Daniel Francis Persico

Person

Simpsonville, SC, US

People

Patents Grantslast 30 patents

Information Patent Grant
Protecting resin-encapsulated components
- Patent number 7,125,429
- Issue date Oct 24, 2006
- Kemet Electronics Corporation
- Brian John Melody
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Protecting resin-encapsulated components
- Patent number 6,845,004
- Issue date Jan 18, 2005
- Kemet Electronics Corporation
- Brian John Melody
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Surface mount aluminum capacitor having anode foil anodized in an a...
- Patent number 6,808,615
- Issue date Oct 26, 2004
- Kemet Electronics Corporation
- Philip Michael Lessner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Protecting resin-encapsulated components
- Patent number 6,798,645
- Issue date Sep 28, 2004
- Kemet Electronics Corp.
- Brian John Melody
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Edge formation process for aluminum solid electrolytic capacitor
- Patent number 6,707,663
- Issue date Mar 16, 2004
- Kemet Electronics Corporation
- Daniel Francis Persico
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Edge formation process with anodizing for aluminum solid electrolyt...
- Patent number 6,562,652
- Issue date May 13, 2003
- Kemet Electronics Corporation
- Daniel Francis Persico
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Surface mount aluminum capacitor having anode foil anodized in an a...
- Patent number 6,459,565
- Issue date Oct 1, 2002
- Kemet Electronics Corporation
- Philip Michael Lessner
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Protecting resin-encapsulated components
- Publication number 20040157400
- Publication date Aug 12, 2004
- Brian John Melody
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PROTECTING RESIN-ENCAPSULATED COMPONENTS
- Publication number 20040156165
- Publication date Aug 12, 2004
- Brian John Melody
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Protecting resin-encapsulated components
- Publication number 20040154149
- Publication date Aug 12, 2004
- Brian John Melody
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Edge formation process for aluminum solid electrolytic capacitor
- Publication number 20030164526
- Publication date Sep 4, 2003
- Kemet Electronics Corporation
- Daniel Francis Persico
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Edge formation process for aluminum solid electrolytic capacitor
- Publication number 20030030970
- Publication date Feb 13, 2003
- Daniel Francis Persico
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Surface mount aluminum capacitor having anode foil anodized in an a...
- Publication number 20020186521
- Publication date Dec 12, 2002
- Kemet Electronics Corporation
- Philip Michael Lessner
- H01 - BASIC ELECTRIC ELEMENTS

Daniel Francis Persico

Person

Patents Grantslast 30 patents

Protecting resin-encapsulated components

Protecting resin-encapsulated components

Surface mount aluminum capacitor having anode foil anodized in an a...

Protecting resin-encapsulated components

Edge formation process for aluminum solid electrolytic capacitor

Edge formation process with anodizing for aluminum solid electrolyt...

Surface mount aluminum capacitor having anode foil anodized in an a...

Patents Applicationslast 30 patents

Protecting resin-encapsulated components

PROTECTING RESIN-ENCAPSULATED COMPONENTS

Protecting resin-encapsulated components

Edge formation process for aluminum solid electrolytic capacitor

Edge formation process for aluminum solid electrolytic capacitor

Surface mount aluminum capacitor having anode foil anodized in an a...