Daniel Cutler

Person

Betchworth, GB

People

Patents Grantslast 30 patents

Information Patent Grant
Method for fabricating a semiconductor package with conductive carr...
- Patent number 9,673,109
- Issue date Jun 6, 2017
- Infineon Technologies Americas Corp.
- Eung San Cho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package including conductive carrier coupled power sw...
- Patent number 9,576,887
- Issue date Feb 21, 2017
- Infineon Technologies Americas Corp.
- Eung San Cho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power semiconductor package having vertically stacked driver IC
- Patent number 9,502,395
- Issue date Nov 22, 2016
- Infineon Technologies Americas Corp.
- Eung San Cho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power converter package including top-drain configured power FET
- Patent number 9,397,212
- Issue date Jul 19, 2016
- Infineon Technologies Americas Corp.
- Eung San Cho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Surface mountable power components
- Patent number 9,362,221
- Issue date Jun 7, 2016
- Infineon Technologies Americas Corp.
- Mark Pavier
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for fabricating a power semiconductor package including vert...
- Patent number 9,299,690
- Issue date Mar 29, 2016
- Infineon Technologies Americas Corp.
- Eung San Cho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for fabricating a semiconductor package with conductive carr...
- Patent number 9,269,655
- Issue date Feb 23, 2016
- Infineon Technologies Americas Corp.
- Eung San Cho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power converter package including vertically stacked driver IC
- Patent number 9,159,703
- Issue date Oct 13, 2015
- International Rectifier Corporation
- Eung San Cho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with conductive carrier integrated heat spreader
- Patent number 9,111,921
- Issue date Aug 18, 2015
- International Rectifier Corporation
- Eung San Cho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Surface mountable power components
- Patent number 9,012,990
- Issue date Apr 21, 2015
- International Rectifier Corporation
- Mark Pavier
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Autoclave capable chip-scale package
- Patent number 8,143,729
- Issue date Mar 27, 2012
- International Rectifier Corporation
- Mark Pavier
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Fabricating a Semiconductor Package with Conductive Carrier
- Publication number 20160155674
- Publication date Jun 2, 2016
- Infineon Technologies Americas Corp.
- Eung San Cho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Power Semiconductor Package Having Vertically Stacked Driver IC
- Publication number 20160035699
- Publication date Feb 4, 2016
- Infineon Technologies Americas Corp.
- Eung San Cho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FABRICATING A POWER SEMICONDUCTOR PACKAGE INCLUDING VERT...
- Publication number 20160027767
- Publication date Jan 28, 2016
- Infineon Technologies Americas Corp.
- Eung San Cho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for Fabricating a Semiconductor Package with Conductive Carr...
- Publication number 20150348887
- Publication date Dec 3, 2015
- INTERNATIONAL RECTIFIER CORPORATION
- Eung San Cho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Package with Integrated Heat Spreader
- Publication number 20150348888
- Publication date Dec 3, 2015
- INTERNATIONAL RECTIFIER CORPORATION
- Eung San Cho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Surface Mountable Power Components
- Publication number 20150221588
- Publication date Aug 6, 2015
- INTERNATIONAL RECTIFIER CORPORATION
- Mark Pavier
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Power Converter Package Including Top-Drain Configured Power FET
- Publication number 20140110788
- Publication date Apr 24, 2014
- International Rectifier Corporation
- Eung San Cho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Package with Conductive Carrier Integrated Heat Spreader
- Publication number 20140110796
- Publication date Apr 24, 2014
- INTERNATIONAL RECTIFIER CORPORATION
- Eung San Cho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Power Converter Package Including Vertically Stacked Driver IC
- Publication number 20140110863
- Publication date Apr 24, 2014
- INTERNATIONAL RECTIFIER CORPORATION
- Eung San Cho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Package Including Conductive Carrier Coupled Power Sw...
- Publication number 20140110776
- Publication date Apr 24, 2014
- INTERNATIONAL RECTIFIER CORPORATION
- Eung San Cho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Surface Mountable Power Components
- Publication number 20140103393
- Publication date Apr 17, 2014
- INTERNATIONAL RECTIFIER CORPORATION
- Mark Pavier
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
AUTOCLAVE CAPABLE CHIP-SCALE PACKAGE
- Publication number 20090218684
- Publication date Sep 3, 2009
- Mark Pavier
- H01 - BASIC ELECTRIC ELEMENTS

Daniel Cutler

Person

Patents Grantslast 30 patents

Method for fabricating a semiconductor package with conductive carr...

Semiconductor package including conductive carrier coupled power sw...

Power semiconductor package having vertically stacked driver IC

Power converter package including top-drain configured power FET

Surface mountable power components

Method for fabricating a power semiconductor package including vert...

Method for fabricating a semiconductor package with conductive carr...

Power converter package including vertically stacked driver IC

Semiconductor package with conductive carrier integrated heat spreader

Surface mountable power components

Autoclave capable chip-scale package

Patents Applicationslast 30 patents

Fabricating a Semiconductor Package with Conductive Carrier

Power Semiconductor Package Having Vertically Stacked Driver IC

METHOD FOR FABRICATING A POWER SEMICONDUCTOR PACKAGE INCLUDING VERT...

Method for Fabricating a Semiconductor Package with Conductive Carr...

Semiconductor Package with Integrated Heat Spreader

Surface Mountable Power Components

Power Converter Package Including Top-Drain Configured Power FET

Semiconductor Package with Conductive Carrier Integrated Heat Spreader

Power Converter Package Including Vertically Stacked Driver IC

Semiconductor Package Including Conductive Carrier Coupled Power Sw...

Surface Mountable Power Components

AUTOCLAVE CAPABLE CHIP-SCALE PACKAGE