Dalson Ye Seng Kim

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Singapore, SG

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Patents Applicationslast 30 patents

Information Patent Application
Stacked die package for peripheral and center device pad layout device
- Publication number 20060246622
- Publication date Nov 2, 2006
- Dalson Ye Seng Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Stacked device package for peripheral and center device pad layout...
- Publication number 20060197206
- Publication date Sep 7, 2006
- Dalson Ye Seng Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Chip on board leadframe for semiconductor components having area array
- Publication number 20060163702
- Publication date Jul 27, 2006
- Dalson Ye Seng Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor component having chip on board leadframe and method o...
- Publication number 20050023651
- Publication date Feb 3, 2005
- Dalson Ye Seng Kim
- H01 - BASIC ELECTRIC ELEMENTS