Dale Arnold

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Meridian, ID, US

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Patents Grantslast 30 patents

Information Patent Grant
Solder bond site including an opening with discontinuous profile
- Patent number 10,847,382
- Issue date Nov 24, 2020
- Micron Technology, Inc.
- Jaspreet S. Gandhi
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Solder bond site including an opening with discontinuous profile
- Patent number 10,410,882
- Issue date Sep 10, 2019
- Micron Technology, Inc.
- Jaspreet S. Gandhi
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Solder bond site including an opening with discontinuous profile
- Patent number 9,881,858
- Issue date Jan 30, 2018
- Micron Technology, Inc.
- Jaspreet Gandhi
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
BOND WIRE INDUCTION APPARATUS
- Publication number 20240371914
- Publication date Nov 7, 2024
- Micron Technology, Inc.
- Carlos Franco
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOLDER BOND SITE INCLUDING AN OPENING WITH DISCONTINUOUS PROFILE
- Publication number 20190393050
- Publication date Dec 26, 2019
- Micron Technology, Inc.
- Jaspreet S. Gandhi
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
SOLDER BOND SITE INCLUDING AN OPENING WITH DISCONTINUOUS PROFILE
- Publication number 20190074194
- Publication date Mar 7, 2019
- Micron Technology, Inc.
- Jaspreet S. Gandhi
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
SOLDER BOND SITE INCLUDING AN OPENING WITH DISCONTINOUS PROFILE
- Publication number 20170018489
- Publication date Jan 19, 2017
- Micron Technology, Inc.
- Jaspreet Gandhi
- H01 - BASIC ELECTRIC ELEMENTS