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Dali LIU

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  • Yongin-si, KR
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Patents Grantslast 30 patents

  • Information Patent Grant

    Wafer clamping apparatus
    • Patent number 9,768,051
    • Issue date Sep 19, 2017
    • Samsung Electronics Co., Ltd.
    • Xinglong Chen
    • H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

  • Information Patent Application

    WAFER CLAMPING APPARATUS
    • Publication number 20170018451
    • Publication date Jan 19, 2017
    • Samsung Electronics Co., Ltd.
    • Xinglong CHEN
    • H01 - BASIC ELECTRIC ELEMENTS