Daisuke Soma

Person

Tokyo, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Cu ball, Osp-treated Cu ball, Cu core ball, solder joint, solder pa...
- Patent number 11,185,950
- Issue date Nov 30, 2021
- Senju Metal Industry Co., Ltd.
- Hiroyoshi Kawasaki
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Cu core ball, solder joint, solder paste and formed solder
- Patent number 10,888,959
- Issue date Jan 12, 2021
- Senju Metal Industry Co., Ltd.
- Hiroyoshi Kawasaki
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Cu column, Cu core column, solder joint, and through-silicon via
- Patent number 10,811,376
- Issue date Oct 20, 2020
- Senju Metal Industry Co., Ltd.
- Hiroyoshi Kawasaki
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Solder material, solder paste, solder preform, solder joint and met...
- Patent number 10,717,157
- Issue date Jul 21, 2020
- Senju Metal Industry Co., Ltd.
- Takahiro Hattori
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Joining member, solder material, solder paste, formed solder, flux...
- Patent number 10,675,719
- Issue date Jun 9, 2020
- Senju Metal Industry Co., Ltd.
- Hiroyoshi Kawasaki
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Cu core ball, solder joint, solder paste and formed solder
- Patent number 10,639,749
- Issue date May 5, 2020
- Senju Metal Industry Co., Ltd.
- Hiroyoshi Kawasaki
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Flux composition for solder applications
- Patent number 10,610,979
- Issue date Apr 7, 2020
- Senju Metal Industry Co., Ltd.
- Daisuke Maruko
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Core material, semiconductor package, and forming method of bump el...
- Patent number 10,381,319
- Issue date Aug 13, 2019
- Senju Metal Industry Co., Ltd.
- Tomoaki Nishino
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Method of manufacturing cu core ball
- Patent number 10,370,771
- Issue date Aug 6, 2019
- Senju Metal Industry Co., Ltd.
- Hiroyoshi Kawasaki
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Cu core ball, solder paste, formed solder, Cu core column, and sold...
- Patent number 10,322,472
- Issue date Jun 18, 2019
- Senju Metal Industry Co., Ltd.
- Takahiro Hattori
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Solder material, solder joint, and method of manufacturing the sold...
- Patent number 10,173,287
- Issue date Jan 8, 2019
- Senju Metal Industry Co., Ltd.
- Hiroyoshi Kawasaki
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Method for producing metal ball, joining material, and metal ball
- Patent number 10,150,185
- Issue date Dec 11, 2018
- Senju Metal Industry Co., Ltd.
- Hiroyoshi Kawasaki
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Cu core ball
- Patent number 10,147,695
- Issue date Dec 4, 2018
- Senju Metal Industry Co., Ltd.
- Hiroyoshi Kawasaki
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Cu ball, Cu core ball, solder joint, solder paste, and solder foam
- Patent number 10,137,535
- Issue date Nov 27, 2018
- Senju Metal Industry Co., Ltd.
- Hiroyoshi Kawasaki
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Ni ball, Ni core ball, solder joint, solder paste, and solder foam
- Patent number 9,802,251
- Issue date Oct 31, 2017
- Senju Metal Industry Co., Ltd.
- Hiroyoshi Kawasaki
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Cu ball
- Patent number 9,668,358
- Issue date May 30, 2017
- Senju Metal Industry Co., Ltd.
- Hiroyoshi Kawasaki
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Bump electrode, board which has bump electrodes, and method for man...
- Patent number 9,662,730
- Issue date May 30, 2017
- Senju Metal Industry Co., Ltd.
- Takahiro Hattori
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Core ball, solder paste, formed-solder, flux-coated core ball and s...
- Patent number 9,278,409
- Issue date Mar 8, 2016
- Senju Metal Industry Co., Ltd.
- Hiroyoshi Kawasaki
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Ag ball, ag core ball, flux-coated ag ball, flux-coated ag core bal...
- Patent number 9,266,196
- Issue date Feb 23, 2016
- Senju Metal Industry Co., Ltd.
- Takashi Akagawa
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of soldering portions plated by electroless Ni plating
- Patent number 8,887,980
- Issue date Nov 18, 2014
- Senju Metal Industry Co., Ltd.
- Ryoichi Kurata
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Lead-free solder alloy
- Patent number 8,691,143
- Issue date Apr 8, 2014
- Senju Metal Industry Co., Ltd.
- Tsukasa Ohnishi
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Solder for use on surfaces coated with nickel by electroless plating
- Patent number 7,132,020
- Issue date Nov 7, 2006
- Senju Metal Industry Co., Ltd.
- Iwao Nozawa
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
SOLDER MATERIAL, SOLDER PASTE, AND SOLDER JOINT
- Publication number 20200376607
- Publication date Dec 3, 2020
- SENJU METAL INDUSTRY CO., LTD.,
- Hiroyoshi Kawasaki
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Cu Ball, Osp-Treated Cu Ball, Cu Core Ball, Solder Joint, Solder Pa...
- Publication number 20200298349
- Publication date Sep 24, 2020
- SENJU METAL INDUSTRY CO., LTD.
- Hiroyoshi Kawasaki
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SOLDER MATERIAL, SOLDER PASTE, FORMED SOLDER AND SOLDER JOINT
- Publication number 20200061757
- Publication date Feb 27, 2020
- SENJU METAL INDUSTRY CO., LTD.
- Tomoaki NISHINO
- B22 - CASTING POWDER METALLURGY
Information Patent Application
Cu Core Ball, Solder Joint, Solder Paste and Formed Solder
- Publication number 20190375054
- Publication date Dec 12, 2019
- SENJU METAL INDUSTRY CO., LTD.
- Hiroyoshi Kawasaki
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Cu Core Ball, Solder Joint, Solder Paste and Formed Solder
- Publication number 20190376161
- Publication date Dec 12, 2019
- SENJU METAL INDUSTRY CO., LTD.
- Hiroyoshi Kawasaki
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Cu Core Ball, Solder Joint, Solder Paste and Formed Solder
- Publication number 20190375053
- Publication date Dec 12, 2019
- SENJU METAL INDUSTRY CO., LTD.
- Hiroyoshi Kawasaki
- B22 - CASTING POWDER METALLURGY
Information Patent Application
Flux
- Publication number 20180339375
- Publication date Nov 29, 2018
- SENJU METAL INDUSTRY CO., LTD.
- Daisuke Maruko
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Core Material, Semiconductor Package, and Forming Method of Bump El...
- Publication number 20180174991
- Publication date Jun 21, 2018
- SENJU METAL INDUSTRY CO., LTD.
- Tomoaki Nishino
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
Joining Member, Solder Material, Solder Paste, Formed Solder, Flux...
- Publication number 20180015572
- Publication date Jan 18, 2018
- SENJU METAL INDUSTRY CO., LTD.
- Hiroyoshi Kawasaki
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
Solder Material, Solder Paste, Solder Preform, Solder Joint and Met...
- Publication number 20170312860
- Publication date Nov 2, 2017
- SENJU METAL INDUSTRY CO., LTD.
- Takahiro Hattori
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Cu Column, Cu Core Column, Solder Joint, and Through-Silicon Via
- Publication number 20170287862
- Publication date Oct 5, 2017
- SENJU METAL INDUSTRY CO., LTD.
- Hiroyoshi Kawasaki
- B32 - LAYERED PRODUCTS
Information Patent Application
Solder Material, Solder Joint, and Method of Manufacturing the Sold...
- Publication number 20170252871
- Publication date Sep 7, 2017
- SENJU METAL INDUSTRY CO., LTD.
- Hiroyoshi Kawasaki
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
Cu Ball, Cu Core Ball, Solder Joint, Solder Paste, and Solder Foam
- Publication number 20170246711
- Publication date Aug 31, 2017
- SENJU METAL INDUSTRY CO., LTD.
- Hiroyoshi Kawasaki
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
Cu CORE BALL, SOLDER PASTE AND SOLDER JOINT
- Publication number 20170233884
- Publication date Aug 17, 2017
- SENJU METAL INDUSTRY CO., LTD.
- Hiroyoshi KAWASAKI
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Method for Producing Metal Ball, Joining Material, and Metal Ball
- Publication number 20170182600
- Publication date Jun 29, 2017
- SENJU METAL INDUSTRY CO., LTD.
- Hiroyoshi Kawasaki
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
Ni Ball, Ni Core Ball, Solder Joint, Solder Paste, and Solder Foam
- Publication number 20170080491
- Publication date Mar 23, 2017
- SENJU METAL INDUSTRY CO., LTD.
- Hiroyoshi Kawasaki
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
Cu Core Ball, Solder Paste, Formed Solder, Cu Core Column, and Sold...
- Publication number 20160368105
- Publication date Dec 22, 2016
- SENJU METAL INDUSTRY CO., LTD
- Takahiro Hattori
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
Cu Core Ball
- Publication number 20160148885
- Publication date May 26, 2016
- SENJU METAL INDUSTRY CO., LTD
- Hiroyoshi Kawasaki
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
Cu BALL
- Publication number 20150336216
- Publication date Nov 26, 2015
- Senju Metal lndustry Co., Ltd.
- Takahiro HATTORI
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
Cu BALL
- Publication number 20150313025
- Publication date Oct 29, 2015
- SENJU METAL INDUSTRY CO., LTD.
- Hiroyoshi KAWASAKI
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
Ag BALL, Ag CORE BALL, FLUX-COATED Ag BALL, FLUX-COATED Ag CORE BAL...
- Publication number 20150217409
- Publication date Aug 6, 2015
- Senju Metal lndustry Co., Ltd.
- Takashi AKAGAWA
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
CORE BALL, SOLDER PASTE, FORMED-SOLDER, FLUX-COATED CORE BALL AND S...
- Publication number 20150217408
- Publication date Aug 6, 2015
- Senju Metal lndustry Co., Ltd.
- Hiroyoshi KAWASAKI
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
Cu CORE BALL, SOLDER PASTE AND SOLDER JOINT
- Publication number 20150209912
- Publication date Jul 30, 2015
- Senju Metal lndustry Co., Ltd.
- Hiroyoshi KAWASAKI
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
Bump Electrode, Board Which Has Bump Electrodes, and Method for Man...
- Publication number 20150061129
- Publication date Mar 5, 2015
- SENJU METAL INDUSTRY CO., LTD.
- Takahiro Hattori
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Lead-free solder alloy
- Publication number 20090232696
- Publication date Sep 17, 2009
- Tsukasa Ohnishi
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method of soldering portions plated by electroless ni plating
- Publication number 20090218387
- Publication date Sep 3, 2009
- Ryoichi Kurata
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Solder for use on surfaces coated with nickel by electroless plating
- Publication number 20040126269
- Publication date Jul 1, 2004
- Iwao Nozawa
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Image recording and replaying apparatus
- Publication number 20030175010
- Publication date Sep 18, 2003
- Alps Electric Co., Ltd.
- Kenji Nomura
- H04 - ELECTRIC COMMUNICATION TECHNIQUE

Daisuke Soma

Person

Patents Grantslast 30 patents

Cu ball, Osp-treated Cu ball, Cu core ball, solder joint, solder pa...

Cu core ball, solder joint, solder paste and formed solder

Cu column, Cu core column, solder joint, and through-silicon via

Solder material, solder paste, solder preform, solder joint and met...

Joining member, solder material, solder paste, formed solder, flux...

Cu core ball, solder joint, solder paste and formed solder

Flux composition for solder applications

Core material, semiconductor package, and forming method of bump el...

Method of manufacturing cu core ball

Cu core ball, solder paste, formed solder, Cu core column, and sold...

Solder material, solder joint, and method of manufacturing the sold...

Method for producing metal ball, joining material, and metal ball

Cu core ball

Cu ball, Cu core ball, solder joint, solder paste, and solder foam

Ni ball, Ni core ball, solder joint, solder paste, and solder foam

Cu ball

Bump electrode, board which has bump electrodes, and method for man...

Core ball, solder paste, formed-solder, flux-coated core ball and s...

Ag ball, ag core ball, flux-coated ag ball, flux-coated ag core bal...

Method of soldering portions plated by electroless Ni plating

Lead-free solder alloy

Solder for use on surfaces coated with nickel by electroless plating

Patents Applicationslast 30 patents

SOLDER MATERIAL, SOLDER PASTE, AND SOLDER JOINT

Cu Ball, Osp-Treated Cu Ball, Cu Core Ball, Solder Joint, Solder Pa...

SOLDER MATERIAL, SOLDER PASTE, FORMED SOLDER AND SOLDER JOINT

Cu Core Ball, Solder Joint, Solder Paste and Formed Solder

Cu Core Ball, Solder Joint, Solder Paste and Formed Solder

Cu Core Ball, Solder Joint, Solder Paste and Formed Solder

Flux

Core Material, Semiconductor Package, and Forming Method of Bump El...

Joining Member, Solder Material, Solder Paste, Formed Solder, Flux...

Solder Material, Solder Paste, Solder Preform, Solder Joint and Met...

Cu Column, Cu Core Column, Solder Joint, and Through-Silicon Via

Solder Material, Solder Joint, and Method of Manufacturing the Sold...

Cu Ball, Cu Core Ball, Solder Joint, Solder Paste, and Solder Foam

Cu CORE BALL, SOLDER PASTE AND SOLDER JOINT

Method for Producing Metal Ball, Joining Material, and Metal Ball

Ni Ball, Ni Core Ball, Solder Joint, Solder Paste, and Solder Foam

Cu Core Ball, Solder Paste, Formed Solder, Cu Core Column, and Sold...

Cu Core Ball

Cu BALL

Cu BALL

Ag BALL, Ag CORE BALL, FLUX-COATED Ag BALL, FLUX-COATED Ag CORE BAL...

CORE BALL, SOLDER PASTE, FORMED-SOLDER, FLUX-COATED CORE BALL AND S...

Cu CORE BALL, SOLDER PASTE AND SOLDER JOINT

Bump Electrode, Board Which Has Bump Electrodes, and Method for Man...

Lead-free solder alloy

Method of soldering portions plated by electroless ni plating

Solder for use on surfaces coated with nickel by electroless plating

Image recording and replaying apparatus