Daisuke Nakamata

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Nagano, JP

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Patents Grantslast 30 patents

Information Patent Grant
Method of resuming operation of wire saw
- Patent number 9,662,805
- Issue date May 30, 2017
- Shin-Etsu Handotai Co., Ltd.
- Atsuo Uchiyama
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Grant
Slicing method and method for manufacturing epitaxial wafer
- Patent number 8,210,906
- Issue date Jul 3, 2012
- Shin-Etsu Handotai Co., Ltd.
- Hiroshi Oishi
- B24 - GRINDING POLISHING
Information Patent Grant
Slicing method
- Patent number 8,167,681
- Issue date May 1, 2012
- Shin-Etsu Handotai Co., Ltd.
- Hiroshi Oishi
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Grant
Slicing method
- Patent number 7,988,530
- Issue date Aug 2, 2011
- Shin-Etsu Handotai Co., Ltd.
- Hiroshi Oishi
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Grant
Method for evaluating semiconductor wafer, apparatus for evaluating...
- Patent number 7,810,383
- Issue date Oct 12, 2010
- Shin-Etsu Handotai Co., Ltd.
- Keiichi Okabe
- B82 - NANO-TECHNOLOGY

Patents Applicationslast 30 patents

Information Patent Application
METHOD OF RESUMING OPERATION OF WIRE SAW
- Publication number 20150328800
- Publication date Nov 19, 2015
- Shin-Etsu Handotai Co., Ltd.
- Atsuo UCHIYAMA
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Application
Slicing method
- Publication number 20100037881
- Publication date Feb 18, 2010
- Shin-Etsu Handotai Co., Ltd.
- Hiroshi Oishi
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Application
Slicing method and method for manufacturing epitaxial wafer
- Publication number 20090288530
- Publication date Nov 26, 2009
- Shin-Etsu Handotai Co., Ltd.
- Hiroshi Oishi
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Application
Slicing Method
- Publication number 20090253352
- Publication date Oct 8, 2009
- Shin-Etsu Handotai Co., Ltd.
- Hiroshi Oishi
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Application
Method for Evaluating Semiconductor Wafer, Apparatus for Evaluating...
- Publication number 20080166823
- Publication date Jul 10, 2008
- Keiichi Okabe
- G01 - MEASURING TESTING