
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-chip module
- Patent number 8,446,020
- Issue date May 21, 2013
- Fujitsu Limited
- Masateru Koide
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structural analysis of a printed wiring substrate
- Patent number 7,996,196
- Issue date Aug 9, 2011
- Fujitsu Limited
- Daisuke Mizutani
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit board and method for manufacturing the same
- Patent number 7,851,707
- Issue date Dec 14, 2010
- Fujitsu Limited
- Daisuke Mizutani
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device, connecting member, method for manufacturing a...
- Patent number 7,791,197
- Issue date Sep 7, 2010
- Fujitsu Limited
- Daisuke Mizutani
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multilayer wiring circuit board
- Patent number 7,671,281
- Issue date Mar 2, 2010
- Fujitsu Limited
- Toshihiro Kusagaya
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multilayer wiring circuit board
- Patent number 7,253,023
- Issue date Aug 7, 2007
- Fujitsu Limited
- Toshihiro Kusagaya
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Head suspension for swing arm actuator
- Patent number 6,992,861
- Issue date Jan 31, 2006
- Fujitsu Limited
- Atsushi Suzuki
- G11 - INFORMATION STORAGE
Information Patent Grant
Composition of epoxy group-containing cycloolefin resin
- Patent number 6,001,488
- Issue date Dec 14, 1999
- Nippon Zeon Co., Ltd.
- Hideaki Kataoka
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Composition of epoxy group-containing cycloolefin resin
- Patent number 5,895,800
- Issue date Apr 20, 1999
- Nippon Zeon Co., Ltd.
- Hideaki Kataoka
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Pattern forming process
- Patent number 5,886,136
- Issue date Mar 23, 1999
- Nippon Zeon Co., Ltd.
- Akira Tanaka
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Composition of epoxy group-containing cycloolefin resin
- Patent number 5,783,639
- Issue date Jul 21, 1998
- Nipon Zeon Co., Ltd.
- Hideaki Kataoka
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Photosensitive polyimide resin composition
- Patent number 5,777,068
- Issue date Jul 7, 1998
- Nippon Zeon Co., Ltd.
- Akira Tanaka
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY

Patents Applicationslast 30 patents

Information Patent Application
CAPACITOR-EMBEDDED SUBSTRATE AND ELECTRONIC APPARATUS
- Publication number 20200245463
- Publication date Jul 30, 2020
- Fujitsu Limited
- Tomoyuki Akahoshi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CIRCUIT SUBSTRATE AND METHOD FOR FABRICATING CIRCUIT SUBSTRATE
- Publication number 20190306981
- Publication date Oct 3, 2019
- Fujitsu Limited
- Masaharu Furuyama
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD AND METHOD OF MANUFACTURING CIRCUIT BOARD
- Publication number 20190306982
- Publication date Oct 3, 2019
- Fujitsu Limited
- Hideaki Nagaoka
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRING SUBSTRATE, SEMICONDUCTOR MODULE, AND MANUFACTURING METHOD FO...
- Publication number 20190287893
- Publication date Sep 19, 2019
- Fujitsu Limited
- Daisuke Mizutani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CIRCUIT BOARD, METHOD OF MANUFACTURING CIRCUIT BOARD, AND ELECTRONI...
- Publication number 20190289715
- Publication date Sep 19, 2019
- Fujitsu Limited
- Toshiki Iwai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CAPACITOR BUILT-IN MULTILAYER WIRING SUBSTRATE AND MANUFACTURING ME...
- Publication number 20190289718
- Publication date Sep 19, 2019
- Fujitsu Limited
- Tomoyuki Akahoshi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CIRCUIT BOARD, METHOD OF MANUFACTURING CIRCUIT BOARD, AND ELECTRONI...
- Publication number 20190215963
- Publication date Jul 11, 2019
- Fujitsu Limited
- Tomoyuki Akahoshi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CIRCUIT BOARD, METHOD FOR MANUFACTURING CIRCUIT BOARD, AND ELECTRON...
- Publication number 20190051598
- Publication date Feb 14, 2019
- Fujitsu Limited
- Tomoyuki AKAHOSHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CIRCUIT BOARD, METHOD OF MANUFACTURING CIRCUIT BOARD, AND ELECTRONI...
- Publication number 20190053385
- Publication date Feb 14, 2019
- Fujitsu Limited
- Masaharu Furuyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRING BOARD, ELECTRONIC DEVICE, AND WIRING BOARD MANUFACTURING METHOD
- Publication number 20190013266
- Publication date Jan 10, 2019
- Fujitsu Limited
- Toshiki Iwai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CAPACITOR BUILT-IN MULTILAYER WIRING SUBSTRATE AND MANUFACTURING ME...
- Publication number 20180332707
- Publication date Nov 15, 2018
- Fujitsu Limited
- Tomoyuki Akahoshi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
BOARD AND METHOD OF MANUFACTURING BOARD
- Publication number 20180315687
- Publication date Nov 1, 2018
- Fujitsu Limited
- Kei FUKUI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTILAYER CIRCUIT BOARD, SEMICONDUCTOR APPARATUS, AND METHOD OF MA...
- Publication number 20170006699
- Publication date Jan 5, 2017
- Fujitsu Limited
- Daisuke Mizutani
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRING SUBSTRATE, METHOD FOR MANUFACTURING WIRING SUBSTRATE, ELECTR...
- Publication number 20160233128
- Publication date Aug 11, 2016
- Fujitsu Limited
- Taiga Fukumori
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE MANUFACTURING METHOD AND SEMICONDUCTOR MOUNTIN...
- Publication number 20150216040
- Publication date Jul 30, 2015
- Fujitsu Limited
- Mamoru Kurashina
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRING BOARD, METHOD FOR FABRICATING THE SAME, AND ELECTRONIC APPAR...
- Publication number 20150189751
- Publication date Jul 2, 2015
- Fujitsu Limited
- Tomoyuki AKAHOSHI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SIMULATION METHOD AND SIMULATION APPARATUS
- Publication number 20140350901
- Publication date Nov 27, 2014
- Fujitsu Limited
- Hideaki Nagaoka
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
CIRCUIT BOARD AND ELECTRONIC DEVICE
- Publication number 20140293566
- Publication date Oct 2, 2014
- Fujitsu Limited
- Daisuke Mizutani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE MANUFACTURING METHOD AND SEMICONDUCTOR MOUNTIN...
- Publication number 20140264935
- Publication date Sep 18, 2014
- Fujitsu Limited
- Mamoru Kurashina
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CIRCUIT BOARD, SEMICONDUCTOR DEVICE, AND METHOD OF MANUFACTURING SE...
- Publication number 20140103097
- Publication date Apr 17, 2014
- Fujitsu Limited
- Masaharu FURUYAMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRING SUBSTRATE, METHOD FOR MANUFACTURING WIRING SUBSTRATE, ELECTR...
- Publication number 20140021609
- Publication date Jan 23, 2014
- Taiga Fukumori
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRIC CIRCUIT APPARATUS AND MANUFACTURING METHOD THEREFOR
- Publication number 20140022751
- Publication date Jan 23, 2014
- Fujitsu Limited
- Mamoru Kurashina
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ANALYSIS APPARATUS, ANALYSIS METHOD AND ANALYSIS PROGRAM
- Publication number 20110235673
- Publication date Sep 29, 2011
- Fujitsu Limited
- Daisuke Mizutani
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
MULTI-CHIP MODULE
- Publication number 20110089579
- Publication date Apr 21, 2011
- Fujitsu Limited
- Masateru KOIDE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20110084383
- Publication date Apr 14, 2011
- FUJITSU LIMITED
- Daisuke Mizutani
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
INTERCONNECT BOARD, PRINTED CIRCUIT BOARD UNIT, AND METHOD
- Publication number 20110080717
- Publication date Apr 7, 2011
- Fujitsu Limited
- Masateru Koide
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MULTI-CHIP MODULE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20110042806
- Publication date Feb 24, 2011
- Fujitsu Limited
- Masateru Koide
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTICHIP MODULE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20110044015
- Publication date Feb 24, 2011
- Fujitsu Limited
- Masateru KOIDE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ANALYZER, ANALYSIS METHOD, AND ANALYSIS PROGRAM PRODUCT
- Publication number 20090326883
- Publication date Dec 31, 2009
- Fujitsu Limited
- Daisuke Mizutani
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
CIRCUIT BOARD, SEMICONDUCTOR DEVICE, AND METHOD OF MANUFACTURING SE...
- Publication number 20090090543
- Publication date Apr 9, 2009
- Fujitsu Limited
- Masaharu FURUYAMA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Daisuke Mizutani

Person

Patents Grantslast 30 patents

Circuit board, method of manufacturing circuit board, and electroni...

Circuit board, method of manufacturing circuit board, and electroni...

Circuit board, method for manufacturing circuit board, and electron...

Wiring board, electronic device, and wiring board manufacturing method

Wiring board, electronic device, and wiring board manufacturing method

Capacitor built-in multilayer wiring substrate and manufacturing me...

Method of manufacturing board

Capacitor built-in multilayer wiring substrate and manufacturing me...

Simulation method and simulation apparatus

Wiring substrate, method for manufacturing wiring substrate, electr...

Circuit board and electronic device

Semiconductor device manufacturing method and semiconductor mountin...

Electric circuit apparatus and manufacturing method therefor

Semiconductor device manufacturing method and semiconductor mountin...

Semiconductor device and manufacturing method thereof

Circuit board, semiconductor device, and method of manufacturing se...

Multichip module and method for manufacturing the same

Electronic part and method of manufacturing the same

Multi-chip module

Structural analysis of a printed wiring substrate

Circuit board and method for manufacturing the same

Semiconductor device, connecting member, method for manufacturing a...

Multilayer wiring circuit board

Multilayer wiring circuit board

Head suspension for swing arm actuator

Composition of epoxy group-containing cycloolefin resin

Composition of epoxy group-containing cycloolefin resin

Pattern forming process

Composition of epoxy group-containing cycloolefin resin

Photosensitive polyimide resin composition

Patents Applicationslast 30 patents

CAPACITOR-EMBEDDED SUBSTRATE AND ELECTRONIC APPARATUS

CIRCUIT SUBSTRATE AND METHOD FOR FABRICATING CIRCUIT SUBSTRATE

CIRCUIT BOARD AND METHOD OF MANUFACTURING CIRCUIT BOARD

WIRING SUBSTRATE, SEMICONDUCTOR MODULE, AND MANUFACTURING METHOD FO...

CIRCUIT BOARD, METHOD OF MANUFACTURING CIRCUIT BOARD, AND ELECTRONI...

CAPACITOR BUILT-IN MULTILAYER WIRING SUBSTRATE AND MANUFACTURING ME...

CIRCUIT BOARD, METHOD OF MANUFACTURING CIRCUIT BOARD, AND ELECTRONI...

CIRCUIT BOARD, METHOD FOR MANUFACTURING CIRCUIT BOARD, AND ELECTRON...

CIRCUIT BOARD, METHOD OF MANUFACTURING CIRCUIT BOARD, AND ELECTRONI...

WIRING BOARD, ELECTRONIC DEVICE, AND WIRING BOARD MANUFACTURING METHOD

CAPACITOR BUILT-IN MULTILAYER WIRING SUBSTRATE AND MANUFACTURING ME...

BOARD AND METHOD OF MANUFACTURING BOARD

MULTILAYER CIRCUIT BOARD, SEMICONDUCTOR APPARATUS, AND METHOD OF MA...

WIRING SUBSTRATE, METHOD FOR MANUFACTURING WIRING SUBSTRATE, ELECTR...

SEMICONDUCTOR DEVICE MANUFACTURING METHOD AND SEMICONDUCTOR MOUNTIN...

WIRING BOARD, METHOD FOR FABRICATING THE SAME, AND ELECTRONIC APPAR...

SIMULATION METHOD AND SIMULATION APPARATUS

CIRCUIT BOARD AND ELECTRONIC DEVICE

SEMICONDUCTOR DEVICE MANUFACTURING METHOD AND SEMICONDUCTOR MOUNTIN...

CIRCUIT BOARD, SEMICONDUCTOR DEVICE, AND METHOD OF MANUFACTURING SE...

WIRING SUBSTRATE, METHOD FOR MANUFACTURING WIRING SUBSTRATE, ELECTR...

ELECTRIC CIRCUIT APPARATUS AND MANUFACTURING METHOD THEREFOR

ANALYSIS APPARATUS, ANALYSIS METHOD AND ANALYSIS PROGRAM

MULTI-CHIP MODULE

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

INTERCONNECT BOARD, PRINTED CIRCUIT BOARD UNIT, AND METHOD

MULTI-CHIP MODULE AND METHOD OF MANUFACTURING THE SAME

MULTICHIP MODULE AND METHOD FOR MANUFACTURING THE SAME

ANALYZER, ANALYSIS METHOD, AND ANALYSIS PROGRAM PRODUCT

CIRCUIT BOARD, SEMICONDUCTOR DEVICE, AND METHOD OF MANUFACTURING SE...