Daniel Arnzen

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Eden Prairie, MN, US

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Patents Grantslast 30 patents

Information Patent Grant
Non-planar packaging of image sensor
- Patent number 7,507,944
- Issue date Mar 24, 2009
- Cypress Semiconductor Corporation
- Daniel Arnzen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Reducing defect formation within an etched semiconductor topography
- Patent number 7,129,178
- Issue date Oct 31, 2006
- Cypress Semiconductor Corp.
- Benjamin C. E. Schwarz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor topography having an inactive region formed from a du...
- Patent number 6,833,622
- Issue date Dec 21, 2004
- Cypress Semiconductor Corp.
- Andrey V. Zagrebelny
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Plasma etching method
- Patent number 6,406,640
- Issue date Jun 18, 2002
- Cypress Semiconductor Corporation
- Chan-lon Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Selective SAC etch process
- Patent number 6,403,488
- Issue date Jun 11, 2002
- Cypress Semiconductor Corp.
- Chan-Lon Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Plasma etching method
- Patent number 6,165,375
- Issue date Dec 26, 2000
- Cypress Semiconductor Corporation
- Chan-lon Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thin liner layer providing reduced via resistance
- Patent number 6,016,012
- Issue date Jan 18, 2000
- Cypress Semiconductor Corporation
- Ahmad Chatila
- H01 - BASIC ELECTRIC ELEMENTS