Daniel G. Berger

Person

Wappingers Falls, NY, US

People

Patents Grantslast 30 patents

Information Patent Grant
Stacked semiconductor devices having dissimilar-sized dies
- Patent number 10,818,570
- Issue date Oct 27, 2020
- GLOBALFOUNDRIES Inc.
- Luke England
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Architecture and implementation of cortical system, and fabricating...
- Patent number 10,613,754
- Issue date Apr 7, 2020
- International Business Machines Corporation
- Daniel G. Berger
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Architecture and implementation of cortical system, and fabricating...
- Patent number 10,503,402
- Issue date Dec 10, 2019
- International Business Machines Corporation
- Daniel G. Berger
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Thermally enhanced package to reduce thermal interaction between dies
- Patent number 10,461,067
- Issue date Oct 29, 2019
- GLOBALFOUNDRIES Inc.
- Janak Patel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Architecture and implementation of cortical system, and fabricating...
- Patent number 9,886,193
- Issue date Feb 6, 2018
- International Business Machines Corporation
- Daniel G. Berger
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Thermally enhanced package to reduce thermal interaction between dies
- Patent number 9,859,262
- Issue date Jan 2, 2018
- GLOBALFOUNDRIES Inc.
- Janak Patel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Conductive adhesive composition
- Patent number 7,405,247
- Issue date Jul 29, 2008
- International Business Machines Corporation
- Krishna G. Sachdev
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Conductive adhesive rework method
- Patent number 7,393,419
- Issue date Jul 1, 2008
- International Business Machines Corporation
- Krishna G. Sachdev
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
UV-curable solvent free compositions and use thereof in ceramic chi...
- Patent number 7,329,439
- Issue date Feb 12, 2008
- International Business Machines Corporation
- Krishna G. Sachdev
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Thermal interface adhesive and rework
- Patent number 7,312,261
- Issue date Dec 25, 2007
- International Business Machines Corporation
- Krishna G. Sachdev
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
High performance integrated MLC cooling device for high power densi...
- Patent number 7,255,153
- Issue date Aug 14, 2007
- International Business Machines Corporation
- Daniel G. Berger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Rework method for finishing metallurgy on chip carriers
- Patent number 6,838,009
- Issue date Jan 4, 2005
- International Business Machines Corporation
- Charles L. Arvin
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Self-scrub buckling beam probe
- Patent number 6,529,021
- Issue date Mar 4, 2003
- International Business Machines Corporation
- Yuet-Ying Yu
- G01 - MEASURING TESTING
Information Patent Grant
Polymer and ceramic composite electronic substrates
- Patent number 6,528,145
- Issue date Mar 4, 2003
- International Business Machines Corporation
- Daniel George Berger
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for making interconnect for low temperature chip attachment
- Patent number 6,340,630
- Issue date Jan 22, 2002
- International Business Machines Corporation
- Daniel George Berger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for building interconnect structures by injection molded sol...
- Patent number 6,149,122
- Issue date Nov 21, 2000
- International Business Machines Corporation
- Daniel George Berger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for building interconnect structures by injection molded sol...
- Patent number 6,133,633
- Issue date Oct 17, 2000
- International Business Machines Corporation
- Daniel George Berger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnect for low temperature chip attachment
- Patent number 6,127,735
- Issue date Oct 3, 2000
- International Business Machines Corporation
- Daniel George Berger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer test and burn-in platform using ceramic tile supports
- Patent number 6,020,750
- Issue date Feb 1, 2000
- International Business Machines Corporation
- Daniel George Berger
- G01 - MEASURING TESTING
Information Patent Grant
Method for building interconnect structures by injection molded sol...
- Patent number 5,775,569
- Issue date Jul 7, 1998
- IBM Corporation
- Daniel George Berger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Process for forming negative tone images of polyimides using base t...
- Patent number 5,310,625
- Issue date May 10, 1994
- International Business Machines Corporation
- Marie Angelopoulos
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Line width control in a radiation sensitive polyimide
- Patent number 5,300,403
- Issue date Apr 5, 1994
- International Business Machines Corporation
- Marie Angelopolus
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Grant
Selective plating method for forming integral via and wiring layers
- Patent number 5,209,817
- Issue date May 11, 1993
- International Business Machines Corporation
- Umar M. Ahmad
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
STACKED SEMICONDUCTOR DEVICES HAVING DISSIMILAR-SIZED DIES
- Publication number 20200365481
- Publication date Nov 19, 2020
- GLOBALFOUNDRIES INC.
- LUKE ENGLAND
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ARCHITECTURE AND IMPLEMENTATION OF CORTICAL SYSTEM, AND FABRICATING...
- Publication number 20200042182
- Publication date Feb 6, 2020
- International Business Machines Corporation
- Daniel G. Berger
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
THERMALLY ENHANCED PACKAGE TO REDUCE THERMAL INTERACTION BETWEEN DIES
- Publication number 20190378829
- Publication date Dec 12, 2019
- GLOBALFOUNDRIES INC.
- Janak PATEL
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ARCHITECTURE AND IMPLEMENTATION OF CORTICAL SYSTEM, AND FABRICATING...
- Publication number 20180136846
- Publication date May 17, 2018
- International Business Machines Corporation
- Daniel G. Berger
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
THERMALLY ENHANCED PACKAGE TO REDUCE THERMAL INTERACTION BETWEEN DIES
- Publication number 20180068993
- Publication date Mar 8, 2018
- GLOBALFOUNDRIES Inc.
- Janak PATEL
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMALLY ENHANCED PACKAGE TO REDUCE THERMAL INTERACTION BETWEEN DIES
- Publication number 20180012878
- Publication date Jan 11, 2018
- GLOBALFOUNDRIES INC.
- Janak PATEL
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ARCHITECTURE AND IMPLEMENTATION OF CORTICAL SYSTEM, AND FABRICATING...
- Publication number 20160334991
- Publication date Nov 17, 2016
- International Business Machines Corporation
- Daniel G. Berger
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
HIGH PERFORMANCE INTEGRATED MLC COOLING DEVICE FOR HIGH POWER DENSI...
- Publication number 20080060792
- Publication date Mar 13, 2008
- International Business Machines Corporation
- Daniel G. Berger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONDUCTIVE ADHESIVE REWORK METHOD
- Publication number 20080017223
- Publication date Jan 24, 2008
- International Business Machines Corporation
- Krishna G. Sachdev
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
CONDUCTIVE ADHESIVE COMPOSITION
- Publication number 20070270536
- Publication date Nov 22, 2007
- International Business Machines Corporation
- Krishna G. Sachdev
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
HIGH PERFORMANCE INTEGRATED MLC COOLING DEVICE FOR HIGH POWER DENSI...
- Publication number 20060266497
- Publication date Nov 30, 2006
- International Business Machines Corporation
- Daniel G. Berger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
UV-curable solvent free compositions and use thereof in ceramic chi...
- Publication number 20060069177
- Publication date Mar 30, 2006
- International Business Machines Corporation
- Krishna G. Sachdev
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Temporary chip attach method using reworkable conductive adhesive i...
- Publication number 20060014309
- Publication date Jan 19, 2006
- Krishna Gandhi Sachdev
- G01 - MEASURING TESTING
Information Patent Application
THERMAL INTERFACE ADHESIVE AND REWORK
- Publication number 20050256241
- Publication date Nov 17, 2005
- International Business Machines Corporation
- Krishna G. Sachdev
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
Rework method for finishing metallurgy on chip carriers
- Publication number 20030080092
- Publication date May 1, 2003
- International Business Machines Corporation
- Charles L. Arvin
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
REMOVAL OF CURED SILICONE ADHESIVE FOR REWORKING ELECTRONIC COMPONENTS
- Publication number 20020000239
- Publication date Jan 3, 2002
- KRISHNA G. SACHDEV
- C11 - ANIMAL AND VEGETABLE OILS, FATS, FATTY SUBSTANCES AND WAXES FATTY ACIDS...

Daniel G. Berger

Person

Patents Grantslast 30 patents

Stacked semiconductor devices having dissimilar-sized dies

Architecture and implementation of cortical system, and fabricating...

Architecture and implementation of cortical system, and fabricating...

Thermally enhanced package to reduce thermal interaction between dies

Architecture and implementation of cortical system, and fabricating...

Thermally enhanced package to reduce thermal interaction between dies

Conductive adhesive composition

Conductive adhesive rework method

UV-curable solvent free compositions and use thereof in ceramic chi...

Thermal interface adhesive and rework

High performance integrated MLC cooling device for high power densi...

Rework method for finishing metallurgy on chip carriers

Self-scrub buckling beam probe

Polymer and ceramic composite electronic substrates

Method for making interconnect for low temperature chip attachment

Method for building interconnect structures by injection molded sol...

Method for building interconnect structures by injection molded sol...

Interconnect for low temperature chip attachment

Wafer test and burn-in platform using ceramic tile supports

Method for building interconnect structures by injection molded sol...

Process for forming negative tone images of polyimides using base t...

Line width control in a radiation sensitive polyimide

Selective plating method for forming integral via and wiring layers

Patents Applicationslast 30 patents

STACKED SEMICONDUCTOR DEVICES HAVING DISSIMILAR-SIZED DIES

ARCHITECTURE AND IMPLEMENTATION OF CORTICAL SYSTEM, AND FABRICATING...

THERMALLY ENHANCED PACKAGE TO REDUCE THERMAL INTERACTION BETWEEN DIES

ARCHITECTURE AND IMPLEMENTATION OF CORTICAL SYSTEM, AND FABRICATING...

THERMALLY ENHANCED PACKAGE TO REDUCE THERMAL INTERACTION BETWEEN DIES

THERMALLY ENHANCED PACKAGE TO REDUCE THERMAL INTERACTION BETWEEN DIES

ARCHITECTURE AND IMPLEMENTATION OF CORTICAL SYSTEM, AND FABRICATING...

HIGH PERFORMANCE INTEGRATED MLC COOLING DEVICE FOR HIGH POWER DENSI...

CONDUCTIVE ADHESIVE REWORK METHOD

CONDUCTIVE ADHESIVE COMPOSITION

HIGH PERFORMANCE INTEGRATED MLC COOLING DEVICE FOR HIGH POWER DENSI...

UV-curable solvent free compositions and use thereof in ceramic chi...

Temporary chip attach method using reworkable conductive adhesive i...

THERMAL INTERFACE ADHESIVE AND REWORK

Rework method for finishing metallurgy on chip carriers

REMOVAL OF CURED SILICONE ADHESIVE FOR REWORKING ELECTRONIC COMPONENTS