Daniel Bolowski

Follow

Person

Warstein-Suttrop, DE

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor substrate having a bond pad material based on aluminum
- Patent number 11,410,950
- Issue date Aug 9, 2022
- Infineon Technologies AG
- Gert Pfahl
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor module bonding wire connection method
- Patent number 9,925,588
- Issue date Mar 27, 2018
- Infineon Technologies AG
- Daniel Bolowski
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Power semiconductor module with integrated thick-film printed circu...
- Patent number 8,981,553
- Issue date Mar 17, 2015
- Infineon Technologies AG
- Ulrich Michael Georg Schwarzer
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Semiconductor Substrate Having a Bond Pad Material Based on Aluminum
- Publication number 20210091025
- Publication date Mar 25, 2021
- INFINEON TECHNOLOGIES AG
- Gert Pfahl
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MODULE BONDING WIRE CONNECTION METHOD
- Publication number 20150333034
- Publication date Nov 19, 2015
- INFINEON TECHNOLOGIES AG
- Daniel Bolowski
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Power Semiconductor Module with Integrated Thick-Film Printed Circu...
- Publication number 20130075932
- Publication date Mar 28, 2013
- INFINEON TECHNOLOGIES AG
- Ulrich Michael Georg Schwarzer
- H01 - BASIC ELECTRIC ELEMENTS