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Dan OKAMOTO

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  • Oita, JP
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Patents Grantslast 30 patents

  • Information Patent Grant

    Quad flat no lead package and method of making
    • Patent number 11,735,435
    • Issue date Aug 22, 2023
    • Texas Instruments Incorporated
    • Dan Okamoto
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Quad flat no lead package and method of making
    • Patent number 10,665,475
    • Issue date May 26, 2020
    • Texas Instruments Incorporated
    • Dan Okamoto
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Circuit substrate interconnect
    • Patent number 9,536,753
    • Issue date Jan 3, 2017
    • Texas Instruments Incorporated
    • Yohei Koto
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Method of making a QFN package
    • Patent number 9,379,087
    • Issue date Jun 28, 2016
    • Texas Instruments Incorporated
    • Dan Okamoto
    • G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
  • Information Patent Grant

    Semiconductor die collet
    • Patent number 8,465,619
    • Issue date Jun 18, 2013
    • Texas Instruments Incorporated
    • Dan Okamoto
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Semiconductor die collet and method
    • Patent number 7,790,507
    • Issue date Sep 7, 2010
    • Texas Instruments Incorporated
    • Dan Okamoto
    • H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

  • Information Patent Application

    Quad Flat No Lead Package And Method Of Making
    • Publication number 20200251352
    • Publication date Aug 6, 2020
    • TEXAS INSTRUMENTS INCORPORATED
    • Dan Okamoto
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    LEAD FRAME WITH SOLDER SIDEWALLS
    • Publication number 20170352609
    • Publication date Dec 7, 2017
    • TEXAS INSTRUMENTS INCORPORATED
    • Dan Okamoto
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    LEAD FRAME WITH SOLDER SIDEWALLS
    • Publication number 20170271244
    • Publication date Sep 21, 2017
    • TEXAS INSTRUMENTS INCORPORATED
    • Dan Okamoto
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    DUAL TRANSISTORS FABRICATED ON LEAD FRAMES AND METHOD OF FABRICATION
    • Publication number 20160315036
    • Publication date Oct 27, 2016
    • TEXAS INSTRUMENTS INCORPORATED
    • Makoto Shibuya
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    METHOD OF MAKING A QFN PACKAGE
    • Publication number 20160307831
    • Publication date Oct 20, 2016
    • TEXAS INSTRUMENTS INCORPORATED
    • Dan Okamoto
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    QFN Package
    • Publication number 20160133599
    • Publication date May 12, 2016
    • TEXAS INSTRUMENTS INCORPORATED
    • Dan Okamoto
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    CIRCUIT SUBSTRATE INTERCONNECT
    • Publication number 20160099226
    • Publication date Apr 7, 2016
    • TEXAS INSTRUMENTS INCORPORATED
    • Yohei Koto
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    Quad Flat No Lead Package And Method Of Making
    • Publication number 20150364373
    • Publication date Dec 17, 2015
    • TEXAS INSTRUMENTS INCORPORATED
    • Dan Okamoto
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    Solder Coated Clip And Integrated Circuit Packaging Method
    • Publication number 20150348881
    • Publication date Dec 3, 2015
    • TEXAS INSTRUMENTS INCORPORATED
    • Dan Okamoto
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    Integrated Circuit Die And Package
    • Publication number 20150340324
    • Publication date Nov 26, 2015
    • TEXAS INSTRUMENTS INCORPORATED
    • Kazunori Hayata
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    Semiconductor Die Collet and Method
    • Publication number 20130264836
    • Publication date Oct 10, 2013
    • TEXAS INSTRUMENTS INCORPORATED
    • Dan OKAMOTO
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    Semiconductor Die Collet and Method
    • Publication number 20100289159
    • Publication date Nov 18, 2010
    • TEXAS INSTRUMENTS INCORPORATED
    • Dan OKAMOTO
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    Semiconductor Die Collet and Method
    • Publication number 20080233680
    • Publication date Sep 25, 2008
    • Dan Okamoto
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    Method and apparatus for fine pitch solder joint
    • Publication number 20070037376
    • Publication date Feb 15, 2007
    • TEXAS INSTRUMENTS INCORPORATED
    • Dan Okamoto
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    Stress distribution package
    • Publication number 20050133913
    • Publication date Jun 23, 2005
    • Dan Okamoto
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR