DANFENG YANG

Person

Wuxi City, Jiangsu Province, CN

People

Patents Grantslast 30 patents

Information Patent Grant
SIP package structure
- Patent number 12,249,582
- Issue date Mar 11, 2025
- JCET GROUP CO., LTD.
- Yaojian Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fan-out package structure and method for manufacturing the same
- Patent number 12,148,681
- Issue date Nov 19, 2024
- JCET GROUP CO., LTD.
- Yaojian Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure having a plurality of chips attached to a lead fr...
- Patent number 11,854,949
- Issue date Dec 26, 2023
- JCET GROUP CO., LTD.
- Yaojian Lin
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Semiconductor Device and Method of Forming Fan-Out Package Structur...
- Publication number 20250140730
- Publication date May 1, 2025
- STATS ChipPAC Pte Ltd.
- Yaojian Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Making a Dual-Sided Bridge Die P...
- Publication number 20250132291
- Publication date Apr 24, 2025
- STATS ChipPAC Pte Ltd.
- DanFeng Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND METHOD FOR FORMING SAME
- Publication number 20250062298
- Publication date Feb 20, 2025
- JCET Group Co., Ltd.
- Yaojian LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND METHOD FOR FORMING SAME
- Publication number 20250062215
- Publication date Feb 20, 2025
- JCET GROUP CO., LTD.
- Danfeng YANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20240413040
- Publication date Dec 12, 2024
- JCET GROUP CO., LTD.
- Danfeng Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
System and Method of Providing FOUP or Cassette Supporting Structur...
- Publication number 20240332051
- Publication date Oct 3, 2024
- STATS ChipPAC Pte Ltd.
- Yaojian Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROMINIATURE IMAGE ACQUISITION AND PROCESSING SYSTEM PACKAGING ST...
- Publication number 20240162267
- Publication date May 16, 2024
- JCET GROUP CO., LTD.
- Jianyong Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE WITH INDUCTOR, AND MANUFACTURING METHOD THEREOF
- Publication number 20240057256
- Publication date Feb 15, 2024
- JCET GROUP CO., LTD.
- Yaojian LIN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ANTENNA PACKAGING STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20230411826
- Publication date Dec 21, 2023
- JCET GROUP CO., LTD.
- YAOJIAN LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FAN-OUT PACKAGING STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20230282599
- Publication date Sep 7, 2023
- JCET GROUP CO., LTD.
- YAOJIAN LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20230275039
- Publication date Aug 31, 2023
- JCET GROUP CO., LTD.
- YAOJIAN LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGING STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20230187366
- Publication date Jun 15, 2023
- JCET GROUP CO., LTD.
- YAOJIAN LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGING STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20230187363
- Publication date Jun 15, 2023
- JCET GROUP CO., LTD.
- YAOJIAN LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGING STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20230187422
- Publication date Jun 15, 2023
- JCET GROUP CO., LTD.
- YAOJIAN LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FAN-OUT PACKAGE STRUCTURE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20230005811
- Publication date Jan 5, 2023
- JCET GROUP CO., LTD.
- YAOJIAN LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND METHOD FOR MANUFACTURING SAME
- Publication number 20220399254
- Publication date Dec 15, 2022
- JCET GROUP CO., LTD.
- YAOJIAN LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SIP PACKAGE STRUCTURE
- Publication number 20220223539
- Publication date Jul 14, 2022
- JCET GROUP CO., LTD.
- YAOJIAN LIN
- H01 - BASIC ELECTRIC ELEMENTS

DANFENG YANG

Person

Patents Grantslast 30 patents

SIP package structure

Fan-out package structure and method for manufacturing the same

Package structure having a plurality of chips attached to a lead fr...

Patents Applicationslast 30 patents

Semiconductor Device and Method of Forming Fan-Out Package Structur...

Semiconductor Device and Method of Making a Dual-Sided Bridge Die P...

PACKAGE STRUCTURE AND METHOD FOR FORMING SAME

PACKAGE STRUCTURE AND METHOD FOR FORMING SAME

PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF

System and Method of Providing FOUP or Cassette Supporting Structur...

MICROMINIATURE IMAGE ACQUISITION AND PROCESSING SYSTEM PACKAGING ST...

PACKAGE STRUCTURE WITH INDUCTOR, AND MANUFACTURING METHOD THEREOF

ANTENNA PACKAGING STRUCTURE AND MANUFACTURING METHOD THEREOF

FAN-OUT PACKAGING STRUCTURE AND MANUFACTURING METHOD THEREOF

PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF

PACKAGING STRUCTURE AND MANUFACTURING METHOD THEREOF

PACKAGING STRUCTURE AND MANUFACTURING METHOD THEREOF

PACKAGING STRUCTURE AND MANUFACTURING METHOD THEREOF

FAN-OUT PACKAGE STRUCTURE AND METHOD FOR MANUFACTURING THE SAME

PACKAGE STRUCTURE AND METHOD FOR MANUFACTURING SAME

SIP PACKAGE STRUCTURE