Daniel A. Delibac

Person

Colchester, VT, US

People

Patents Grantslast 30 patents

Information Patent Grant
Method of fine-tuning process controls during integrated circuit ch...
- Patent number 9,576,863
- Issue date Feb 21, 2017
- International Business Machines Corporation
- Shawn A. Adderly
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of fine-tuning process controls during integrated circuit ch...
- Patent number 9,330,988
- Issue date May 3, 2016
- International Business Machines Corporation
- Shawn A. Adderly
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structures with metal lines
- Patent number 9,087,839
- Issue date Jul 21, 2015
- International Business Machines Corporation
- Shawn A. Adderly
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for reducing lateral extrusion formed in semiconductor struc...
- Patent number 9,006,703
- Issue date Apr 14, 2015
- International Business Machines Corporation
- Shawn A. Adderly
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electromigration resistant aluminum-based metal interconnect structure
- Patent number 8,084,864
- Issue date Dec 27, 2011
- International Business Machines Corporation
- Jonathan D. Chapple-Sokol
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electromigration resistant aluminum-based metal interconnect structure
- Patent number 8,003,536
- Issue date Aug 23, 2011
- International Business Machines Corporation
- Jonathan D. Chapple-Sokol
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
METHOD FOR REDUCING LATERAL EXTRUSION FORMED IN SEMICONDUCTOR STRUC...
- Publication number 20150035117
- Publication date Feb 5, 2015
- International Business Machines Corporation
- Shawn A. Adderly
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURES WITH METAL LINES
- Publication number 20140291802
- Publication date Oct 2, 2014
- International Business Machines Corporation
- Shawn A. Adderly
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTROMIGRATION RESISTANT ALUMINUM-BASED METAL INTERCONNECT STRUCTURE
- Publication number 20110221064
- Publication date Sep 15, 2011
- International Business Machines Corporation
- Jonathan D. Chapple-Sokol
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTROMIGRATION RESISTANT ALUMINUM-BASED METAL INTERCONNECT STRUCTURE
- Publication number 20100237503
- Publication date Sep 23, 2010
- International Business Machines Corporation
- Jonathan D. Chapple-Sokol
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TUNGSTEN LINER FOR ALUMINUM-BASED ELECTROMIGRATION RESISTANT INTERC...
- Publication number 20090230555
- Publication date Sep 17, 2009
- International Business Machines Corporation
- Jonathan D. Chapple-Sokol
- H01 - BASIC ELECTRIC ELEMENTS

Daniel A. Delibac

Person

Patents Grantslast 30 patents

Method of fine-tuning process controls during integrated circuit ch...

Method of fine-tuning process controls during integrated circuit ch...

Semiconductor structures with metal lines

Method for reducing lateral extrusion formed in semiconductor struc...

Electromigration resistant aluminum-based metal interconnect structure

Electromigration resistant aluminum-based metal interconnect structure

Patents Applicationslast 30 patents

METHOD FOR REDUCING LATERAL EXTRUSION FORMED IN SEMICONDUCTOR STRUC...

SEMICONDUCTOR STRUCTURES WITH METAL LINES

ELECTROMIGRATION RESISTANT ALUMINUM-BASED METAL INTERCONNECT STRUCTURE

ELECTROMIGRATION RESISTANT ALUMINUM-BASED METAL INTERCONNECT STRUCTURE

TUNGSTEN LINER FOR ALUMINUM-BASED ELECTROMIGRATION RESISTANT INTERC...