DAISUKE SHIMIZU

Person

Milpitas, CA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Methods and apparatus for in-situ protection liners for high aspect...
- Patent number 11,373,877
- Issue date Jun 28, 2022
- Applied Materials, Inc.
- Daisuke Shimizu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods and apparatus for etching semiconductor structures
- Patent number 11,164,723
- Issue date Nov 2, 2021
- Applied Materials, Inc.
- Daisuke Shimizu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods and apparatus for etching semiconductor structures
- Patent number 10,930,471
- Issue date Feb 23, 2021
- Applied Materials, Inc.
- Daisuke Shimizu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Radio frequency (RF) pulsing impedance tuning with multiplier mode
- Patent number 10,854,427
- Issue date Dec 1, 2020
- Applied Materials, Inc.
- Katsumasa Kawasaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Silicon dioxide-polysilicon multi-layered stack etching with plasma...
- Patent number 10,643,854
- Issue date May 5, 2020
- Applied Materials, Inc.
- Daisuke Shimizu
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Methods and apparatus for etching semiconductor structures
- Patent number 10,593,518
- Issue date Mar 17, 2020
- Applied Materials, Inc.
- Daisuke Shimizu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Using bias RF pulsing to effectively clean electrostatic chuck (ESC)
- Patent number 10,410,845
- Issue date Sep 10, 2019
- Applied Materials, Inc.
- Kenny Linh Doan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Smart multi-level RF pulsing methods
- Patent number 9,872,373
- Issue date Jan 16, 2018
- Applied Materials, Inc.
- Daisuke Shimizu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
RF power delivery with approximated saw tooth wave pulsing
- Patent number 9,788,405
- Issue date Oct 10, 2017
- Applied Materials, Inc.
- Katsumasa Kawasaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Etching oxide-nitride stacks using C4F6H2
- Patent number 9,748,366
- Issue date Aug 29, 2017
- Applied Materials, Inc.
- Jong Mun Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Maintaining mask integrity to form openings in wafers
- Patent number 9,589,832
- Issue date Mar 7, 2017
- Applied Materials, Inc.
- Daisuke Shimizu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Silicon dioxide-polysilicon multi-layered stack etching with plasma...
- Patent number 9,299,574
- Issue date Mar 29, 2016
- Applied Materials, Inc.
- Daisuke Shimizu
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Methods for etching materials using synchronized RF pulses
- Patent number 9,269,587
- Issue date Feb 23, 2016
- Applied Materials, Inc.
- Daisuke Shimizu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Boron-doped carbon-based hardmask etch processing
- Patent number 9,129,911
- Issue date Sep 8, 2015
- Applied Materials, Inc.
- Kenny Linh Doan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Maintaining mask integrity to form openings in wafers
- Patent number 8,603,921
- Issue date Dec 10, 2013
- Applied Materials, Inc.
- Daisuke Shimizu
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
METHOD AND APPARATUS FOR ETCHING A SEMICONDUCTOR SUBSTRATE IN A PLA...
- Publication number 20230402286
- Publication date Dec 14, 2023
- Applied Materials, Inc.
- Daisuke SHIMIZU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PLASMA CHAMBER WITH A MULTIPHASE ROTATING CROSS-FLOW WITH UNIFORMIT...
- Publication number 20230057145
- Publication date Feb 23, 2023
- Applied Materials, Inc.
- DAISUKE SHIMIZU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PLASMA CHAMBER WITH MULTIPHASE ROTATING INDEPENDENT GAS CROSS-FLOW...
- Publication number 20220084795
- Publication date Mar 17, 2022
- Applied Materials, Inc.
- Kenneth S. Collins
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS AND APPARATUS FOR IN-SITU PROTECTION LINERS FOR HIGH ASPECT...
- Publication number 20210320012
- Publication date Oct 14, 2021
- Applied Materials, Inc.
- Daisuke SHIMIZU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS AND APPARATUS FOR ETCHING SEMICONDUCTOR STRUCTURES
- Publication number 20210142987
- Publication date May 13, 2021
- Applied Materials, Inc.
- DAISUKE SHIMIZU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTIZONE FLOW DISTRIBUTION SYSTEM
- Publication number 20200312680
- Publication date Oct 1, 2020
- Applied Materials Inc.
- DAISUKE SHIMIZU
- F16 - ENGINEERING ELEMENTS AND UNITS GENERAL MEASURES FOR PRODUCING AND MAINT...
Information Patent Application
METHODS AND APPARATUS FOR ETCHING SEMICONDUCTOR STRUCTURES
- Publication number 20200294771
- Publication date Sep 17, 2020
- Applied Materials, Inc.
- DAISUKE SHIMIZU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEMS AND METHODS FOR ETCHING OXIDE NITRIDE STACKS
- Publication number 20190362983
- Publication date Nov 28, 2019
- Applied Materials, Inc.
- Daisuke SHIMIZU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RF POWER DELIVERY WITH APPROXIMATED SAW TOOTH WAVE PULSING
- Publication number 20170099722
- Publication date Apr 6, 2017
- Applied Materials, Inc.
- KATSUMASA KAWASAKI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SILICON DIOXIDE-POLYSILICON MULTI-LAYERED STACK ETCHING WITH PLASMA...
- Publication number 20160086771
- Publication date Mar 24, 2016
- Daisuke Shimizu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ETCHING OXIDE-NITRIDE STACKS USING C4F6H2
- Publication number 20150097276
- Publication date Apr 9, 2015
- Applied Materials, Inc.
- Jong Mun Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS FOR ETCHING MATERIALS USING SYNCHRONIZED RF PULSES
- Publication number 20150072530
- Publication date Mar 12, 2015
- Applied Materials, Inc.
- Jong Mun KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ETCH PROCESS HAVING ADAPTIVE CONTROL WITH ETCH DEPTH OF PRESSURE AN...
- Publication number 20140342570
- Publication date Nov 20, 2014
- Applied Materials, Inc.
- Kenny Linh Doan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BORON-DOPED CARBON-BASED HARDMASK ETCH PROCESSING
- Publication number 20140213059
- Publication date Jul 31, 2014
- Kenny Linh Doan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SILICON DIOXIDE-POLYSILICON MULTI-LAYERED STACK ETCHING WITH PLASMA...
- Publication number 20140213062
- Publication date Jul 31, 2014
- Daisuke SHIMIZU
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MAINTAINING MASK INTEGRITY TO FORM OPENINGS IN WAFERS
- Publication number 20140065824
- Publication date Mar 6, 2014
- Daisuke Shimizu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF POLYMERS DEPOSITION FOR FORMING REDUCED CRITICAL DIMENSIONS
- Publication number 20130122707
- Publication date May 16, 2013
- Daisuke Shimizu
- B05 - SPRAYING OR ATOMISING IN GENERAL APPLYING LIQUIDS OR OTHER FLUENT MATER...
Information Patent Application
MAINTAINING MASK INTEGRITY TO FORM OPENINGS IN WAFERS
- Publication number 20130029484
- Publication date Jan 31, 2013
- Daisuke Shimizu
- H01 - BASIC ELECTRIC ELEMENTS

DAISUKE SHIMIZU

Person

Patents Grantslast 30 patents

Methods and apparatus for in-situ protection liners for high aspect...

Methods and apparatus for etching semiconductor structures

Methods and apparatus for etching semiconductor structures

Radio frequency (RF) pulsing impedance tuning with multiplier mode

Silicon dioxide-polysilicon multi-layered stack etching with plasma...

Methods and apparatus for etching semiconductor structures

Using bias RF pulsing to effectively clean electrostatic chuck (ESC)

Smart multi-level RF pulsing methods

RF power delivery with approximated saw tooth wave pulsing

Etching oxide-nitride stacks using C4F6H2

Maintaining mask integrity to form openings in wafers

Silicon dioxide-polysilicon multi-layered stack etching with plasma...

Methods for etching materials using synchronized RF pulses

Boron-doped carbon-based hardmask etch processing

Maintaining mask integrity to form openings in wafers

Patents Applicationslast 30 patents

METHOD AND APPARATUS FOR ETCHING A SEMICONDUCTOR SUBSTRATE IN A PLA...

PLASMA CHAMBER WITH A MULTIPHASE ROTATING CROSS-FLOW WITH UNIFORMIT...

PLASMA CHAMBER WITH MULTIPHASE ROTATING INDEPENDENT GAS CROSS-FLOW...

METHODS AND APPARATUS FOR IN-SITU PROTECTION LINERS FOR HIGH ASPECT...

METHODS AND APPARATUS FOR ETCHING SEMICONDUCTOR STRUCTURES

MULTIZONE FLOW DISTRIBUTION SYSTEM

METHODS AND APPARATUS FOR ETCHING SEMICONDUCTOR STRUCTURES

SYSTEMS AND METHODS FOR ETCHING OXIDE NITRIDE STACKS

RF POWER DELIVERY WITH APPROXIMATED SAW TOOTH WAVE PULSING

SILICON DIOXIDE-POLYSILICON MULTI-LAYERED STACK ETCHING WITH PLASMA...

ETCHING OXIDE-NITRIDE STACKS USING C4F6H2

METHODS FOR ETCHING MATERIALS USING SYNCHRONIZED RF PULSES

ETCH PROCESS HAVING ADAPTIVE CONTROL WITH ETCH DEPTH OF PRESSURE AN...

BORON-DOPED CARBON-BASED HARDMASK ETCH PROCESSING

SILICON DIOXIDE-POLYSILICON MULTI-LAYERED STACK ETCHING WITH PLASMA...

MAINTAINING MASK INTEGRITY TO FORM OPENINGS IN WAFERS

METHODS OF POLYMERS DEPOSITION FOR FORMING REDUCED CRITICAL DIMENSIONS

MAINTAINING MASK INTEGRITY TO FORM OPENINGS IN WAFERS