Damir Fazil

Person

Boise, ID, US

People

Patents Grantslast 30 patents

Information Patent Grant
Integrated assemblies which include stacked memory decks, and metho...
- Patent number 12,010,850
- Issue date Jun 11, 2024
- John D. Hopkins
Information Patent Grant
Integrated assemblies, and methods of forming integrated assemblies
- Patent number 12,004,351
- Issue date Jun 4, 2024
- S. M. Istiaque Hossain
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic devices including an interdeck region between deck...
- Patent number 11,955,330
- Issue date Apr 9, 2024
- Micron Technology, Inc.
- John D. Hopkins
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated assemblies which include stacked memory decks
- Patent number 11,744,072
- Issue date Aug 29, 2023
- Micron Technology, Inc.
- John D. Hopkins
Information Patent Grant
Methods of forming electronic devices with channel openings or pill...
- Patent number 11,706,925
- Issue date Jul 18, 2023
- Micron Technology, Inc.
- John D. Hopkins
Information Patent Grant
Electronic devices and systems with channel openings or pillars ext...
- Patent number 11,495,617
- Issue date Nov 8, 2022
- Micron Technology, Inc.
- John D. Hopkins
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated assemblies, and methods of forming integrated assemblies
- Patent number 11,430,809
- Issue date Aug 30, 2022
- Micron Technology, Inc.
- S. M. Istiaque Hossain
- G11 - INFORMATION STORAGE
Information Patent Grant
Methods of forming microelectronic devices including an interdeck r...
- Patent number 11,393,672
- Issue date Jul 19, 2022
- Micron Technology, Inc.
- John D. Hopkins
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Memory arrays and methods used in forming a memory array
- Patent number 11,329,062
- Issue date May 10, 2022
- Micron Technology, Inc.
- Justin B. Dorhout
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of forming integrated assemblies include stacked memory decks
- Patent number 11,107,831
- Issue date Aug 31, 2021
- Micron Technology, Inc.
- John D. Hopkins
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Memory arrays and methods used in forming a memory array
- Patent number 11,056,497
- Issue date Jul 6, 2021
- Micron Technology, Inc.
- John D. Hopkins
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices and systems with channel openings or pillars...
- Patent number 10,825,828
- Issue date Nov 3, 2020
- Micron Technology, Inc.
- John D. Hopkins
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Memory devices and systems having reduced bit line to drain select...
- Patent number 10,134,758
- Issue date Nov 20, 2018
- Intel Corporation
- Hongbin Zhu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Memory devices and systems having reduced bit line to drain select...
- Patent number 9,741,734
- Issue date Aug 22, 2017
- Intel Corporation
- Hongbin Zhu
- G11 - INFORMATION STORAGE

Patents Applicationslast 30 patents

Information Patent Application
INTEGRATED ASSEMBLIES WHICH INCLUDE STACKED MEMORY DECKS, AND METHO...
- Publication number 20240397717
- Publication date Nov 28, 2024
- Lodestar Licensing Group LLC
- John D. Hopkins
Information Patent Application
INTEGRATED ASSEMBLIES, AND METHODS OF FORMING INTEGRATED ASSEMBLIES
- Publication number 20240324223
- Publication date Sep 26, 2024
- Lodestar Licensing Group LLC
- S. M. Istiaque Hossain
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Memory Arrays Comprising Strings Of Memory Cells And Methods Used I...
- Publication number 20240074179
- Publication date Feb 29, 2024
- Micron Technology, Inc.
- John D. Hopkins
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated Assemblies Which Include Stacked Memory Decks, and Metho...
- Publication number 20240008275
- Publication date Jan 4, 2024
- Lodestar Licensing Group LLC
- John D. Hopkins
Information Patent Application
Memory Arrays Comprising Strings Of Memory Cells And Methods Used I...
- Publication number 20230380159
- Publication date Nov 23, 2023
- Micron Technology, Inc.
- Damir Fazil
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICOELECTRONIC DEVICES WITH PILLARS OR OPENINGS EXTENDING THROUGH A...
- Publication number 20230363168
- Publication date Nov 9, 2023
- Lodestar Licensing Group, LLC
- John D. Hopkins
Information Patent Application
MEMORY APPARATUS AND METHODS INCLUDING MERGED PROCESS FOR MEMORY CE...
- Publication number 20230345722
- Publication date Oct 26, 2023
- Micron Technology, Inc.
- Byeung Chul Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Memory Arrays Comprising Strings Of Memory Cells And Methods Used I...
- Publication number 20230253465
- Publication date Aug 10, 2023
- Micron Technology, Inc.
- John D. Hopkins
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Memory Arrays Comprising Strings Of Memory Cells And Methods Used I...
- Publication number 20230207469
- Publication date Jun 29, 2023
- Micron Technology, Inc.
- Damir Fazil
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF FORMING ELECTRONIC DEVICES WITH CHANNEL OPENINGS OR PILL...
- Publication number 20230092501
- Publication date Mar 23, 2023
- Micron Technology, Inc.
- John D. Hopkins
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated Assemblies, and Methods of Forming Integrated Assemblies
- Publication number 20220367512
- Publication date Nov 17, 2022
- Micron Technology, Inc.
- S.M. Istiaque Hossain
- G11 - INFORMATION STORAGE
Information Patent Application
MICROELECTRONIC DEVICES INCLUDING AN INTERDECK REGION BETWEEN DECK...
- Publication number 20220301860
- Publication date Sep 22, 2022
- Micron Technology, Inc.
- John D. Hopkins
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated Assemblies, and Methods of Forming Integrated Assemblies
- Publication number 20220045086
- Publication date Feb 10, 2022
- Micron Technology, Inc.
- S.M. Istiaque Hossain
- G11 - INFORMATION STORAGE
Information Patent Application
Integrated Assemblies Which Include Stacked Memory Decks, and Metho...
- Publication number 20210358951
- Publication date Nov 18, 2021
- Micron Technology, Inc.
- John D. Hopkins
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF FORMING MICROELECTRONIC DEVICES INCLUDING AN INTERDECK R...
- Publication number 20210249261
- Publication date Aug 12, 2021
- Micron Technology, Inc.
- John D. Hopkins
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated Assemblies Which Include Stacked Memory Decks, and Metho...
- Publication number 20210167081
- Publication date Jun 3, 2021
- Micron Technology, Inc.
- John D. Hopkins
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICES AND SYSTEMS WITH CHANNEL OPENINGS OR PILLARS EXT...
- Publication number 20210013228
- Publication date Jan 14, 2021
- Micron Technology, Inc.
- John D. Hopkins
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Memory Arrays And Methods Used In Forming A Memory Array
- Publication number 20200357809
- Publication date Nov 12, 2020
- Micron Technology, Inc.
- John D. Hopkins
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Memory Arrays And Methods Used In Forming A Memory Array
- Publication number 20200127004
- Publication date Apr 23, 2020
- Micron Technology, Inc.
- Justin B. Dorhout
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES AND SYSTEMS WITH CHANNEL OPENINGS OR PILLARS...
- Publication number 20200119038
- Publication date Apr 16, 2020
- Micron Technology, Inc.
- John D. Hopkins
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MEMORY DEVICES AND SYSTEMS HAVING REDUCED BIT LINE TO DRAIN SELECT...
- Publication number 20180130819
- Publication date May 10, 2018
- Intel Corporation
- Hongbin Zhu
- G11 - INFORMATION STORAGE
Information Patent Application
MEMORY DEVICES AND SYSTEMS HAVING REDUCED BIT LINE TO DRAIN SELECT...
- Publication number 20170170190
- Publication date Jun 15, 2017
- Intel Corporation
- Hongbin Zhu
- G11 - INFORMATION STORAGE

Damir Fazil

Person

Patents Grantslast 30 patents

Integrated assemblies which include stacked memory decks, and metho...

Integrated assemblies, and methods of forming integrated assemblies

Microelectronic devices including an interdeck region between deck...

Integrated assemblies which include stacked memory decks

Methods of forming electronic devices with channel openings or pill...

Electronic devices and systems with channel openings or pillars ext...

Integrated assemblies, and methods of forming integrated assemblies

Methods of forming microelectronic devices including an interdeck r...

Memory arrays and methods used in forming a memory array

Methods of forming integrated assemblies include stacked memory decks

Memory arrays and methods used in forming a memory array

Semiconductor devices and systems with channel openings or pillars...

Memory devices and systems having reduced bit line to drain select...

Memory devices and systems having reduced bit line to drain select...

Patents Applicationslast 30 patents

INTEGRATED ASSEMBLIES WHICH INCLUDE STACKED MEMORY DECKS, AND METHO...

INTEGRATED ASSEMBLIES, AND METHODS OF FORMING INTEGRATED ASSEMBLIES

Memory Arrays Comprising Strings Of Memory Cells And Methods Used I...

Integrated Assemblies Which Include Stacked Memory Decks, and Metho...

Memory Arrays Comprising Strings Of Memory Cells And Methods Used I...

MICOELECTRONIC DEVICES WITH PILLARS OR OPENINGS EXTENDING THROUGH A...

MEMORY APPARATUS AND METHODS INCLUDING MERGED PROCESS FOR MEMORY CE...

Memory Arrays Comprising Strings Of Memory Cells And Methods Used I...

Memory Arrays Comprising Strings Of Memory Cells And Methods Used I...

METHODS OF FORMING ELECTRONIC DEVICES WITH CHANNEL OPENINGS OR PILL...

Integrated Assemblies, and Methods of Forming Integrated Assemblies

MICROELECTRONIC DEVICES INCLUDING AN INTERDECK REGION BETWEEN DECK...

Integrated Assemblies, and Methods of Forming Integrated Assemblies

Integrated Assemblies Which Include Stacked Memory Decks, and Metho...

METHODS OF FORMING MICROELECTRONIC DEVICES INCLUDING AN INTERDECK R...

Integrated Assemblies Which Include Stacked Memory Decks, and Metho...

ELECTRONIC DEVICES AND SYSTEMS WITH CHANNEL OPENINGS OR PILLARS EXT...

Memory Arrays And Methods Used In Forming A Memory Array

Memory Arrays And Methods Used In Forming A Memory Array

SEMICONDUCTOR DEVICES AND SYSTEMS WITH CHANNEL OPENINGS OR PILLARS...

MEMORY DEVICES AND SYSTEMS HAVING REDUCED BIT LINE TO DRAIN SELECT...

MEMORY DEVICES AND SYSTEMS HAVING REDUCED BIT LINE TO DRAIN SELECT...