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Dan Vilenski
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Haifa, IL
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last 30 patents
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Patent Grant
Method and apparatus for cleaving semiconductor wafers
Patent number
5,740,953
Issue date
Apr 21, 1998
Sela Semiconductor Engineering Laboratories
Colin Smith
B28 - WORKING CEMENT, CLAY, OR STONE
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Patent Grant
Second bond positioning wire bonder
Patent number
4,073,424
Issue date
Feb 14, 1978
Kulicke and Soffa Industries Inc.
Frederick W. Kulicke
H01 - BASIC ELECTRIC ELEMENTS