Daniel Alan Lawlyes

Person

Kokomo, IN, US

People

Patents Grantslast 30 patents

Information Patent Grant
Electronic enclosure with continuous ground contact surface
- Patent number 7,563,992
- Issue date Jul 21, 2009
- Delphi Technologies, Inc.
- Daniel A. Lawlyes
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of making an electronic assembly
- Patent number 7,510,108
- Issue date Mar 31, 2009
- Delphi Technologies, Inc.
- Daniel A. Lawlyes
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronics enclosure and method of fabricating an electronics encl...
- Patent number 7,294,007
- Issue date Nov 13, 2007
- Delphi Technologies, Inc.
- Daniel A. Lawlyes
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Relaxed tolerance flip chip assembly
- Patent number 6,998,706
- Issue date Feb 14, 2006
- Delphi Technologies, Inc.
- Daniel A. Lawlyes
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heat sink with integrated electronics
- Patent number 6,822,868
- Issue date Nov 23, 2004
- Delphi Technologies, Inc.
- David P. Buehler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Relaxed tolerance flip chip assembly
- Patent number 6,821,816
- Issue date Nov 23, 2004
- Delphi Technologies, Inc.
- Daniel A. Lawlyes
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High density wirebond connector assembly
- Patent number 6,565,365
- Issue date May 20, 2003
- Delphi Technologies, Inc.
- Daniel A. Lawlyes
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic enclosure with improved EMC performance
- Patent number 6,549,426
- Issue date Apr 15, 2003
- Delphi Tecnologies, Inc
- Daniel A. Lawlyes
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Pressure sensor connector
- Patent number 6,536,286
- Issue date Mar 25, 2003
- Delphi Technologies, Inc.
- James I. Moyer
- G01 - MEASURING TESTING
Information Patent Grant
Pressure sensor connector
- Patent number 6,447,342
- Issue date Sep 10, 2002
- Delphi Technologies, Inc.
- Daniel A. Lawlyes
- G01 - MEASURING TESTING
Information Patent Grant
High density wirebond connector assembly
- Patent number 6,309,224
- Issue date Oct 30, 2001
- Delphi Technologies, Inc.
- Daniel Alan Lawlyes
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus for controlling hydraulic fluid pressure
- Patent number 6,308,725
- Issue date Oct 30, 2001
- Delphi Technologies, Inc.
- Daniel Alan Lawlyes
- G05 - CONTROLLING REGULATING

Patents Applicationslast 30 patents

Information Patent Application
MULTIPLE HYDRAULIC CIRCUIT PRESSURE SENSOR
- Publication number 20130036826
- Publication date Feb 14, 2013
- Delphi Technologies, Inc.
- Daniel R. Dahlgren
- G01 - MEASURING TESTING
Information Patent Application
Electronic enclosure with continuous ground contact surface
- Publication number 20080066956
- Publication date Mar 20, 2008
- Daniel A. Lawlyes
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Sealed electronic component
- Publication number 20080053700
- Publication date Mar 6, 2008
- Kurt F. O'Connor
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method of making an electronic assembly
- Publication number 20070023488
- Publication date Feb 1, 2007
- DELPHI TECHNOLOGIES, INC.
- Daniel A. Lawlyes
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Relaxed tolerance flip chip assembly
- Publication number 20050098900
- Publication date May 12, 2005
- DELPHI TECHNOLOGIES, INC.
- Daniel A. Lawlyes
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Heat sink with integrated electronics
- Publication number 20050088824
- Publication date Apr 28, 2005
- DELPHI TECHNOLOGIES, INC.
- David P. Buehler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Relaxed tolerance flip chip assembly
- Publication number 20050040521
- Publication date Feb 24, 2005
- Daniel A. Lawlyes
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Heat sink with integrated electronics
- Publication number 20030161106
- Publication date Aug 28, 2003
- David P. Buehler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
High density wire bondable connector assembly
- Publication number 20030143899
- Publication date Jul 31, 2003
- Mikel R. Fulk
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Partitioned circuit assembly
- Publication number 20030035278
- Publication date Feb 20, 2003
- Daniel A. Lawlyes
- B60 - VEHICLES IN GENERAL
Information Patent Application
High density wirebond connector assembly
- Publication number 20010031569
- Publication date Oct 18, 2001
- Daniel A. Lawlyes
- H01 - BASIC ELECTRIC ELEMENTS

Daniel Alan Lawlyes

Person

Patents Grantslast 30 patents

Electronic enclosure with continuous ground contact surface

Method of making an electronic assembly

Electronics enclosure and method of fabricating an electronics encl...

Relaxed tolerance flip chip assembly

Heat sink with integrated electronics

Relaxed tolerance flip chip assembly

High density wirebond connector assembly

Electronic enclosure with improved EMC performance

Pressure sensor connector

Pressure sensor connector

High density wirebond connector assembly

Apparatus for controlling hydraulic fluid pressure

Patents Applicationslast 30 patents

MULTIPLE HYDRAULIC CIRCUIT PRESSURE SENSOR

Electronic enclosure with continuous ground contact surface

Sealed electronic component

Method of making an electronic assembly

Relaxed tolerance flip chip assembly

Heat sink with integrated electronics

Relaxed tolerance flip chip assembly

Heat sink with integrated electronics

High density wire bondable connector assembly

Partitioned circuit assembly

High density wirebond connector assembly