Daisuke TANI

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Patents Grantslast 30 patents

Information Patent Grant
Bonding apparatus
- Patent number 9,385,104
- Issue date Jul 5, 2016
- Shinkawa Ltd.
- Daisuke Tani
- B32 - LAYERED PRODUCTS

Patents Applicationslast 30 patents

Information Patent Application
MANUFACTURING APPARATUS AND MANUFACTURING METHOD OF SEMICONDUCTOR D...
- Publication number 20230230853
- Publication date Jul 20, 2023
- SHINKAWA LTD.
- Daisuke TANI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING APPARATUS AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20150087083
- Publication date Mar 26, 2015
- SHINKAWA LTD.
- Daisuke TANI
- B32 - LAYERED PRODUCTS