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Daniel Brandler
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Moorpark, CA, US
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Patents Grants
last 30 patents
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Patent Grant
Multilayered construction for resistor and capacitor formation
Patent number
7,192,654
Issue date
Mar 20, 2007
Oak-Mitsui Inc.
John A. Andresakis
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Patents Applications
last 30 patents
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Patent Application
CIRCUIT BOARD MATERIAL
Publication number
20140205854
Publication date
Jul 24, 2014
Ohmega Technologies, Inc.
Daniel BRANDLER
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
Multilayered construction for resistor and capacitor formation
Publication number
20060188701
Publication date
Aug 24, 2006
John A. Andresakis
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR