Dale Hackitt

Person

Mesa, AZ, US

People

Patents Grantslast 30 patents

Information Patent Grant
Ultra slim RF package for ultrabooks and smart phones
- Patent number 8,890,628
- Issue date Nov 18, 2014
- Intel Corporation
- Vijay K. Nair
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Microelectronic package having solder-filled through-vias
- Patent number 7,638,867
- Issue date Dec 29, 2009
- Intel Corporation
- Dingying Xu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic package having a stiffening element and method of m...
- Patent number 7,372,133
- Issue date May 13, 2008
- Intel Corporation
- Saeed Shojaie
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bottom heat spreader
- Patent number 7,190,068
- Issue date Mar 13, 2007
- Intel Corporation
- Dale Hackitt
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Use of direct gold surface finish on a copper wire-bond substrate,...
- Patent number 6,972,152
- Issue date Dec 6, 2005
- Intel Corporation
- Brian Taggert
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Slotted thermal dissipater for a semiconductor package
- Patent number 5,489,805
- Issue date Feb 6, 1996
- Intel Corporation
- Dale Hackitt
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
ULTRA SLIM RF PACKAGE FOR ULTRABOOKS AND SMART PHONES
- Publication number 20140062607
- Publication date Mar 6, 2014
- Vijay K. Nair
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Microelectronic package having solder-filled through-vias
- Publication number 20070278635
- Publication date Dec 6, 2007
- Dingying Xu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Backside via formation prior to die attachment
- Publication number 20070275540
- Publication date Nov 29, 2007
- Dale A. Hackitt
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Microelectronic package having a stiffening element and method of m...
- Publication number 20070126094
- Publication date Jun 7, 2007
- Intel Corporation
- Saeed Shojaie
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Use of direct gold surface finish on a copper wire-bond substrate,...
- Publication number 20060012042
- Publication date Jan 19, 2006
- Intel Corporation
- Brian Taggert
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Bottom heat spreader
- Publication number 20050285260
- Publication date Dec 29, 2005
- Dale Hackitt
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
USE OF GOLD SURFACE FINISH ON A COPPER WIRE-BOND SUBSTRATE, METHOD...
- Publication number 20050147801
- Publication date Jul 7, 2005
- Intel Corporation
- Brian Taggert
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...

Dale Hackitt

Person

Patents Grantslast 30 patents

Ultra slim RF package for ultrabooks and smart phones

Microelectronic package having solder-filled through-vias

Microelectronic package having a stiffening element and method of m...

Bottom heat spreader

Use of direct gold surface finish on a copper wire-bond substrate,...

Slotted thermal dissipater for a semiconductor package

Patents Applicationslast 30 patents

ULTRA SLIM RF PACKAGE FOR ULTRABOOKS AND SMART PHONES

Microelectronic package having solder-filled through-vias

Backside via formation prior to die attachment

Microelectronic package having a stiffening element and method of m...

Use of direct gold surface finish on a copper wire-bond substrate,...

Bottom heat spreader

USE OF GOLD SURFACE FINISH ON A COPPER WIRE-BOND SUBSTRATE, METHOD...