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Daisuke Souma
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Haga-gun, JP
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Patents Grants
last 30 patents
Information
Patent Grant
Core material, electronic component and method for forming bump ele...
Patent number
11,872,656
Issue date
Jan 16, 2024
Senju Metal Industry Co., Ltd.
Shigeki Kondoh
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Core material, electronic component and method for forming bump ele...
Patent number
11,495,566
Issue date
Nov 8, 2022
Senju Metal Industry Co., Ltd.
Shigeki Kondoh
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method for forming bump electrode substrate
Patent number
11,478,869
Issue date
Oct 25, 2022
Senju Metal Industry Co., Ltd.
Takahiro Hattori
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Storing package unit and a storing method for micro solder spheres
Patent number
8,434,614
Issue date
May 7, 2013
Senju Metal Industry Co., Ltd.
Isamu Sato
B65 - CONVEYING PACKING STORING HANDLING THIN OR FILAMENTARY MATERIAL
Information
Patent Grant
Lead-free solder ball
Patent number
7,750,475
Issue date
Jul 6, 2010
Senju Metal Industry Co., Ltd.
Daisuke Souma
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Lead-free solder
Patent number
7,282,175
Issue date
Oct 16, 2007
Senju Metal Industry Co., Ltd.
Masazumi Amagai
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Patents Applications
last 30 patents
Information
Patent Application
CORE MATERIAL, ELECTRONIC COMPONENT AND METHOD FOR FORMING BUMP ELE...
Publication number
20240100635
Publication date
Mar 28, 2024
SENJU METAL INDUSTRY CO., LTD.
Shigeki Kondoh
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Application
CORE MATERIAL, ELECTRONIC COMPONENT AND METHOD FOR FORMING BUMP ELE...
Publication number
20220212294
Publication date
Jul 7, 2022
SENJU METAL INDUSTRY CO., LTD.
Shigeki KONDOH
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Application
CORE MATERIAL, ELECTRONIC COMPONENT AND METHOD FOR FORMING BUMP ELE...
Publication number
20220077093
Publication date
Mar 10, 2022
SENJU METAL INDUSTRY CO., LTD.
Shigeki KONDOH
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHOD FOR FORMING BUMP ELECTRODE SUBSTRATE
Publication number
20210387276
Publication date
Dec 16, 2021
SENJU METAL INDUSTRY CO., LTD.
Takahiro HATTORI
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Application
STORING PACKAGE UNIT AND A STORING METHOD FOR MICRO SOLDER SPHERES
Publication number
20110198253
Publication date
Aug 18, 2011
Isamu Sato
B65 - CONVEYING PACKING STORING HANDLING THIN OR FILAMENTARY MATERIAL
Information
Patent Application
Lead-free solder ball
Publication number
20070069379
Publication date
Mar 29, 2007
Daisuke Souma
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Application
Lead-free solder
Publication number
20040262779
Publication date
Dec 30, 2004
Masazumi Amagai
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR