Daisuke OBA

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Patents Applicationslast 30 patents

Information Patent Application
EMBEDDING METHOD AND SUBSTRATE PROCESSING APPARATUS
- Publication number 20250171890
- Publication date May 29, 2025
- TOKYO ELECTRON LIMITED
- Isao GUNJI
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
METHOD FOR FORMING INSULATING FILM, AND SUBSTRATE PROCESSING SYSTEM
- Publication number 20250166990
- Publication date May 22, 2025
- Tokyo Electron Limited
- Daisuke OBA
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
INSULATING FILM FORMING METHOD AND SUBSTRATE PROCESSING SYSTEM
- Publication number 20240321571
- Publication date Sep 26, 2024
- TOKYO ELECTRON LIMITED
- Daisuke OBA
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
METHOD FOR FORMING SILICON-CONTAINING FILM AND FILM FORMING APPARATUS
- Publication number 20240087883
- Publication date Mar 14, 2024
- TOKYO ELECTRON LIMITED
- Nobuo MATSUKI
- H01 - BASIC ELECTRIC ELEMENTS