Daniel C. Van Hart

Person

Conklin, NY, US

People

Patents Grantslast 30 patents

Information Patent Grant
Formation of a metallic interlocking structure
- Patent number 6,693,031
- Issue date Feb 17, 2004
- International Business Machines Corporation
- Gerald G. Advocate
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Technique for imaging electrical contacts
- Patent number 6,639,661
- Issue date Oct 28, 2003
- International Business Machines Corporation
- William L. Brodsky
- G01 - MEASURING TESTING
Information Patent Grant
Solder ball with chemically and mechanically enhanced surface prope...
- Patent number 6,607,613
- Issue date Aug 19, 2003
- International Business Machines Corporation
- Frank D. Egitto
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Metallic interlocking structure
- Patent number 6,348,737
- Issue date Feb 19, 2002
- International Business Machines Corporation
- Gerald G. Advocate
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Enhanced solder surface and process for chemically and mechanically...
- Patent number 6,210,547
- Issue date Apr 3, 2001
- International Business Machines Corporation
- Frank D. Egitto
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Process for chemically and mechanically enhancing solder surface pr...
- Patent number 6,056,831
- Issue date May 2, 2000
- International Business Machines Corporation
- Frank D. Egitto
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Removal of excimer laser debris using carbon dioxide laser
- Patent number 5,194,713
- Issue date Mar 16, 1993
- International Business Machines Corporation
- Frank D. Egitto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Gold plating bath additives for copper circuitization on polyimide...
- Patent number 5,176,811
- Issue date Jan 5, 1993
- International Business Machines Corporation
- Leann G. Keim
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR

Patents Applicationslast 30 patents

Information Patent Application
CONDUCTIVE METAL NUB FOR ENHANCED ELECTRICAL INTERCONNECTION, AND I...
- Publication number 20120243155
- Publication date Sep 27, 2012
- Endicott Interconnect Technologies, Inc.
- Luis J. Matienzo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR VIA PLATING IN ELECTRONIC PACKAGES CONTAINING FLUOROPOLY...
- Publication number 20110260299
- Publication date Oct 27, 2011
- Endicott Interconnect Technologies, Inc.
- Robert D. Edwards
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Technique for imaging electrical contacts
- Publication number 20020089663
- Publication date Jul 11, 2002
- William L. Brodsky
- G01 - MEASURING TESTING
Information Patent Application
Formation of a metallic interlocking structure
- Publication number 20020056890
- Publication date May 16, 2002
- International Business Machines Corporation
- Gerald G. Advocate
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Solder ball with chemically and mechanically enhanced surface prope...
- Publication number 20010012570
- Publication date Aug 9, 2001
- Frank D. Egitto
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...

Daniel C. Van Hart

Person

Patents Grantslast 30 patents

Formation of a metallic interlocking structure

Technique for imaging electrical contacts

Solder ball with chemically and mechanically enhanced surface prope...

Metallic interlocking structure

Enhanced solder surface and process for chemically and mechanically...

Process for chemically and mechanically enhancing solder surface pr...

Removal of excimer laser debris using carbon dioxide laser

Gold plating bath additives for copper circuitization on polyimide...

Patents Applicationslast 30 patents

CONDUCTIVE METAL NUB FOR ENHANCED ELECTRICAL INTERCONNECTION, AND I...

METHOD FOR VIA PLATING IN ELECTRONIC PACKAGES CONTAINING FLUOROPOLY...

Technique for imaging electrical contacts

Formation of a metallic interlocking structure

Solder ball with chemically and mechanically enhanced surface prope...