Dan Shier

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Olympia, WA, US

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Patents Grantslast 30 patents

Information Patent Grant
Methods to couple integrated circuit packages to bonding pads havin...
- Patent number 7,036,712
- Issue date May 2, 2006
- Intel Corporation
- Stephen C. Joy
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Design and assembly methodology for reducing bridging in bonding el...
- Patent number 6,622,905
- Issue date Sep 23, 2003
- Intel Corporation
- Daniel E. Shier
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Apparatus for coupling integrated circuit packages to bonding pads...
- Patent number 6,395,995
- Issue date May 28, 2002
- Intel Corporation
- Stephen C. Joy
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
INTEGRATED CIRCUIT CHIP ATTACHMENT USING LOCAL HEAT SOURCE
- Publication number 20160351526
- Publication date Dec 1, 2016
- Intel Corporation
- Thomas Alan Boyd
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method and apparatus for coupling integrated circuit packages to bo...
- Publication number 20020108777
- Publication date Aug 15, 2002
- Intel Corporation
- Stephen C. Joy
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Design and assembly methodology for reducing bridging in bonding el...
- Publication number 20020084312
- Publication date Jul 4, 2002
- Daniel E. Shier
- H01 - BASIC ELECTRIC ELEMENTS