Daniel A. Steckert

Follow

Person

Boise, ID, US

People

Patents Grantslast 30 patents

Information Patent Grant
Method to reduce charge buildup during high aspect ratio contact etch
- Patent number 8,673,787
- Issue date Mar 18, 2014
- Micron Technology, Inc.
- Gurtej S. Sandhu
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Method to reduce charge buildup during high aspect ratio contact etch
- Patent number 7,985,692
- Issue date Jul 26, 2011
- Micron Technology, Inc.
- Gurtej S. Sandhu
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Method to reduce charge buildup during high aspect ratio contact etch
- Patent number 7,344,975
- Issue date Mar 18, 2008
- Micron Technology, Inc.
- Gurtej S. Sandhu
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Method to Reduce Charge Buildup During High Aspect Ratio Contact Etch
- Publication number 20110250759
- Publication date Oct 13, 2011
- Micron Technology, Inc.
- Gurtej S. Sandhu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD TO REDUCE CHARGE BUILDUP DURING HIGH ASPECT RATIO CONTACT ETCH
- Publication number 20080128389
- Publication date Jun 5, 2008
- Gurtej S. Sandhu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method to reduce charge buildup during high aspect ratio contact etch
- Publication number 20070049018
- Publication date Mar 1, 2007
- Gurtej S. Sandhu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Implanted photoresist to reduce etch erosion during the formation o...
- Publication number 20060043536
- Publication date Mar 2, 2006
- Chih-Chen Co
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY