Dan Lillie

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Bedford, OH, US

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Patents Grantslast 30 patents

Information Patent Grant
Etching solution for forming an embedded resistor
- Patent number 6,841,084
- Issue date Jan 11, 2005
- Nikko Materials USA, Inc.
- Dan Lillie
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Process for manufacturing copper foil on a metal carrier substrate
- Patent number 6,770,976
- Issue date Aug 3, 2004
- Nikko Materials USA, Inc.
- Jiangtao Wang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Applying resistive layer onto copper
- Patent number 6,489,035
- Issue date Dec 3, 2002
- Gould Electronics Inc.
- Jiangtao Wang
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method of forming chromium coated copper for printed circuit boards
- Patent number 6,489,034
- Issue date Dec 3, 2002
- Gould Electronics Inc.
- Jiangtao Wang
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Thin copper on usable carrier and method of forming same
- Patent number 6,447,929
- Issue date Sep 10, 2002
- Gould Electronics Inc.
- Jiangtao Wang
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR

Patents Applicationslast 30 patents

Information Patent Application
Etching solution for forming an embedded resistor
- Publication number 20030150840
- Publication date Aug 14, 2003
- Gould Electronics Inc.
- Dan Lillie
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Process for manufacturing copper foil on a metal carrier substrate
- Publication number 20030153169
- Publication date Aug 14, 2003
- Gould Electronics Inc.
- Jiangtao Wang
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR