Daniel Chung

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North York, CA

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Patents Grantslast 30 patents

Information Patent Grant
Under bump metallization for on-die capacitor
- Patent number 8,314,474
- Issue date Nov 20, 2012
- ATI Technologies ULC
- Neil McLellan
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Under Bump Metallization for On-Die Capacitor
- Publication number 20100019347
- Publication date Jan 28, 2010
- Neil McLellan
- H01 - BASIC ELECTRIC ELEMENTS