Dan Cromwell

Follow

Person

Penryn, CA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Supporting a circuit package including a substrate having a solder...
- Patent number 7,372,147
- Issue date May 13, 2008
- Hewlett-Packard Development Company, L.P.
- Xiang Dai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method and system for assembling a printed circuit board using a la...
- Patent number 7,171,742
- Issue date Feb 6, 2007
- Hewlett-Packard Development Company, L.P.
- Dan Cromwell
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Support for an integrated circuit package having a column grid arra...
- Patent number 6,923,658
- Issue date Aug 2, 2005
- Hewlett-Packard Development Company, L.P.
- Dan Cromwell
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method and system for assembling a printed circuit board using a la...
- Patent number 6,660,563
- Issue date Dec 9, 2003
- Hewlett-Packard Development Company, L.P.
- Dan Cromwell
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
Method for aligning a component on a printed circuit board
- Publication number 20060156540
- Publication date Jul 20, 2006
- Hewlett-Packard Development Company, L.P.
- Daniel Cromwell
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
SUPPORT FOR AN INTEGRATED CIRCUIT PACKAGE HAVING A COLUMN GRID ARRA...
- Publication number 20050124185
- Publication date Jun 9, 2005
- Dan Cromwell
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Supporting a circuit package including a substrate having a solder...
- Publication number 20050001310
- Publication date Jan 6, 2005
- Xiang Dai
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Method and system for assembling a printed circuit board using a la...
- Publication number 20040088853
- Publication date May 13, 2004
- Dan Cromwell
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD AND SYSTEM FOR ASSEMBLING A PRINTED CIRCUIT BOARD USING A LA...
- Publication number 20030224558
- Publication date Dec 4, 2003
- Dan Cromwell
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR