Dan Willis

Person

Portland, OR, US

People

Patents Grantslast 30 patents

Information Patent Grant
Enhanced dummy die for MCP
- Patent number 11,756,941
- Issue date Sep 12, 2023
- Intel Corporation
- John Fallin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Processor package with optimization based on package connection type
- Patent number 11,023,247
- Issue date Jun 1, 2021
- Intel Corporation
- Daniel Willis
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Socket cavity insulator
- Patent number 10,729,010
- Issue date Jul 28, 2020
- Intel Corporation
- Daniel Willis
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multiple storage devices implemented using a common connector
- Patent number 10,509,759
- Issue date Dec 17, 2019
- Intel Corporation
- Daniel S. Willis
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Multi-axis retention mechanism
- Patent number 7,909,627
- Issue date Mar 22, 2011
- Intel Corporation
- Brent A. Hill
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrical interface for memory connector
- Patent number 7,458,821
- Issue date Dec 2, 2008
- Intel Corporation
- Dan Willis
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic packaging using conductive interproser connector
- Patent number 7,385,288
- Issue date Jun 10, 2008
- Intel Corporation
- David W. Boggs
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Differential I/O spline for inexpensive breakout and excellent sign...
- Patent number 7,347,701
- Issue date Mar 25, 2008
- Intel Corporation
- Gregory M. Daly
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three-dimensional flexible interposer
- Patent number 7,325,303
- Issue date Feb 5, 2008
- Intel Corporation
- David W. Boggs
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic packaging using conductive interposer connector
- Patent number 7,241,680
- Issue date Jul 10, 2007
- Intel Corporation
- David W. Boggs
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Three-dimensional flexible interposer
- Patent number 7,201,583
- Issue date Apr 10, 2007
- Intel Corporation
- David W. Boggs
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
ENHANCED DUMMY DIE FOR MCP
- Publication number 20200328195
- Publication date Oct 15, 2020
- Intel Corporation
- John FALLIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOCKET CAVITY INSULATOR
- Publication number 20190306984
- Publication date Oct 3, 2019
- Intel Corporation
- Daniel Willis
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PROCESSOR PACKAGE WITH OPTIMIZATION BASED ON PACKAGE CONNECTION TYPE
- Publication number 20190042270
- Publication date Feb 7, 2019
- Intel Corporation
- Daniel Willis
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
MULTIPLE STORAGE DEVICES IMPLEMENTED USING A COMMON CONNECTOR
- Publication number 20180285307
- Publication date Oct 4, 2018
- Intel Corporation
- Daniel S. WILLIS
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
CONTEXTUAL PLATFORM FEATURE RECOMMENDATIONS
- Publication number 20160078350
- Publication date Mar 17, 2016
- Mark D. Yarvis
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
MEMORY CONNECTOR FOR TWO SODIMM PER CHANNEL CONFIGURATION
- Publication number 20150171535
- Publication date Jun 18, 2015
- Xiang Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Differential I/O spline for inexpensive breakout and excellent sign...
- Publication number 20070269998
- Publication date Nov 22, 2007
- Gregory M. Daly
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC PACKAGING USING CONDUCTIVE INTERPROSER CONNECTOR
- Publication number 20070228562
- Publication date Oct 4, 2007
- David W. Boggs
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Electrical interface for memory connector
- Publication number 20070128896
- Publication date Jun 7, 2007
- Dan Willis
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Three-dimensional flexible interposer
- Publication number 20070082512
- Publication date Apr 12, 2007
- David W. Boggs
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Electronic packaging using conductive interposer connector
- Publication number 20050242434
- Publication date Nov 3, 2005
- David W. Boggs
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
THREE-DIMENSIONAL FLEXIBLE INTERPOSER
- Publication number 20050142900
- Publication date Jun 30, 2005
- David W. Boggs
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Multi-axis retention mechanism
- Publication number 20050085113
- Publication date Apr 21, 2005
- Brent A. Hill
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Retention mechanism for high mass add-in cards
- Publication number 20040190268
- Publication date Sep 30, 2004
- Yun Ling
- H01 - BASIC ELECTRIC ELEMENTS

Person

Patents Grantslast 30 patents

Enhanced dummy die for MCP

Processor package with optimization based on package connection type

Socket cavity insulator

Multiple storage devices implemented using a common connector

Multi-axis retention mechanism

Electrical interface for memory connector

Electronic packaging using conductive interproser connector

Differential I/O spline for inexpensive breakout and excellent sign...

Three-dimensional flexible interposer

Electronic packaging using conductive interposer connector

Three-dimensional flexible interposer

Patents Applicationslast 30 patents

ENHANCED DUMMY DIE FOR MCP

SOCKET CAVITY INSULATOR

PROCESSOR PACKAGE WITH OPTIMIZATION BASED ON PACKAGE CONNECTION TYPE

MULTIPLE STORAGE DEVICES IMPLEMENTED USING A COMMON CONNECTOR

CONTEXTUAL PLATFORM FEATURE RECOMMENDATIONS

MEMORY CONNECTOR FOR TWO SODIMM PER CHANNEL CONFIGURATION

Differential I/O spline for inexpensive breakout and excellent sign...

ELECTRONIC PACKAGING USING CONDUCTIVE INTERPROSER CONNECTOR

Electrical interface for memory connector

Three-dimensional flexible interposer

Electronic packaging using conductive interposer connector

THREE-DIMENSIONAL FLEXIBLE INTERPOSER

Multi-axis retention mechanism

Retention mechanism for high mass add-in cards