Daisuke Sakurai

Person

Toyonaka-shi, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device and methods of manufacturing semiconductor device
- Patent number 11,908,785
- Issue date Feb 20, 2024
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Takeru Tamari
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solid-state imaging apparatus including semiconductor element with...
- Patent number 11,810,927
- Issue date Nov 7, 2023
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Kiyokazu Itoi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solid-state imaging device having electronic components mounted bet...
- Patent number 11,381,767
- Issue date Jul 5, 2022
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Kiyokazu Itoi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing semiconductor device
- Patent number 10,790,250
- Issue date Sep 29, 2020
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Daisuke Sakurai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Optical module structure
- Patent number 10,365,446
- Issue date Jul 30, 2019
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Shozo Ochi
- G02 - OPTICS
Information Patent Grant
Mounting structure and manufacturing method for same
- Patent number 9,373,595
- Issue date Jun 21, 2016
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Daisuke Sakurai
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device manufacturing method and semiconductor device
- Patent number 9,331,042
- Issue date May 3, 2016
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Daisuke Sakurai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solder transfer substrate, manufacturing method of solder transfer...
- Patent number 9,238,278
- Issue date Jan 19, 2016
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Daisuke Sakurai
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Manufacturing method of solder transfer substrate, solder precoatin...
- Patent number 9,027,822
- Issue date May 12, 2015
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Daisuke Sakurai
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Mounting structure of electronic component with joining portions an...
- Patent number 8,922,011
- Issue date Dec 30, 2014
- Panasonic Corporation
- Takatoshi Osumi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic-component mounted body, electronic component, and circui...
- Patent number 8,921,708
- Issue date Dec 30, 2014
- Panasonic Corporation
- Daisuke Sakurai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Three-dimensional circuit board
- Patent number 8,809,693
- Issue date Aug 19, 2014
- Panasonic Corporation
- Daisuke Sakurai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device
- Patent number 8,742,584
- Issue date Jun 3, 2014
- Panasonic Corporation
- Daisuke Sakurai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Conductive bump, method for producing the same, and electronic comp...
- Patent number 8,575,751
- Issue date Nov 5, 2013
- Panasonic Corporation
- Daisuke Sakurai
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Semiconductor device and method for fabricating the same
- Patent number 8,450,848
- Issue date May 28, 2013
- Panasonic Corporation
- Daisuke Sakurai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and semiconductor device manufacturing method
- Patent number 8,367,539
- Issue date Feb 5, 2013
- Panasonic Corporation
- Daisuke Sakurai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three-dimensional circuit board and its manufacturing method
- Patent number 8,134,081
- Issue date Mar 13, 2012
- Panasonic Corporation
- Daisuke Sakurai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic component mounting structure and method for manufacturin...
- Patent number 8,120,188
- Issue date Feb 21, 2012
- Panasonic Corporation
- Daisuke Sakurai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of manufacturing an electronic part mounting structure
- Patent number 8,119,449
- Issue date Feb 21, 2012
- Panasonic Corporation
- Daisuke Sakurai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Noncontact information storage medium and method for manufacturing...
- Patent number 8,083,150
- Issue date Dec 27, 2011
- Panasonic Corporation
- Daisuke Sakurai
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Interconnect substrate and electronic circuit mounted structure
- Patent number 8,018,731
- Issue date Sep 13, 2011
- Panasonic Corporation
- Daisuke Sakurai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Conductive bump, method for manufacturing the conductive bump, semi...
- Patent number 7,928,566
- Issue date Apr 19, 2011
- Panasonic Corporation
- Yoshihiko Yagi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Card type information device and method for manufacturing same
- Patent number 7,775,446
- Issue date Aug 17, 2010
- Panasonic Corporation
- Shozo Ochi
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Electronic circuit device, electronic device using the same, and me...
- Patent number 7,768,795
- Issue date Aug 3, 2010
- Panasonic Corporation
- Daisuke Sakurai
- G11 - INFORMATION STORAGE
Information Patent Grant
High density multilayer circuit module
- Patent number 7,375,421
- Issue date May 20, 2008
- Matsushita Electric Industrial Co., Ltd.
- Daisuke Sakurai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit board fabrication method and circuit board
- Patent number 7,353,600
- Issue date Apr 8, 2008
- Matsushita Electric Industrial Co., Ltd.
- Norihito Tsukahara
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit board and method of manufacturing the same
- Patent number 7,297,876
- Issue date Nov 20, 2007
- Matsushita Electric Industrial Co., Ltd.
- Daisuke Sakurai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Interconnection substrate and fabrication method thereof
- Patent number 7,233,069
- Issue date Jun 19, 2007
- Matsushita Electric Industrial Co., Ltd.
- Norihito Tsukahara
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Connecting structure of circuit board and method for manufacturing...
- Patent number 7,229,293
- Issue date Jun 12, 2007
- Matsushita Electric Industrial Co., Ltd.
- Daisuke Sakurai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method and apparatus for manufacturing electronic component-mounted...
- Patent number 7,176,055
- Issue date Feb 13, 2007
- Matsushita Electric Industrial Co., Ltd.
- Norihito Tsukahara
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
FLIP-CHIP MOUNTING STRUCTURE AND FLIP-CHIP MOUNTING METHOD
- Publication number 20240387444
- Publication date Nov 21, 2024
- Panasonic Intellectual Property Management Co., Ltd.
- TAKAHIRO KUMAKAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BUMP MANUFACTURING METHOD AND IMPRINT DIE USED IN SAME
- Publication number 20240332234
- Publication date Oct 3, 2024
- Panasonic Intellectual Property Management Co., Ltd.
- KEIKO IKUTA
- B22 - CASTING POWDER METALLURGY
Information Patent Application
METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE
- Publication number 20230089483
- Publication date Mar 23, 2023
- Panasonic Intellectual Property Management Co., Ltd.
- KIYOKAZU ITOI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHODS OF MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20210366817
- Publication date Nov 25, 2021
- Panasonic Intellectual Property Management Co., Ltd.
- TAKERU TAMARI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR ELEMENT AND SOLID-STATE IMAGING APPARATUS
- Publication number 20210305293
- Publication date Sep 30, 2021
- Panasonic Intellectual Property Management Co., Ltd.
- KIYOKAZU ITOI
- G01 - MEASURING TESTING
Information Patent Application
SOLID-STATE IMAGING DEVICE
- Publication number 20200195867
- Publication date Jun 18, 2020
- Panasonic Intellectual Property Management Co., Ltd.
- KIYOKAZU ITOI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20190181110
- Publication date Jun 13, 2019
- Panasonic Intellectual Property Management Co., Ltd.
- Daisuke SAKURAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OPTICAL MODULE STRUCTURE
- Publication number 20190137708
- Publication date May 9, 2019
- Panasonic Intellectual Property Management Co., Ltd.
- Shozo OCHI
- G02 - OPTICS
Information Patent Application
SEMICONDUCTOR DEVICE MANUFACTURING METHOD AND SEMICONDUCTOR DEVICE
- Publication number 20140299986
- Publication date Oct 9, 2014
- Daisuke Sakurai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MOUNTING STRUCTURE AND MANUFACTURING METHOD FOR SAME
- Publication number 20140217595
- Publication date Aug 7, 2014
- PANASONIC CORPORATION
- Daisuke Sakurai
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SOLDER TRANSFER BASE, METHOD FOR PRODUCING SOLDER TRANSFER BASE, AN...
- Publication number 20140010991
- Publication date Jan 9, 2014
- PANASONIC CORPORATION
- Daisuke Sakurai
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
MOUNTING STRUCTURE OF ELECTRONIC COMPONENT AND METHOD OF MANUFACTUR...
- Publication number 20130307146
- Publication date Nov 21, 2013
- PANASONIC CORPORATION
- Takatoshi OSUMI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURING METHOD OF SOLDER TRANSFER SUBSTRATE, SOLDER PRECOATIN...
- Publication number 20130181041
- Publication date Jul 18, 2013
- PANASONIC CORPORATION
- Daisuke Sakurai
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC-COMPONENT MOUNTED BODY, ELECTRONIC COMPONENT, AND CIRCUI...
- Publication number 20130170165
- Publication date Jul 4, 2013
- PANASONIC CORPORATION
- Daisuke Sakurai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20120168961
- Publication date Jul 5, 2012
- PANASONIC CORPORATION
- Daisuke SAKURAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSIONAL CIRCUIT BOARD AND ITS MANUFACTURING METHOD
- Publication number 20120125676
- Publication date May 24, 2012
- PANASONIC CORPORATION
- Daisuke Sakurai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE MANUFACTURING METHOD
- Publication number 20110233767
- Publication date Sep 29, 2011
- PANASONIC CORPORATION
- Daisuke SAKURAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME
- Publication number 20100148362
- Publication date Jun 17, 2010
- Panasonic Corparation
- Daisuke SAKURAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC COMPONENT MOUNTING STRUCTURE AND METHOD FOR MANUFACTURIN...
- Publication number 20100052189
- Publication date Mar 4, 2010
- Daisuke Sakurai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CONDUCTIVE BUMP, METHOD FOR MANUFACTURING THE CONDUCTIVE BUMP, SEMI...
- Publication number 20100029044
- Publication date Feb 4, 2010
- Yoshihiko Yagi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONDUCTIVE BUMP, METHOD FOR PRODUCING THE SAME, AND ELECTRONIC COMP...
- Publication number 20090315178
- Publication date Dec 24, 2009
- Daisuke Sakurai
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Application
INTERCONNECT SUBSTRATE AND ELECTRONIC CIRCUIT MOUNTED STRUCTURE
- Publication number 20090268423
- Publication date Oct 29, 2009
- Daisuke Sakurai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
THREE-DIMENSIONAL CIRCUIT BOARD AND ITS MANUFACTURING METHOD
- Publication number 20090266582
- Publication date Oct 29, 2009
- Daisuke Sakurai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC COMPONENT MOUNTED STRUCTURE AND METHOD OF MANUFACTURING...
- Publication number 20090246474
- Publication date Oct 1, 2009
- Panasonic Corporation
- Daisuke Sakurai
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
CARD TYPE INFORMATION DEVICE AND METHOD FOR MANUFACTURING SAME
- Publication number 20090173795
- Publication date Jul 9, 2009
- Shozo Ochi
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Noncontact Information Storage Medium and Method for Manufacturing...
- Publication number 20090039168
- Publication date Feb 12, 2009
- Daisuke Sakurai
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
ELECTRONIC PART MOUNTING STRUCTURE AND ITS MANUFACTURING METHOD
- Publication number 20090026634
- Publication date Jan 29, 2009
- Daisuke Sakurai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Electronic Circuit Device, Electronic Device Using the Same, and Me...
- Publication number 20080094793
- Publication date Apr 24, 2008
- Daisuke Sakurai
- G11 - INFORMATION STORAGE
Information Patent Application
Method and apparatus for manufacturing electronic component-mounted...
- Publication number 20070200217
- Publication date Aug 30, 2007
- Norihito Tsukahara
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Connecting structure of circuit board and method for manufacturing...
- Publication number 20060014403
- Publication date Jan 19, 2006
- Daisuke Sakurai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Daisuke Sakurai

Person

Patents Grantslast 30 patents

Semiconductor device and methods of manufacturing semiconductor device

Solid-state imaging apparatus including semiconductor element with...

Solid-state imaging device having electronic components mounted bet...

Method for manufacturing semiconductor device

Optical module structure

Mounting structure and manufacturing method for same

Semiconductor device manufacturing method and semiconductor device

Solder transfer substrate, manufacturing method of solder transfer...

Manufacturing method of solder transfer substrate, solder precoatin...

Mounting structure of electronic component with joining portions an...

Electronic-component mounted body, electronic component, and circui...

Three-dimensional circuit board

Semiconductor device

Conductive bump, method for producing the same, and electronic comp...

Semiconductor device and method for fabricating the same

Semiconductor device and semiconductor device manufacturing method

Three-dimensional circuit board and its manufacturing method

Electronic component mounting structure and method for manufacturin...

Method of manufacturing an electronic part mounting structure

Noncontact information storage medium and method for manufacturing...

Interconnect substrate and electronic circuit mounted structure

Conductive bump, method for manufacturing the conductive bump, semi...

Card type information device and method for manufacturing same

Electronic circuit device, electronic device using the same, and me...

High density multilayer circuit module

Circuit board fabrication method and circuit board

Circuit board and method of manufacturing the same

Interconnection substrate and fabrication method thereof

Connecting structure of circuit board and method for manufacturing...

Method and apparatus for manufacturing electronic component-mounted...

Patents Applicationslast 30 patents

FLIP-CHIP MOUNTING STRUCTURE AND FLIP-CHIP MOUNTING METHOD

BUMP MANUFACTURING METHOD AND IMPRINT DIE USED IN SAME

METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE AND METHODS OF MANUFACTURING SEMICONDUCTOR DEVICE

SEMICONDUCTOR ELEMENT AND SOLID-STATE IMAGING APPARATUS

SOLID-STATE IMAGING DEVICE

METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE

OPTICAL MODULE STRUCTURE

SEMICONDUCTOR DEVICE MANUFACTURING METHOD AND SEMICONDUCTOR DEVICE

MOUNTING STRUCTURE AND MANUFACTURING METHOD FOR SAME

SOLDER TRANSFER BASE, METHOD FOR PRODUCING SOLDER TRANSFER BASE, AN...

MOUNTING STRUCTURE OF ELECTRONIC COMPONENT AND METHOD OF MANUFACTUR...

MANUFACTURING METHOD OF SOLDER TRANSFER SUBSTRATE, SOLDER PRECOATIN...

ELECTRONIC-COMPONENT MOUNTED BODY, ELECTRONIC COMPONENT, AND CIRCUI...

SEMICONDUCTOR DEVICE

THREE-DIMENSIONAL CIRCUIT BOARD AND ITS MANUFACTURING METHOD

SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE MANUFACTURING METHOD

SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME

ELECTRONIC COMPONENT MOUNTING STRUCTURE AND METHOD FOR MANUFACTURIN...

CONDUCTIVE BUMP, METHOD FOR MANUFACTURING THE CONDUCTIVE BUMP, SEMI...

CONDUCTIVE BUMP, METHOD FOR PRODUCING THE SAME, AND ELECTRONIC COMP...

INTERCONNECT SUBSTRATE AND ELECTRONIC CIRCUIT MOUNTED STRUCTURE

THREE-DIMENSIONAL CIRCUIT BOARD AND ITS MANUFACTURING METHOD

ELECTRONIC COMPONENT MOUNTED STRUCTURE AND METHOD OF MANUFACTURING...

CARD TYPE INFORMATION DEVICE AND METHOD FOR MANUFACTURING SAME

Noncontact Information Storage Medium and Method for Manufacturing...

ELECTRONIC PART MOUNTING STRUCTURE AND ITS MANUFACTURING METHOD

Electronic Circuit Device, Electronic Device Using the Same, and Me...

Method and apparatus for manufacturing electronic component-mounted...

Connecting structure of circuit board and method for manufacturing...