Dales Kent

Person

Round Rock, TX, US

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor chip with thermal interface tape
- Patent number 9,627,281
- Issue date Apr 18, 2017
- Advanced Micro Device, Inc.
- Seth Prejean
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Functional and stress testing of LGA devices
- Patent number 7,479,796
- Issue date Jan 20, 2009
- International Business Machines Corporation
- John Saunders Corbin, Jr.
- G01 - MEASURING TESTING
Information Patent Grant
Functional and stress testing of LGA devices
- Patent number 7,466,155
- Issue date Dec 16, 2008
- International Business Machines Corporation
- John Saunders Corbin, Jr.
- G01 - MEASURING TESTING
Information Patent Grant
Functional and stress testing of LGA devices
- Patent number 7,463,017
- Issue date Dec 9, 2008
- International Business Machines Corporation
- John Saunders Corbin, Jr.
- G01 - MEASURING TESTING
Information Patent Grant
Functional and stress testing of LGA devices
- Patent number 7,456,644
- Issue date Nov 25, 2008
- International Business Machines Corporation
- John Saunders Corbin, Jr.
- G01 - MEASURING TESTING
Information Patent Grant
Functional and stress testing of LGA devices
- Patent number 7,453,279
- Issue date Nov 18, 2008
- International Business Machines Corporation
- John Saunders Corbin, Jr.
- G01 - MEASURING TESTING
Information Patent Grant
Functional and stress testing of LGA devices
- Patent number 7,425,822
- Issue date Sep 16, 2008
- International Business Machines Corporation
- John Saunders Corbin, Jr.
- G01 - MEASURING TESTING
Information Patent Grant
Functional and stress testing of LGA devices
- Patent number 7,423,440
- Issue date Sep 9, 2008
- International Business Machines Corporation
- John Saunders Corbin, Jr.
- G01 - MEASURING TESTING
Information Patent Grant
Functional and stress testing of LGA devices
- Patent number 7,405,583
- Issue date Jul 29, 2008
- International Business Machines Corporation
- John Saunders Corbin, Jr.
- G01 - MEASURING TESTING
Information Patent Grant
Functional and stress testing of LGA devices
- Patent number 7,352,200
- Issue date Apr 1, 2008
- International Business Machines Corporation
- John Saunders Corbin, Jr.
- G01 - MEASURING TESTING
Information Patent Grant
Temperature and condensation control system for functional tester
- Patent number 7,135,877
- Issue date Nov 14, 2006
- International Business Machines Corporation
- Daniel Paul Beaman
- G01 - MEASURING TESTING
Information Patent Grant
Packaging for enhanced thermal and structural performance of electr...
- Patent number 7,119,433
- Issue date Oct 10, 2006
- International Business Machines Corporation
- John S. Corbin, Jr.
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heatsink retention and air duct assembly
- Patent number 5,910,884
- Issue date Jun 8, 1999
- International Business Machines Corporation
- Jose Arturo Garza
- G06 - COMPUTING CALCULATING COUNTING

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR CHIP WITH THERMAL INTERFACE TAPE
- Publication number 20120043539
- Publication date Feb 23, 2012
- Seth Prejean
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Temperature and Condensation Control System for Functional Tester
- Publication number 20080186043
- Publication date Aug 7, 2008
- International Business Machines Corporation
- Daniel Paul Beaman
- G01 - MEASURING TESTING
Information Patent Application
FUNCTIONAL AND STRESS TESTING OF LGA DEVICES
- Publication number 20070210819
- Publication date Sep 13, 2007
- John Saunders Corbin
- G01 - MEASURING TESTING
Information Patent Application
FUNCTIONAL AND STRESS TESTING OF LGA DEVICES
- Publication number 20070205796
- Publication date Sep 6, 2007
- John Saunders Corbin
- G01 - MEASURING TESTING
Information Patent Application
FUNCTIONAL AND STRESS TESTING OF LGA DEVICES
- Publication number 20070205756
- Publication date Sep 6, 2007
- John Saunders Corbin
- G01 - MEASURING TESTING
Information Patent Application
FUNCTIONAL AND STRESS TESTING OF LGA DEVICES
- Publication number 20070205758
- Publication date Sep 6, 2007
- John Saunders Corbin
- G01 - MEASURING TESTING
Information Patent Application
FUNCTIONAL AND STRESS TESTING OF LGA DEVICES
- Publication number 20070205757
- Publication date Sep 6, 2007
- John Saunders Corbin
- G01 - MEASURING TESTING
Information Patent Application
FUNCTIONAL AND STRESS TESTING OF LGA DEVICES
- Publication number 20070205773
- Publication date Sep 6, 2007
- John Saunders Corbin
- G01 - MEASURING TESTING
Information Patent Application
FUNCTIONAL AND STRESS TESTING OF LGA DEVICES
- Publication number 20070205797
- Publication date Sep 6, 2007
- John Saunders Corbin
- G01 - MEASURING TESTING
Information Patent Application
FUNCTIONAL AND STRESS TESTING OF LGA DEVICES
- Publication number 20070205786
- Publication date Sep 6, 2007
- John Saunders Corbin
- G01 - MEASURING TESTING
Information Patent Application
Functional and stress testing of LGA devices
- Publication number 20060152237
- Publication date Jul 13, 2006
- John Saunders Corbin
- G01 - MEASURING TESTING
Information Patent Application
Packaging for enhanced thermal and structural performance of electr...
- Publication number 20050280140
- Publication date Dec 22, 2005
- International Business Machines Corporation
- John S. Corbin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Temperature and condensation control system for functional tester
- Publication number 20050030053
- Publication date Feb 10, 2005
- Daniel Paul Beaman
- G01 - MEASURING TESTING
Information Patent Application
Temperature and condensation control system for functional tester
- Publication number 20050030052
- Publication date Feb 10, 2005
- International Business Machines Corporation
- Daniel Paul Beaman
- G01 - MEASURING TESTING

Person

Patents Grantslast 30 patents

Semiconductor chip with thermal interface tape

Functional and stress testing of LGA devices

Functional and stress testing of LGA devices

Functional and stress testing of LGA devices

Functional and stress testing of LGA devices

Functional and stress testing of LGA devices

Functional and stress testing of LGA devices

Functional and stress testing of LGA devices

Functional and stress testing of LGA devices

Functional and stress testing of LGA devices

Temperature and condensation control system for functional tester

Packaging for enhanced thermal and structural performance of electr...

Heatsink retention and air duct assembly

Patents Applicationslast 30 patents

SEMICONDUCTOR CHIP WITH THERMAL INTERFACE TAPE

Temperature and Condensation Control System for Functional Tester

FUNCTIONAL AND STRESS TESTING OF LGA DEVICES

FUNCTIONAL AND STRESS TESTING OF LGA DEVICES

FUNCTIONAL AND STRESS TESTING OF LGA DEVICES

FUNCTIONAL AND STRESS TESTING OF LGA DEVICES

FUNCTIONAL AND STRESS TESTING OF LGA DEVICES

FUNCTIONAL AND STRESS TESTING OF LGA DEVICES

FUNCTIONAL AND STRESS TESTING OF LGA DEVICES

FUNCTIONAL AND STRESS TESTING OF LGA DEVICES

Functional and stress testing of LGA devices

Packaging for enhanced thermal and structural performance of electr...

Temperature and condensation control system for functional tester

Temperature and condensation control system for functional tester