Dalson Ye Seng Kim

Person

Singapore, SG

People

Patents Grantslast 30 patents

Information Patent Grant
Stacked die package for peripheral and center device pad layout device
- Patent number 8,269,328
- Issue date Sep 18, 2012
- Micron Technology, Inc.
- Dalson Ye Seng Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked die package for peripheral and center device pad layout device
- Patent number 7,846,768
- Issue date Dec 7, 2010
- Micron Technology, Inc.
- Dalson Ye Seng Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip on board leadframe for semiconductor components having area array
- Patent number 7,459,778
- Issue date Dec 2, 2008
- Micron Technology, Inc.
- Dalson Ye Seng Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked die package for peripheral and center device pad layout device
- Patent number 7,425,463
- Issue date Sep 16, 2008
- Micron Technology, Inc.
- Dalson Ye Seng Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked device package for peripheral and center device pad layout...
- Patent number 7,205,656
- Issue date Apr 17, 2007
- Micron Technology, Inc.
- Dalson Ye Seng Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for fabricating semiconductor component with chip on board l...
- Patent number 7,049,173
- Issue date May 23, 2006
- Micron Technology, Inc.
- Dalson Ye Seng Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor component having chip on board leadframe
- Patent number 6,903,449
- Issue date Jun 7, 2005
- Micron Technology, Inc.
- Dalson Ye Seng Kim
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
STACKED DIE PACKAGE FOR PERIPHERAL AND CENTER DEVICE PAD LAYOUT DEVICE
- Publication number 20110062583
- Publication date Mar 17, 2011
- Micron Technology, Inc.
- Dalson Ye Seng Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED DIE PACKAGE FOR PERIPHERAL AND CENTER DEVICE PAD LAYOUT DEVICE
- Publication number 20080280396
- Publication date Nov 13, 2008
- Micron Technology, Inc.
- Dalson Ye Seng Kim
- H01 - BASIC ELECTRIC ELEMENTS

Dalson Ye Seng Kim

Person

Patents Grantslast 30 patents

Stacked die package for peripheral and center device pad layout device

Stacked die package for peripheral and center device pad layout device

Chip on board leadframe for semiconductor components having area array

Stacked die package for peripheral and center device pad layout device

Stacked device package for peripheral and center device pad layout...

Method for fabricating semiconductor component with chip on board l...

Semiconductor component having chip on board leadframe

Patents Applicationslast 30 patents

STACKED DIE PACKAGE FOR PERIPHERAL AND CENTER DEVICE PAD LAYOUT DEVICE

STACKED DIE PACKAGE FOR PERIPHERAL AND CENTER DEVICE PAD LAYOUT DEVICE