Damaruganath Pinjala

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Singapore, SG

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Patents Grantslast 30 patents

Information Patent Grant
Heat transfer apparatus
- Patent number 6,873,527
- Issue date Mar 29, 2005
- Heng Yun Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus and method for fluid-based cooling of heat-generating dev...
- Patent number 6,717,812
- Issue date Apr 6, 2004
- Institute of Microelectronics
- Damaruganath Pinjala
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Enhanced chip scale package for flip chips
- Patent number 6,608,379
- Issue date Aug 19, 2003
- Institute of Microelectronics, et al.
- Yong Kee Yeo
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
ELECTRONIC PACKAGE AND METHOD OF ASSEMBLING THE SAME
- Publication number 20100187682
- Publication date Jul 29, 2010
- Damaruganath Pinjala
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Heat transfer apparatus
- Publication number 20040012925
- Publication date Jan 22, 2004
- Heng Yun Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ENHANCED CHIP SCALE PACKAGE FOR FLIP CHIPS
- Publication number 20030132529
- Publication date Jul 17, 2003
- Yong Kee Yeo
- H01 - BASIC ELECTRIC ELEMENTS