Daisuke Urayama

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Kurokawa-gun, JP

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Patents Grantslast 30 patents

Information Patent Grant
Substrate processing apparatus and substrate processing method
- Patent number 10,923,329
- Issue date Feb 16, 2021
- Tokyo Electron Limited
- Eiichi Nishimura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for etching copper layer
- Patent number 10,825,688
- Issue date Nov 3, 2020
- Tokyo Electron Limited
- Shigeru Tahara
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Plasma processing method and plasma processing apparatus
- Patent number 9,660,182
- Issue date May 23, 2017
- Tokyo Electron Limited
- Takashi Sone
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD
- Publication number 20200111646
- Publication date Apr 9, 2020
- TOKYO ELECTRON LIMITED
- Eiichi Nishimura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR ETCHING COPPER LAYER
- Publication number 20190272997
- Publication date Sep 5, 2019
- TOKYO ELECTRON LIMITED
- Shigeru TAHARA
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD
- Publication number 20150132970
- Publication date May 14, 2015
- TOKYO ELECTRON LIMITED
- Eiichi Nishimura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PLASMA PROCESSING METHOD AND PLASMA PROCESSING APPARATUS
- Publication number 20150050750
- Publication date Feb 19, 2015
- TOKYO ELECTRON LIMITED
- Takashi Sone
- H01 - BASIC ELECTRIC ELEMENTS